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公开(公告)号:US11824429B2
公开(公告)日:2023-11-21
申请号:US17283738
申请日:2019-10-18
Applicant: Sony Interactive Entertainment Inc.
Inventor: Kazuki Sasao , Masanori Hayashibara , Hideki Ito
CPC classification number: H02M3/1584 , H02M1/084 , H05K1/0231 , H05K2201/10166 , H05K2201/10507
Abstract: A DC/DC converter includes N inductors and N power modules which correspond to N phases. The N inductors each include a plurality of inductor chips that are electrically connected in parallel to each other. The plurality of inductor chips are mounted separately on a main mounting surface and a sub-mounting surface of a printed circuit board. The sub-mounting surface is opposite to the main mounting surface.
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公开(公告)号:US20210328513A1
公开(公告)日:2021-10-21
申请号:US17283738
申请日:2019-10-18
Applicant: Sony Interactive Entertainment Inc.
Inventor: Kazuki Sasao , Masanori Hayashibara , Hideki Ito
Abstract: A DC/DC converter includes N inductors and N power modules which correspond to N phases. The N inductors each include a plurality of inductor chips that are electrically connected in parallel to each other. The plurality of inductor chips are mounted separately on a main mounting surface and a sub-mounting surface of a printed circuit board. The sub-mounting surface is opposite to the main mounting surface.
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公开(公告)号:US20210328515A1
公开(公告)日:2021-10-21
申请号:US17283723
申请日:2019-10-18
Applicant: Sony Interactive Entertainment Inc.
Inventor: Kazuki Sasao , Etsuji Kaneko , Hideki Ito
IPC: H02M3/158
Abstract: A DC/DC converter includes N inductors and N power modules which correspond to N phases. At least one of the N power modules is mounted on a sub-mounting surface that is opposite to a main mounting surface of a printed circuit board.
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公开(公告)号:US12009750B2
公开(公告)日:2024-06-11
申请号:US17283723
申请日:2019-10-18
Applicant: Sony Interactive Entertainment Inc.
Inventor: Kazuki Sasao , Etsuji Kaneko , Hideki Ito
IPC: H02M3/158
CPC classification number: H02M3/1588 , H02M3/1584 , H02M3/1586
Abstract: A DC/DC converter includes N inductors and N power modules which correspond to N phases. At least one of the N power modules is mounted on a sub-mounting surface that is opposite to a main mounting surface of a printed circuit board.
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