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公开(公告)号：US10553520B2
公开(公告)日：2020-02-04
申请号：US15559111
申请日：2016-04-04
Applicant: Sony Interactive Entertainment Inc.
Inventor： Hitomi Iizuka , Hiroaki Tsurumi , Shinya Tsuchida , Kenji Hirose , Yuta Tamaki
Abstract: A leaf spring is disposed between a circuit board and a upper shield. The leaf spring biases a heat sink toward the circuit board through a connecting member. The leaf spring is not electrically connected to the upper shield. According to this structure, an integrated circuit and the heat sink can be contacted with each other with certainty. Further, generation of unnecessary radiation can be suppressed effectively.
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公开(公告)号：US12066874B2
公开(公告)日：2024-08-20
申请号：US17201072
申请日：2021-03-15
Applicant: Sony Interactive Entertainment Inc.
Inventor： Yujin Morisawa , Kazutaka Eto , Yasuhiro Ootori , Yuta Tamaki , Toshihiro Ueda
CPC classification number: G06F1/181 , G06F1/20 , H05K7/20145 , H05K7/20172 , H05K5/0008
Abstract: An electronic apparatus includes an apparatus main body having a first external surface that faces a first direction and a first side surface that faces a second direction orthogonal to the first direction, and a first exterior panel curved at least partly, in which the first exterior panel covers the first external surface and is attached to the first external surface, and the first exterior panel has, at an end portion of the first exterior panel, a first projecting portion beyond a position of the first side surface.
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公开(公告)号：US20220232693A1
公开(公告)日：2022-07-21
申请号：US17609500
申请日：2020-05-21
Applicant: Sony Interactive Entertainment Inc.
Inventor： Yuta Tamaki , Katsushi Ito
Abstract: Electronic equipment includes an option equipment attachment portion at a bottom portion of the electronic equipment. The electronic equipment includes an optional printed circuit board and a lower shield member covering the optional printed circuit board with a part of the optional printed circuit board exposed from the lower shield member. The lower shield member includes a recess including walls as inner walls. A region of the optional printed circuit board exposed from the lower shield member 34 is located at a bottom portion of the recess and is surrounded by the walls of the lower shield member.
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公开(公告)号：US10278303B2
公开(公告)日：2019-04-30
申请号：US15661203
申请日：2017-07-27
Applicant: Sony Interactive Entertainment Inc.
Inventor： Yuta Tamaki , Yasuhiro Ootori
Abstract: An electronic apparatus includes a first member having an opening through which air passes, the opening in a first direction, and a second member mounted to an outside of the first member. The second member includes a plurality of guide portions disposed in juxtaposition with each other in a second direction that extends orthogonally to the first direction when viewed in the first direction, the guide portions guiding air flowing through the opening. At least one guide portion out of the plurality of guide portions includes an engagement portion to be hooked onto the first member. The second member is mounted to the first member through the engagement portion.
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公开(公告)号：US12284763B2
公开(公告)日：2025-04-22
申请号：US17594855
申请日：2020-05-21
Applicant: Sony Interactive Entertainment Inc.
Inventor： Yuta Tamaki , Kazutaka Eto
Abstract: A main printed circuit board of electronic equipment includes through-holes and into which a plurality of types of components are attached. Lands are respectively provided around the through-holes and to electrically connect the components to a main printed circuit board. Shapes of the lands correspond to shapes of components attached to the through-holes. For example, in automatic mounting of components, the shapes of the lands are determined by image recognition, and components with shapes corresponding to the shapes of the lands are attached.
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Patent Agency Ranking
公开(公告)号：US12253890B2
公开(公告)日：2025-03-18
申请号：US18411118
申请日：2024-01-12
Applicant: Sony Interactive Entertainment Inc.
Inventor： Yujin Morisawa , Kazutaka Eto , Yasuhiro Ootori , Yuta Tamaki , Toshihiro Ueda
Abstract: An exterior panel for attachment to a surface of a housing includes: a curved profile that includes an inner surface and an outer surface; and a plurality of projecting portions extending out of the inner surface of the exterior panel, where each of the projecting portions is configured to fit in corresponding attachment holes that is formed on the surface of the housing of the game device, and the plurality of projecting portions, when fit into the corresponding holes, provide a separation between the surface of the housing of the game device and the inner surface.
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公开(公告)号：US20180247881A1
公开(公告)日：2018-08-30
申请号：US15559111
申请日：2016-04-04
Applicant: Sony Interactive Entertainment Inc.
Inventor： Hitomi Iizuka , Hiroaki Tsurumi , Shinya Tsuchida , Kenji Hirose , Yuta Tamaki
Abstract: A leaf spring is disposed between a circuit board and a upper shield. The leaf spring biases a heat sink toward the circuit board through a connecting member. The leaf spring is not electrically connected to the upper shield. According to this structure, an integrated circuit and the heat sink can be contacted with each other with certainty. Further, generation of unnecessary radiation can be suppressed effectively.
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公开(公告)号：US12127332B2
公开(公告)日：2024-10-22
申请号：US17609500
申请日：2020-05-21
Applicant: Sony Interactive Entertainment Inc.
Inventor： Yuta Tamaki , Katsushi Ito
CPC classification number: H05K1/0219 , H05K1/0209 , H05K5/03
Abstract: Electronic equipment includes an option equipment attachment portion at a bottom portion of the electronic equipment. The electronic equipment includes an optional printed circuit board and a lower shield member covering the optional printed circuit board with a part of the optional printed circuit board exposed from the lower shield member. The lower shield member includes a recess including walls as inner walls. A region of the optional printed circuit board exposed from the lower shield member 34 is located at a bottom portion of the recess and is surrounded by the walls of the lower shield member.
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公开(公告)号：US12075593B2
公开(公告)日：2024-08-27
申请号：US17910485
申请日：2020-09-24
Applicant: Sony Interactive Entertainment Inc.
Inventor： Shinya Tsuchida , Keiichi Aoki , Yasuhiro Ootori , Yuta Tamaki , Mitsuharu Morishita
IPC: H05K7/20
CPC classification number: H05K7/20145 , H05K7/20336 , H05K7/2039
Abstract: Not only cooling performance for an integrated circuit such as a central processing unit (CPU) but also cooling performance for a power supply unit is improved. An electronic apparatus includes a first heat sink and a power supply unit including a power supply unit case having an intake air wall in which a plurality of air intake holes are formed. The intake air wall is located in front of the first heat sink. The intake air wall has an external surface being inclined with respect to both a front-rear direction and a left-right direction and facing the first heat sink. A cooling fan is disposed to feed air toward the intake air wall.
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公开(公告)号：US20220312658A1
公开(公告)日：2022-09-29
申请号：US17594855
申请日：2020-05-21
Applicant: Sony Interactive Entertainment Inc.
Inventor： Yuta Tamaki , Kazutaka Eto
Abstract: A main printed circuit board of electronic equipment includes through-holes and into which a plurality of types of components are attached. Lands are respectively provided around the through-holes and to electrically connect the components to a main printed circuit board. Shapes of the lands correspond to shapes of components attached to the through-holes. For example, in automatic mounting of components, the shapes of the lands are determined by image recognition, and components with shapes corresponding to the shapes of the lands are attached.
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