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    POWER SOURCE DEVICE
    1.
    发明申请
    POWER SOURCE DEVICE 有权

    公开(公告)号：US20210328513A1

    公开(公告)日：2021-10-21

    申请号：US17283738

    申请日：2019-10-18

    Applicant: Sony Interactive Entertainment Inc.

    Inventor： Kazuki Sasao ,  Masanori Hayashibara ,  Hideki Ito

    IPC: H02M3/158 ,  H02M1/084 ,  H05K1/02

    Abstract: A DC/DC converter includes N inductors and N power modules which correspond to N phases. The N inductors each include a plurality of inductor chips that are electrically connected in parallel to each other. The plurality of inductor chips are mounted separately on a main mounting surface and a sub-mounting surface of a printed circuit board. The sub-mounting surface is opposite to the main mounting surface.

    DC/DC converter
    2.
    发明授权
    DC/DC converter 有权

    公开(公告)号：US11018588B2

    公开(公告)日：2021-05-25

    申请号：US16309167

    申请日：2016-06-07

    Applicant: Sony Interactive Entertainment Inc.

    Inventor： Kazuki Sasao

    IPC: H02M3/158

    Abstract: There is provided a DC/DC converter that can eliminate the necessity of current sense resistors to thereby reduce the mounting area, improve the efficiency, and realize favorable transient characteristics. A multi-phase DC/DC converter with N phases (N is an integer equal to or greater than 2) is provided. A high-side transistor MH, a low-side transistor ML, and an inductor L are provided for each phase φ. Output power supply wiring connects a load side end of each of N inductors L1 to LN and a load. The output power supply wiring is branched from the load toward the load side ends of the N inductors L1 to LN. A coil current flowing through an inductor Li of an ith phase φi (i=1, 2, . . . N) is detected based on a voltage drop Vsi of a branch portion bri corresponding to the phase φi of the output power supply wiring.

    DC/DC CONVERTER
    4.
    发明申请
    DC/DC CONVERTER 审中-公开

    公开(公告)号：US20200099304A1

    公开(公告)日：2020-03-26

    申请号：US16309167

    申请日：2016-06-07

    Applicant: Sony Interactive Entertainment Inc.

    Inventor： Kazuki Sasao

    IPC: H02M3/158

    Abstract: There is provided a DC/DC converter that can eliminate the necessity of current sense resistors to thereby reduce the mounting area, improve the efficiency, and realize favorable transient characteristics. A multi-phase DC/DC converter with N phases (N is an integer equal to or greater than 2) is provided. A high-side transistor MH, a low-side transistor ML, and an inductor L are provided for each phase φ. Output power supply wiring connects a load side end of each of N inductors L1 to LN and a load. The output power supply wiring is branched from the load toward the load side ends of the N inductors L1 to LN. A coil current flowing through an inductor Li of an ith phase φi (i=1, 2, . . . N) is detected based on a voltage drop Vsi of a branch portion bri corresponding to the phase φi of the output power supply wiring.

    Switching converter having noise cancellation feature and electronic device using the same
    6.
    发明授权
    Switching converter having noise cancellation feature and electronic device using the same 有权

    公开(公告)号：US10027228B2

    公开(公告)日：2018-07-17

    申请号：US15311316

    申请日：2015-02-25

    Applicant: Sony Interactive Entertainment Inc.

    Inventor： Kazuki Sasao

    IPC: H02M3/158 ,  H02M1/44 ,  H02M7/00

    Abstract: An input smoothing circuit is provided between an input line and a ground line. A high-side transistor and a low-side transistor are provided in series between the two ends of the input smoothing circuit. The high-side transistor and the low-side transistor are arranged side by side in a first direction on a circuit board. Two current loops that run through the smoothing circuit, the high-side transistor, and the low-side transistor are formed to be substantially linearly symmetrical with respect to an axis of symmetry that extends in the first direction.

    SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SCREEN
    9.
    发明申请
    SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SCREEN 有权

    公开(公告)号：US20210345496A1

    公开(公告)日：2021-11-04

    申请号：US17284820

    申请日：2019-10-18

    Applicant: Sony Interactive Entertainment Inc.

    Inventor： Kazuki Sasao ,  Katsushi Wada

    IPC: H05K3/34 ,  H01L21/48 ,  H02M3/00

    Abstract: A printed circuit board has an in-pad via. In a first step, a component is mounted on a first surface of a printed circuit board. A screen to be used in a second step has openings at positions corresponding to those of a plurality of pads on a second surface and has a recess positioned to overlap an in-pad via. Solder cream is applied from above the screen, and the screen is removed. Then, a component is mounted on the second surface.

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