公开(公告)号：US20250065360A1

公开(公告)日：2025-02-27

申请号：US18768956

申请日：2024-07-10

Applicant: SEMES CO., LTD. ,  Samsung Electronics Co., Ltd.

Inventor： Jin Yeong Sung ,  Ki Hoon Choi ,  Seung Un Oh ,  Young Ho Park ,  Sang Hyeon Ryu ,  Jang Jin Lee ,  Hyun Yoon ,  Sang Gun Lee ,  Yu Jin Cho ,  Ho Jong Hwang ,  Jong Ju Park ,  Jong Keun Oh ,  Yong Woo Kim

IPC: B05C13/00 ,  G05B19/401 ,  G05B19/404 ,  G06T7/73

Abstract: A control device and a substrate processing apparatus including the same are provided. The substrate processing apparatus includes: a support unit including a spin head and configured to support and to rotate a substrate; a spraying unit configured to spray processing liquid onto the substrate; a correction unit in a swing arm, the correction unit configured to move to a target point on the substrate and to irradiate a beam when the processing liquid is sprayed onto the substrate; and a control unit configured to calculate the target point, wherein the control unit is configured to convert image coordinates associated with a first coordinate system and then to calculate the target point by converting the image coordinates associated with the first coordinate system into image coordinates associated with a second coordinate system, and the second coordinate system is based on rotation angles of the spin head and the swing arm.

公开(公告)号：US20230213852A1

公开(公告)日：2023-07-06

申请号：US18148051

申请日：2022-12-29

Applicant: SEMES CO., LTD.

Inventor： Ji Hoon Jeong ,  Young Dae Chung ,  Hyun Yoon

IPC: G03F1/78 ,  G03F1/70

CPC classification number: G03F1/78 ,  G03F1/70

Abstract: Disclosed is a method of treating a substrate, the method including: supplying a liquid to the substrate, emitting a laser to the substrate supplied with the liquid to heat the substrate, and emitting imaging light for capturing the substrate to obtain an image of the substrate including a region to which the laser is emitted, in which the laser and the imaging light are emitted to the substrate through a head lens, and a divergence angle of the laser emitted from the head lens and a divergence angle of the imaging light are matched with each other.

公开(公告)号：US11887883B2

公开(公告)日：2024-01-30

申请号：US17341696

申请日：2021-06-08

Applicant: SEMES CO., LTD.

Inventor： Do Yeon Kim ,  Pil Kyun Heo ,  Ho Jong Hwang ,  Hyun Yoon ,  Jong Min Lee ,  Chul Gyun Baik

IPC: B32B3/00 ,  H01L21/687 ,  B29C45/00 ,  B29C45/16 ,  B29K507/04 ,  B29K27/18

CPC classification number: H01L21/68757 ,  B29C45/0001 ,  B29C45/0055 ,  B29C45/16 ,  H01L21/68721 ,  B29K2027/18 ,  B29K2507/04

Abstract: A heterogeneous composite material and a method for manufacturing the heterogeneous composite material are provided. The heterogeneous composite material includes a first compression structure formed by compressing a first material, and a second compression structure formed by compressing a second material different from the first material, and disposed in close contact with the first compression structure, wherein at least a portion of the first compression structure and at least a portion of the second compression structure are disposed on both sides of a boundary surface existing in a circular shape with a predetermined radius with respect to a central axis in a state in contact with each other at the boundary surface.

公开(公告)号：US20230229074A1

公开(公告)日：2023-07-20

申请号：US17899616

申请日：2022-08-31

Applicant: SEMES CO., LTD.

Inventor： Hyo Won YANG ,  Hyun Yoon ,  Ji Hoon Jeong ,  In Ki Jung ,  Ki Hoon Choi ,  Tae Hee Kim ,  Se Hoon Oh

IPC: G03F1/72

CPC classification number: G03F1/72

Abstract: A photomask correction method capable of increasing the photomask precision is provided. The photomask correction method comprises measuring an intensity profile of a laser, acquiring etching amount data corresponding to the measured intensity profile using a library, determining a process parameter of the laser based on the etching amount data, and correcting a photomask with the laser according to the determined process parameter.

公开(公告)号：US11960236B2

公开(公告)日：2024-04-16

申请号：US18084381

申请日：2022-12-19

Applicant: SEMES CO., LTD.

Inventor： Young Jun Son ,  Tae Hoon Lee ,  Hyun Yoon ,  Do Yeon Kim

IPC: G03G21/00 ,  G03G15/00 ,  G03G15/02 ,  G03G21/18

CPC classification number: G03G21/1842 ,  G03G15/0233 ,  G03G15/60 ,  G03G15/80 ,  G03G2215/0872 ,  G03G2221/0084 ,  G03G2221/1651

Abstract: Proposed are a home port and a substrate processing apparatus using the same. The home port is installed in the substrate processing apparatus to temporarily mount a nozzle for discharging a process liquid to a substrate, and includes a main body having a space therein, a nozzle holder provided at an upper portion of the main body and configured to mount the nozzle, an inclined surface formed below the nozzle holder in the space, a first supply pipe configured to discharge a rinse liquid to a tip of the nozzle, a second supply pipe configured to inject the rinse liquid into the main body, a conductive wire configured to electrically connect the inclined surface and the first supply pipe, and a first switch installed on the conductive wire.

公开(公告)号：US20230207324A1

公开(公告)日：2023-06-29

申请号：US18057321

申请日：2022-11-21

Applicant: SEMES CO., LTD.

Inventor： Won Sik Son ,  Hyun Yoon ,  Hyo Won Yang ,  Ji Hoon Jeong ,  Young Dae Chung ,  In Ki Jung

IPC: H01L21/268 ,  H01L21/67

CPC classification number: H01L21/268 ,  H01L21/6704 ,  H01L21/67115

Abstract: The present invention provides a substrate treating method of treating a substrate including a plurality of cells, the substrate treating method including: a liquid treating operation of supplying a treatment liquid to the substrate; and a heating operation of heating the substrate by supplying the treatment liquid and irradiating laser light to a specific region located outside a region in which the plurality of cells is provided, in which the laser light is formed to cover the specific region when viewed from the top.

公开(公告)号：US12046466B2

公开(公告)日：2024-07-23

申请号：US17965911

申请日：2022-10-14

Applicant: SEMES CO., LTD.

Inventor： Yong-Jun Seo ,  Hyun Yoon ,  Jungsuk Goh ,  Byeong Geun Kim ,  Yoonki Sa ,  Doyeon Kim ,  Yerim Yeon ,  Choonghyun Lee ,  Pil Kyun Heo ,  Youngje Um ,  Jaeseong Lee ,  Dongok Ahn

IPC: H01L21/02 ,  H01L21/67

CPC classification number: H01L21/02101 ,  H01L21/6715

Abstract: The inventive concept provides a method for treating a substrate. In an embodiment, the substrate treating method includes a treatment step of treating a residue on the substrate with a first fluid in a supercritical state and a second fluid in a supercritical state in a process space of a chamber, and the first fluid in the supercritical state and the second fluid in the supercritical state have different densities.

公开(公告)号：US20230213876A1

公开(公告)日：2023-07-06

申请号：US18148127

申请日：2022-12-29

Applicant: SEMES CO., LTD.

Inventor： Hyo Won YANG ,  Hyun Yoon ,  Young Ho Park ,  Tae Hee Kim ,  In Ki Jung ,  Kwang Sup Kim

IPC: G03F7/20 ,  G03F7/30 ,  G03F7/40

CPC classification number: G03F7/70683 ,  G03F7/2053 ,  G03F7/30 ,  G03F7/40 ,  G03F7/70025 ,  G03F7/7085 ,  G03F7/70825 ,  G03F1/72

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support unit configured to rotate and support a substrate; a liquid supply unit configured to supply a liquid to the substrate supported on the support unit; and an optical module for heating the substrate supported on the support unit, and wherein the support unit includes a teaching member having a grid displaying a reference point which matches a center of the support unit.

公开(公告)号：US20230211436A1

公开(公告)日：2023-07-06

申请号：US18145245

申请日：2022-12-22

Applicant: SEMES CO., LTD.

Inventor： Hyo Won YANG ,  Hyun Yoon ,  Ji Hoon Jeong ,  Ki Hoon Choi ,  In Ki Jung ,  Won Sik Son ,  Tae Hee Kim

IPC: B23K26/03 ,  G03F1/84 ,  G03F1/42 ,  G03F1/60 ,  B23K26/122 ,  B23K26/06 ,  B23K26/04 ,  B23K26/362

CPC classification number: B23K26/032 ,  G03F1/84 ,  G03F1/42 ,  G03F1/60 ,  B23K26/122 ,  B23K26/0648 ,  B23K26/043 ,  B23K26/362

Abstract: The inventive concept provides a mask treating method. The mask treating method includes treating a mask by supplying a liquid to the mask, and irradiating a laser to a region of the mask on which a specific pattern is formed while the liquid remains on the mask; moving an optical module including a laser unit configured to irradiate the laser between a process position for treating the substrate and a standby position deviating from the process position; and adjusting a state of the optical module at an inspection port provided at the standby position to a set condition before the optical module is moved to the process position.

公开(公告)号：US12237181B2

公开(公告)日：2025-02-25

申请号：US17703255

申请日：2022-03-24

Applicant: SEMES CO., LTD.

Inventor： Ho Jong Hwang ,  Do Yeon Kim ,  Hyun Yoon

IPC: H01L21/67 ,  B08B3/02 ,  B08B3/04 ,  B08B3/08 ,  H01L21/687

Abstract: The present invention provides a substrate treating apparatus. The substrate treating apparatus includes: a cup having a treatment space therein; a support unit configured to support a substrate within the treatment space, and including a rotatable support plate; and a liquid discharge unit configured to discharge a chemical liquid to the substrate supported by the support unit, in which the support unit includes: a plurality of pin members provided to the support plate to support the substrate placed on the support plate; and a discharge member coupled to the pin member to discharge charges to the air according to a rotation of the support plate, and the discharge member is provided as a conductive member.