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公开(公告)号：US11943868B2
公开(公告)日：2024-03-26
申请号：US17910876
申请日：2021-03-23
Applicant: Sony Interactive Entertainment Inc.
Inventor： Katsushi Ito , Yasuhiro Ootori , Nobuyuki Sugawara
IPC: H05K1/18
CPC classification number: H05K1/181 , H05K2201/10159 , H05K2201/10371
Abstract: A board shield (52) covers a region in which an electronic part is mounted on a lower surface of a circuit board (50). A memory housing chamber (R1) capable of housing a semiconductor memory is secured on the lower side of the circuit board. The board shield (52) includes a shield wall (52e) along the memory housing chamber (R1). With this, it is possible to protect the semiconductor memory while suppressing an increase in the number of parts.
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公开(公告)号：US11943898B2
公开(公告)日：2024-03-26
申请号：US17910197
申请日：2021-03-23
Applicant: Sony Interactive Entertainment Inc.
Inventor： Nobuyuki Sugawara , Katsushi Ito
CPC classification number: H05K7/20336 , H05K7/2039 , H05K9/00
Abstract: A leakage of electromagnetic waves is suppressed effectively on the periphery of a heat radiating device. A heat radiating device (80) includes a plurality of fins (81) that are arranged on the inside of an opening (52a), a heat pipe (83) that includes a connecting portion (83a) being located between the plurality of fins (81) and a circuit board (50) and extending in a left-right direction along the circuit board (50), and a base plate (82) that supports the plurality of fins (81). The base plate (82) includes a plate left portion (82c). The plate left portion (82c) covers a lower surface of the heat pipe (83), the lower surface facing a side of a board shield (52), and closes a gap (G1) between a left end of the plurality of fins (81) and a left edge of the opening (52a) of the board shield (52).
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公开(公告)号：US20230328940A1
公开(公告)日：2023-10-12
申请号：US18191921
申请日：2023-03-29
Applicant: Sony Interactive Entertainment Inc.
Inventor： Shinya Tsuchida , Katsushi Ito , Nobuyuki Sugawara , Tetsufumi Nozawa
CPC classification number: H05K9/0032 , H05K1/181 , H05K2201/10371
Abstract: Provided is an electronic device including a circuit board having a first surface and a second surface, a first member covering the first surface to function as a shield of the circuit board and having a first encompassing region having, in at least a portion thereof, a first outer region, and a second member that is placed on a side of the second surface that has a second outer region. One of the first and the second outer regions has at least one outer fixed portion fixed to another of the first and the second outer regions and at least one projection located away from the at least one outer fixed portion in a direction along an outer edge of the circuit board. The first and the second members are in contact with each other with the at least one outer fixed portion and the at least one projection.
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Patent Agency Ranking
公开(公告)号：US20220232693A1
公开(公告)日：2022-07-21
申请号：US17609500
申请日：2020-05-21
Applicant: Sony Interactive Entertainment Inc.
Inventor： Yuta Tamaki , Katsushi Ito
Abstract: Electronic equipment includes an option equipment attachment portion at a bottom portion of the electronic equipment. The electronic equipment includes an optional printed circuit board and a lower shield member covering the optional printed circuit board with a part of the optional printed circuit board exposed from the lower shield member. The lower shield member includes a recess including walls as inner walls. A region of the optional printed circuit board exposed from the lower shield member 34 is located at a bottom portion of the recess and is surrounded by the walls of the lower shield member.
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公开(公告)号：US20230327354A1
公开(公告)日：2023-10-12
申请号：US18191912
申请日：2023-03-29
Applicant: Sony Interactive Entertainment Inc.
Inventor： Shinya Tsuchida , Katsushi Ito , Nobuyuki Sugawara
CPC classification number: H01R12/775 , H01R12/79 , H05K9/0026
Abstract: Disclosed herein is an electronic device including a first circuit board on which a first connector is mounted, a second circuit board on which a second connector connected to the first connector via a cable is mounted, a circuit board shield that covers the first circuit board and exposes the first connector, and a connector shield that is attached to the circuit board shield to cover the first connector and is removable from the circuit board shield.
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公开(公告)号：US12127332B2
公开(公告)日：2024-10-22
申请号：US17609500
申请日：2020-05-21
Applicant: Sony Interactive Entertainment Inc.
Inventor： Yuta Tamaki , Katsushi Ito
CPC classification number: H05K1/0219 , H05K1/0209 , H05K5/03
Abstract: Electronic equipment includes an option equipment attachment portion at a bottom portion of the electronic equipment. The electronic equipment includes an optional printed circuit board and a lower shield member covering the optional printed circuit board with a part of the optional printed circuit board exposed from the lower shield member. The lower shield member includes a recess including walls as inner walls. A region of the optional printed circuit board exposed from the lower shield member 34 is located at a bottom portion of the recess and is surrounded by the walls of the lower shield member.
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公开(公告)号：US20240188245A1
公开(公告)日：2024-06-06
申请号：US18554224
申请日：2022-04-18
Applicant: Sony Interactive Entertainment Inc.
Inventor： Katsushi Ito , Kazutaka Eto , Kazuya Odagiri , Sho Kobayashi
CPC classification number: H05K7/12 , H01Q1/2291 , H05K1/0215 , H05K9/0098 , H05K2201/10098
Abstract: Provided is an electronic apparatus in which a state where a cable is in contact with a ground part can be stably maintained for a long period of time. An electronic apparatus includes a shield that is in contact with a ground pattern on a circuit board and that functions as a ground part. The cable extends from a front antenna, is connected to the circuit board, and passes between the shield and a first cushioning member. An inner surface of the housing presses the first cushioning member against the shield.
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公开(公告)号：US11985766B2
公开(公告)日：2024-05-14
申请号：US17910876
申请日：2021-03-23
Applicant: Sony Interactive Entertainment Inc.
Inventor： Katsushi Ito , Yasuhiro Ootori , Nobuyuki Sugawara
IPC: H05K1/18
CPC classification number: H05K1/181 , H05K2201/10159 , H05K2201/10371
Abstract: A board shield (52) covers a region in which an electronic part is mounted on a lower surface of a circuit board (50). A memory housing chamber (R1) capable of housing a semiconductor memory is secured on the lower side of the circuit board. The board shield (52) includes a shield wall (52e) along the memory housing chamber (R1). With this, it is possible to protect the semiconductor memory while suppressing an increase in the number of parts.
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