公开(公告)号：US10553520B2

公开(公告)日：2020-02-04

申请号：US15559111

申请日：2016-04-04

Applicant: Sony Interactive Entertainment Inc.

Inventor： Hitomi Iizuka ,  Hiroaki Tsurumi ,  Shinya Tsuchida ,  Kenji Hirose ,  Yuta Tamaki

IPC: H01L23/00 ,  H01L23/40 ,  A63F13/90 ,  H01L23/433 ,  H05K1/02 ,  H05K1/18 ,  H05K9/00

Abstract: A leaf spring is disposed between a circuit board and a upper shield. The leaf spring biases a heat sink toward the circuit board through a connecting member. The leaf spring is not electrically connected to the upper shield. According to this structure, an integrated circuit and the heat sink can be contacted with each other with certainty. Further, generation of unnecessary radiation can be suppressed effectively.

公开(公告)号：US12234942B2

公开(公告)日：2025-02-25

申请号：US17998071

申请日：2021-05-11

Applicant: Sony Interactive Entertainment Inc.

Inventor： Hiroaki Tsurumi ,  Sei Oonishi ,  Keiko Sato

IPC: H05K5/02 ,  F16M11/04 ,  F16M11/22

Abstract: Provided is a stand capable of supporting an electronic device and improving the degree of freedom in appearance of the electronic device. A stand (1) is a stand for supporting an electronic device (90) having a lower exterior panel (92B) with a curved lower surface. The stand (1) has a stand main body (B) that is located, in plan view, inside an outer circumferential edge of the lower exterior panel (92B) and that has supporting surfaces (11a and 11b) to make contact with the lower surface. Also, the stand (1) has an arm (27) that extends from the stand main body (B) toward the outer circumferential edge of the lower exterior panel (92B) of the electronic device (90) and that has engagement sections (27A and 27B) to engage with an exterior member of the electronic device (90).

公开(公告)号：US20180247881A1

公开(公告)日：2018-08-30

申请号：US15559111

申请日：2016-04-04

Applicant: Sony Interactive Entertainment Inc.

Inventor： Hitomi Iizuka ,  Hiroaki Tsurumi ,  Shinya Tsuchida ,  Kenji Hirose ,  Yuta Tamaki

IPC: H01L23/40 ,  H05K9/00 ,  H01L23/433 ,  H05K1/18 ,  H05K1/02 ,  A63F13/90

Abstract: A leaf spring is disposed between a circuit board and a upper shield. The leaf spring biases a heat sink toward the circuit board through a connecting member. The leaf spring is not electrically connected to the upper shield. According to this structure, an integrated circuit and the heat sink can be contacted with each other with certainty. Further, generation of unnecessary radiation can be suppressed effectively.