公开(公告)号：US20170099050A1

公开(公告)日：2017-04-06

申请号：US15282291

申请日：2016-09-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Yeol Lee ,  Seokil Kim ,  Hoiju Chung ,  Yongjae Shin ,  YouKeun Han

IPC: H03K19/00 ,  G11C7/10

CPC classification number: H03K19/0005 ,  G11C7/1057 ,  G11C2207/2254

Abstract: A memory system includes a memory module and a memory controller. The memory module includes a plurality of memory devices with corresponding ZQ calibration circuits therein. The memory controller, which is electrically coupled to the memory module, includes a ZQ global managing circuit therein. This ZQ global managing circuit is configured to determine a plurality of calibration values associated the corresponding ZQ calibration circuits in the plurality of memory devices, in response to calibration result data generated by the plurality of ZQ calibration circuits. The memory module is mounted within a memory slot. In addition, the plurality of calibration values account for signal loading characteristics of the memory module within the memory slot.

公开(公告)号：US11953545B2

公开(公告)日：2024-04-09

申请号：US17107244

申请日：2020-11-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seyoung Won ,  Dan-Kyu Kang ,  Sang-Yeol Lee

IPC: G01T1/08 ,  G01K1/02 ,  G01K11/12 ,  G01N21/78 ,  G01R31/28 ,  G01R31/44 ,  G01T1/16 ,  H01L23/00 ,  G01N21/77 ,  G01N21/81 ,  H01L25/065

CPC classification number: G01R31/2881 ,  G01K1/02 ,  G01K11/12 ,  G01N21/78 ,  G01R31/2874 ,  G01R31/2879 ,  G01R31/44 ,  G01T1/08 ,  G01T1/16 ,  H01L23/564 ,  G01N2021/7796 ,  G01N21/81 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A semiconductor module includes a substrate; a plurality of semiconductor packages provided on the substrate; and an environment information indicator configured to display information related to an environment surrounding the plurality of semiconductor packages.

公开(公告)号：US12025656B2

公开(公告)日：2024-07-02

申请号：US17107244

申请日：2020-11-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seyoung Won ,  Dan-Kyu Kang ,  Sang-Yeol Lee

IPC: G01T1/08 ,  G01K1/02 ,  G01K11/12 ,  G01N21/78 ,  G01R31/28 ,  G01R31/44 ,  G01T1/16 ,  H01L23/00 ,  G01N21/77 ,  G01N21/81 ,  H01L25/065

CPC classification number: G01R31/2881 ,  G01K1/02 ,  G01K11/12 ,  G01N21/78 ,  G01R31/2874 ,  G01R31/2879 ,  G01R31/44 ,  G01T1/08 ,  G01T1/16 ,  H01L23/564 ,  G01N2021/7796 ,  G01N21/81 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A semiconductor module includes a substrate; a plurality of semiconductor packages provided on the substrate; and an environment information indicator configured to display information related to an environment surrounding the plurality of semiconductor packages.

公开(公告)号：US10908209B2

公开(公告)日：2021-02-02

申请号：US15715625

申请日：2017-09-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seyoung Won ,  Dan-Kyu Kang ,  Sang-Yeol Lee

IPC: G01T1/08 ,  G01R31/28 ,  H01L23/00 ,  G01T1/16 ,  G01K11/12 ,  G01K1/02 ,  G01N21/78 ,  G01R31/44 ,  G01N21/77 ,  G01N21/81 ,  H01L25/065

Abstract: A semiconductor module includes a substrate; a plurality of semiconductor packages provided on the substrate; and an environment information indicator configured to display information related to an environment surrounding the plurality of semiconductor packages.

公开(公告)号：US10284198B2

公开(公告)日：2019-05-07

申请号：US15282291

申请日：2016-09-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Yeol Lee ,  Seokil Kim ,  Hoiju Chung ,  Yongjae Shin ,  YouKeun Han

IPC: H03K19/00 ,  G11C7/10

Abstract: A memory system includes a memory module and a memory controller. The memory module includes a plurality of memory devices with corresponding ZQ calibration circuits therein. The memory controller, which is electrically coupled to the memory module, includes a ZQ global managing circuit therein. This ZQ global managing circuit is configured to determine a plurality of calibration values associated the corresponding ZQ calibration circuits in the plurality of memory devices, in response to calibration result data generated by the plurality of ZQ calibration circuits. The memory module is mounted within a memory slot. In addition, the plurality of calibration values account for signal loading characteristics of the memory module within the memory slot.