公开(公告)号：US11647593B2

公开(公告)日：2023-05-09

申请号：US17284820

申请日：2019-10-18

Applicant: Sony Interactive Entertainment Inc.

Inventor： Kazuki Sasao ,  Katsushi Wada

IPC: H05K3/34 ,  H02M3/00 ,  H01L21/48

CPC classification number: H05K3/3452 ,  H01L21/486 ,  H01L21/4853 ,  H01L21/4857 ,  H02M3/003

Abstract: A printed circuit board has an in-pad via. In a first step, a component is mounted on a first surface of a printed circuit board. A screen to be used in a second step has openings at positions corresponding to those of a plurality of pads on a second surface and has a recess positioned to overlap an in-pad via. Solder cream is applied from above the screen, and the screen is removed. Then, a component is mounted on the second surface.

公开(公告)号：US20210345496A1

公开(公告)日：2021-11-04

申请号：US17284820

申请日：2019-10-18

Applicant: Sony Interactive Entertainment Inc.

Inventor： Kazuki Sasao ,  Katsushi Wada

IPC: H05K3/34 ,  H01L21/48 ,  H02M3/00

Abstract: A printed circuit board has an in-pad via. In a first step, a component is mounted on a first surface of a printed circuit board. A screen to be used in a second step has openings at positions corresponding to those of a plurality of pads on a second surface and has a recess positioned to overlap an in-pad via. Solder cream is applied from above the screen, and the screen is removed. Then, a component is mounted on the second surface.