公开(公告)号：US12046466B2

公开(公告)日：2024-07-23

申请号：US17965911

申请日：2022-10-14

申请人： SEMES CO., LTD.

发明人： Yong-Jun Seo ,  Hyun Yoon ,  Jungsuk Goh ,  Byeong Geun Kim ,  Yoonki Sa ,  Doyeon Kim ,  Yerim Yeon ,  Choonghyun Lee ,  Pil Kyun Heo ,  Youngje Um ,  Jaeseong Lee ,  Dongok Ahn

IPC分类号： H01L21/02 ,  H01L21/67

CPC分类号： H01L21/02101 ,  H01L21/6715

摘要： The inventive concept provides a method for treating a substrate. In an embodiment, the substrate treating method includes a treatment step of treating a residue on the substrate with a first fluid in a supercritical state and a second fluid in a supercritical state in a process space of a chamber, and the first fluid in the supercritical state and the second fluid in the supercritical state have different densities.

公开(公告)号：US11139171B2

公开(公告)日：2021-10-05

申请号：US16514103

申请日：2019-07-17

申请人： SEMES CO., LTD.

发明人： Youngje Um

IPC分类号： H01L21/263 ,  H01L21/67

摘要： Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes a chamber providing an interior space for treating a substrate, a support unit provided in the chamber and configured to support the substrate, a first ejection unit having a first nozzle configured to supply a first cleaning medium in an aerosol state to the substrate supported by the support unit, and a second ejection unit having a second nozzle configured to supply a second cleaning medium to the substrate supported by the support unit.

公开(公告)号：US20190341259A1

公开(公告)日：2019-11-07

申请号：US16514103

申请日：2019-07-17

申请人： SEMES CO., LTD.

发明人： Youngje Um

IPC分类号： H01L21/263 ,  H01L21/67

摘要： Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes a chamber providing an interior space for treating a substrate, a support unit provided in the chamber and configured to support the substrate, a first ejection unit having a first nozzle configured to supply a first cleaning medium in an aerosol state to the substrate supported by the support unit, and a second ejection unit having a second nozzle configured to supply a second cleaning medium to the substrate supported by the support unit.

公开(公告)号：US10395930B2

公开(公告)日：2019-08-27

申请号：US15854198

申请日：2017-12-26

申请人： SEMES CO., LTD.

发明人： Youngje Um

IPC分类号： H01L21/263 ,  H01L21/67

摘要： Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes a chamber providing an interior space for treating a substrate, a support unit provided in the chamber and configured to support the substrate, a first ejection unit having a first nozzle configured to supply a first cleaning medium in an aerosol state to the substrate supported by the support unit, and a second ejection unit having a second nozzle configured to supply a second cleaning medium to the substrate supported by the support unit.

公开(公告)号：US11809158B2

公开(公告)日：2023-11-07

申请号：US16518059

申请日：2019-07-22

申请人： Semes Co., Ltd

发明人： Tae Woong Seo ,  Taerim Lee ,  Youngje Um

IPC分类号： G05B19/4065 ,  H01L21/67

CPC分类号： G05B19/4065 ,  H01L21/67173 ,  H01L21/67259 ,  G05B2219/40006

摘要： A substrate treating apparatus includes a process module including a plurality of process units that perform a plurality of steps included in a substrate treating process and that perform the substrate treating process on substrates sequentially placed in the process units based on process recipes for the substrates, a scheduler that controls operations of the process module and the process units included in the process module, a storage that stores transfer paths information of the substrates, and a selection module that selects a process unit to proceed, by a result of feeding back the transfer paths information stored in the storage to the scheduler. The substrate treating apparatus may further include a measuring instrument that measures defect values of the transfer paths information along which the substrates are transferred. The storage may store the defect values measured by the measuring instrument according to the transfer paths information of the substrates.

公开(公告)号：US20180333755A1

公开(公告)日：2018-11-22

申请号：US15982005

申请日：2018-05-17

申请人： SEMES CO., LTD.

发明人： Su Hyung LEE ,  Youngje Um

IPC分类号： B08B7/04 ,  B08B7/00 ,  H01L21/67

CPC分类号： B08B7/04 ,  B08B7/0021 ,  B08B7/0071 ,  H01L21/67051 ,  H01L21/67063

摘要： Provide are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus comprises a chamber, a substrate supporting member which is positioned in the chamber to support the substrate, a spray member which supplies a rinse liquid to the substrate, a depressurizing line which is used to depressurize the chamber, and a controller which vaporizes the rinse liquid by depressurizing the chamber through the depressurizing line after supplying the rinse liquid in a liquid phase.

公开(公告)号：US20180182628A1

公开(公告)日：2018-06-28

申请号：US15854198

申请日：2017-12-26

申请人： SEMES CO., LTD.

发明人： Youngje Um

IPC分类号： H01L21/263 ,  H01L21/67

CPC分类号： H01L21/263 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67207

摘要： Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes a chamber providing an interior space for treating a substrate, a support unit provided in the chamber and configured to support the substrate, a first ejection unit having a first nozzle configured to supply a first cleaning medium in an aerosol state to the substrate supported by the support unit, and a second ejection unit having a second nozzle configured to supply a second cleaning medium to the substrate supported by the support unit.