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Patent Agency Ranking
公开(公告)号：US11824429B2
公开(公告)日：2023-11-21
申请号：US17283738
申请日：2019-10-18
Applicant: Sony Interactive Entertainment Inc.
Inventor： Kazuki Sasao , Masanori Hayashibara , Hideki Ito
CPC classification number: H02M3/1584 , H02M1/084 , H05K1/0231 , H05K2201/10166 , H05K2201/10507
Abstract: A DC/DC converter includes N inductors and N power modules which correspond to N phases. The N inductors each include a plurality of inductor chips that are electrically connected in parallel to each other. The plurality of inductor chips are mounted separately on a main mounting surface and a sub-mounting surface of a printed circuit board. The sub-mounting surface is opposite to the main mounting surface.
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公开(公告)号：US20220262759A1
公开(公告)日：2022-08-18
申请号：US17427759
申请日：2020-02-03
Applicant: Sony Interactive Entertainment Inc.
Inventor： Shinya Tsuchida , Nils Sabelstrom , Mitsuharu Morishita , Kenji Hirose , Masanori Hayashibara , Tetsuji Tamura , Sei Oonishi , Nobuyuki Sugawara
Abstract: In a structure using a metal having fluidity as a thermally conductive material, the thermally conductive material is prevented from entering an unintended region even in a case where a change in attitude of a semiconductor device or vibration occurs. An electronic apparatus has a thermally conductive material (31) formed between a radiator (50) and a semiconductor chip (11). The thermally conductive material (31) has fluidity at least at a time of operation of the semiconductor chip (11). In addition, the thermally conductive material (31) has electric conductivity. The thermally conductive material (31) is surrounded by a seal member (33). A capacitor (16) is covered by an insulating portion (15).
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公开(公告)号：US20210328513A1
公开(公告)日：2021-10-21
申请号：US17283738
申请日：2019-10-18
Applicant: Sony Interactive Entertainment Inc.
Inventor： Kazuki Sasao , Masanori Hayashibara , Hideki Ito
Abstract: A DC/DC converter includes N inductors and N power modules which correspond to N phases. The N inductors each include a plurality of inductor chips that are electrically connected in parallel to each other. The plurality of inductor chips are mounted separately on a main mounting surface and a sub-mounting surface of a printed circuit board. The sub-mounting surface is opposite to the main mounting surface.
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公开(公告)号：US20230345665A1
公开(公告)日：2023-10-26
申请号：US18249573
申请日：2021-11-01
Applicant: Sony Interactive Entertainment Inc.
Inventor： Shinya Tsuchida , Nils Sabelstrom , Mitsuharu Morishita , Masanori Hayashibara , Yasuhiro Ootori , Keiichi Aoki
CPC classification number: H05K7/20209 , G06F1/206 , H05K7/20136
Abstract: Provided is an electronic apparatus that acquires an ambient temperature of the electronic apparatus and operates a cooling device to cool a component that generates heat during an operation. When the ambient temperature is lower than a predetermined reference temperature, the electronic apparatus exercises control to increase an output of the cooling device to a value higher than that obtained when the ambient temperature is equal to or higher than the reference temperature.
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公开(公告)号：US20220329071A1
公开(公告)日：2022-10-13
申请号：US17627772
申请日：2020-07-28
Applicant: Sony Interactive Entertainment Inc.
Inventor： Masanori Hayashibara , Shinya Hiromitsu
IPC: H02J3/00
Abstract: An electronic device includes a power supply unit and a main body unit. The power supply unit converts electric power supplied from an external power supply to a DC voltage of a first voltage value to output the voltage to the main body unit and changes, in a case where power supply from the external power supply has been cut off, a value of the DC voltage that it outputs to a second voltage value that is different from the first voltage value. The main body unit executes predetermined termination processing in a case where the value of the DC voltage output by the power supply unit has changed to the second voltage value.
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