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公开(公告)号：US10553520B2
公开(公告)日：2020-02-04
申请号：US15559111
申请日：2016-04-04
Applicant: Sony Interactive Entertainment Inc.
Inventor： Hitomi Iizuka , Hiroaki Tsurumi , Shinya Tsuchida , Kenji Hirose , Yuta Tamaki
Abstract: A leaf spring is disposed between a circuit board and a upper shield. The leaf spring biases a heat sink toward the circuit board through a connecting member. The leaf spring is not electrically connected to the upper shield. According to this structure, an integrated circuit and the heat sink can be contacted with each other with certainty. Further, generation of unnecessary radiation can be suppressed effectively.
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公开(公告)号：US09847104B2
公开(公告)日：2017-12-19
申请号：US15458556
申请日：2017-03-14
Applicant: Sony Interactive Entertainment Inc.
Inventor： Kenji Hirose , Kazuto Nakagawa , Shinya Tsuchida , Yasuhiro Ootori
CPC classification number: G11B33/142 , G06F1/1616 , G06F1/181 , G06F1/184 , G06F1/188 , G06F1/20 , H01L23/467 , H05K7/1422 , H05K7/20136
Abstract: An electronic apparatus includes a plurality of parts, a frame having an outer periphery surrounding the plurality of parts and formed from resin, a circuit board disposed at one side in a first direction with respect to the plurality of parts, a chassis disposed at the one side in the first direction with respect to the plurality of parts, attached to the frame, and formed from metal, and a metal plate disposed at the other side in the first direction with respect to at least one of the plurality of parts and attached to the frame.
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公开(公告)号：US20230327354A1
公开(公告)日：2023-10-12
申请号：US18191912
申请日：2023-03-29
Applicant: Sony Interactive Entertainment Inc.
Inventor： Shinya Tsuchida , Katsushi Ito , Nobuyuki Sugawara
CPC classification number: H01R12/775 , H01R12/79 , H05K9/0026
Abstract: Disclosed herein is an electronic device including a first circuit board on which a first connector is mounted, a second circuit board on which a second connector connected to the first connector via a cable is mounted, a circuit board shield that covers the first circuit board and exposes the first connector, and a connector shield that is attached to the circuit board shield to cover the first connector and is removable from the circuit board shield.
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公开(公告)号：US10446192B2
公开(公告)日：2019-10-15
申请号：US16058040
申请日：2018-08-08
Applicant: Sony Interactive Entertainment Inc.
Inventor： Kenji Hirose , Kazuto Nakagawa , Shinya Tsuchida , Yasuhiro Ootori
Abstract: An electronic apparatus includes a plurality of parts, a frame having an outer periphery surrounding the plurality of parts and formed from resin, a circuit board disposed at one side in a first direction with respect to the plurality of parts, a chassis disposed at the one side in the first direction with respect to the plurality of parts, and formed from metal, and a metal plate disposed at the other side in the first direction with respect to at least one of the plurality of parts and attached to the frame.
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公开(公告)号：US10068621B2
公开(公告)日：2018-09-04
申请号：US15827046
申请日：2017-11-30
Applicant: Sony Interactive Entertainment Inc.
Inventor： Kenji Hirose , Kazuto Nakagawa , Shinya Tsuchida , Yasuhiro Ootori
Abstract: An electronic apparatus includes a plurality of parts, a frame having an outer periphery surrounding the plurality of parts and formed from resin, a circuit board disposed at one side in a first direction with respect to the plurality of parts, a chassis disposed at the one side in the first direction with respect to the plurality of parts, and formed from metal, and a metal plate disposed at the other side in the first direction with respect to at least one of the plurality of parts and attached to the frame.
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Patent Agency Ranking
公开(公告)号：US20170287527A1
公开(公告)日：2017-10-05
申请号：US15458556
申请日：2017-03-14
Applicant: Sony Interactive Entertainment Inc.
Inventor： Kenji Hirose , Kazuto Nakagawa , Shinya Tsuchida , Yasuhiro Ootori
IPC: G11B33/14
CPC classification number: G11B33/142 , G06F1/1616 , G06F1/181 , G06F1/184 , G06F1/188 , G06F1/20 , H01L23/467 , H05K7/1422 , H05K7/20136
Abstract: An electronic apparatus includes a plurality of parts, a frame having an outer periphery surrounding the plurality of parts and formed from resin, a circuit board disposed at one side in a first direction with respect to the plurality of parts, a chassis disposed at the one side in the first direction with respect to the plurality of parts, attached to the frame, and formed from metal, and a metal plate disposed at the other side in the first direction with respect to at least one of the plurality of parts and attached to the frame.
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公开(公告)号：US20220262759A1
公开(公告)日：2022-08-18
申请号：US17427759
申请日：2020-02-03
Applicant: Sony Interactive Entertainment Inc.
Inventor： Shinya Tsuchida , Nils Sabelstrom , Mitsuharu Morishita , Kenji Hirose , Masanori Hayashibara , Tetsuji Tamura , Sei Oonishi , Nobuyuki Sugawara
Abstract: In a structure using a metal having fluidity as a thermally conductive material, the thermally conductive material is prevented from entering an unintended region even in a case where a change in attitude of a semiconductor device or vibration occurs. An electronic apparatus has a thermally conductive material (31) formed between a radiator (50) and a semiconductor chip (11). The thermally conductive material (31) has fluidity at least at a time of operation of the semiconductor chip (11). In addition, the thermally conductive material (31) has electric conductivity. The thermally conductive material (31) is surrounded by a seal member (33). A capacitor (16) is covered by an insulating portion (15).
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公开(公告)号：US10932356B2
公开(公告)日：2021-02-23
申请号：US15902071
申请日：2018-02-22
Applicant: Sony Interactive Entertainment Inc.
Inventor： Tetsufumi Nozawa , Shinya Tsuchida
Abstract: Electronic equipment includes a printed board having a front surface on which a ground pattern is formed and a shield member disposed opposed to the front surface of the printed board. The shield member has a strip-shaped region that is opposed to the ground pattern and protrudes toward the printed board, and is fastened to the printed board by screws that pass through a respective one of a plurality of screw holes made in the strip-shaped region. Either one of the shield member and the printed board has a protruding part that is formed projectingly toward the other and causes the strip-shaped region and the ground pattern to get contact with each other at a position sandwiched by adjacent two screw holes in the strip-shaped region in plan view.
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公开(公告)号：US10068618B2
公开(公告)日：2018-09-04
申请号：US15662300
申请日：2017-07-28
Applicant: SONY INTERACTIVE ENTERTAINMENT INC.
Inventor： Kazutaka Eto , Shinya Tsuchida , Keiichi Aoki
Abstract: Disclosed herein is an electronic apparatus including a main body, a compartment provided in the main body, a part that is accommodated in the compartment and that can be drawn out of the compartment, two attachment sections that are provided on the part and that are located away from each other, and a knob member attached to the two attachment sections. The knob member is a flexible member that is longer than a distance between the two attachment sections, includes a curved portion that is curved in such a manner as to swell in a direction away from the part, and is elastically deformable such that the swelling of the curved portion decreases.
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公开(公告)号：US12075593B2
公开(公告)日：2024-08-27
申请号：US17910485
申请日：2020-09-24
Applicant: Sony Interactive Entertainment Inc.
Inventor： Shinya Tsuchida , Keiichi Aoki , Yasuhiro Ootori , Yuta Tamaki , Mitsuharu Morishita
IPC: H05K7/20
CPC classification number: H05K7/20145 , H05K7/20336 , H05K7/2039
Abstract: Not only cooling performance for an integrated circuit such as a central processing unit (CPU) but also cooling performance for a power supply unit is improved. An electronic apparatus includes a first heat sink and a power supply unit including a power supply unit case having an intake air wall in which a plurality of air intake holes are formed. The intake air wall is located in front of the first heat sink. The intake air wall has an external surface being inclined with respect to both a front-rear direction and a left-right direction and facing the first heat sink. A cooling fan is disposed to feed air toward the intake air wall.
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