公开(公告)号：US10553520B2

公开(公告)日：2020-02-04

申请号：US15559111

申请日：2016-04-04

Applicant: Sony Interactive Entertainment Inc.

Inventor： Hitomi Iizuka ,  Hiroaki Tsurumi ,  Shinya Tsuchida ,  Kenji Hirose ,  Yuta Tamaki

IPC: H01L23/00 ,  H01L23/40 ,  A63F13/90 ,  H01L23/433 ,  H05K1/02 ,  H05K1/18 ,  H05K9/00

Abstract: A leaf spring is disposed between a circuit board and a upper shield. The leaf spring biases a heat sink toward the circuit board through a connecting member. The leaf spring is not electrically connected to the upper shield. According to this structure, an integrated circuit and the heat sink can be contacted with each other with certainty. Further, generation of unnecessary radiation can be suppressed effectively.

公开(公告)号：US20180247881A1

公开(公告)日：2018-08-30

申请号：US15559111

申请日：2016-04-04

Applicant: Sony Interactive Entertainment Inc.

Inventor： Hitomi Iizuka ,  Hiroaki Tsurumi ,  Shinya Tsuchida ,  Kenji Hirose ,  Yuta Tamaki

IPC: H01L23/40 ,  H05K9/00 ,  H01L23/433 ,  H05K1/18 ,  H05K1/02 ,  A63F13/90

Abstract: A leaf spring is disposed between a circuit board and a upper shield. The leaf spring biases a heat sink toward the circuit board through a connecting member. The leaf spring is not electrically connected to the upper shield. According to this structure, an integrated circuit and the heat sink can be contacted with each other with certainty. Further, generation of unnecessary radiation can be suppressed effectively.