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17 条记录 (耗时 0.02 秒)

    Electronic device comprising heat transfer member having metal plate and heat transfer material coupled thereto
    1.
    发明授权
    Electronic device comprising heat transfer member having metal plate and heat transfer material coupled thereto 有权

    公开(公告)号：US11304337B2

    公开(公告)日：2022-04-12

    申请号：US17001017

    申请日：2020-08-24

    申请人： Samsung Electronics Co., Ltd.

    发明人： Haejin Lee ,  Kyungha Koo ,  Min Park ,  Jungje Bang

    IPC分类号： H05K7/20 ,  H05K9/00

    摘要： Various embodiments of the present invention relate to an electronic device comprising a shielding structure which is arranged on the periphery of an electronic component, and which has an improved heat-radiating performance. The electronic device comprises: a circuit board; a non-elastic shielding member arranged on one surface of the circuit board, the non-elastic shielding member having a concave portion and an opening formed on a part of the concave portion; a processor contained in the concave portion and arranged on the one surface so as to correspond to the opening; a first heat transfer member arranged to contact the outer surface of the processor in at least a partial area of the opening; an elastic shielding member arranged on the periphery of the opening; and a second heat transfer member arranged to contact the first heat transfer member and the elastic shielding member. The second heat transfer member comprises a metal plate and a heat transfer material having a thermal conductivity higher than 1 W/mK. The heat transfer material may be coupled to the metal plate. The present invention may further comprise various other embodiments.

    Electronic device
    2.
    发明授权
    Electronic device 有权

    公开(公告)号：US11178799B2

    公开(公告)日：2021-11-16

    申请号：US15938689

    申请日：2018-03-28

    申请人： Samsung Electronics Co., Ltd.

    发明人： Hae-Jin Lee ,  Oh-Hyuck Kwon ,  Min Park ,  Jung-Je Bang ,  Jae-Deok Lim ,  Kyung-Ha Koo ,  Jae-Heung Ye ,  Chang-Tae Kim ,  Chi-Hyun Cho

    IPC分类号： H05K9/00 ,  H05K7/20 ,  H05K1/02 ,  H05K1/18

    摘要： Disclosed is an electronic device including a shielding member. The electronic device includes a substrate having an electric element mounted thereon; a shield can mounted on the electric element and including an opening formed at a part facing the electric element; a shielding member mounted around a part in which the opening is formed on an outer surface of the shield can, and electrically connected to the shield can; a metal plate mounted on the shielding member, with the opening covered, and electrically connected to the shielding member; and a heat conductive member mounted in the opening and interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate.

    Electronic device including shielding member connected to conductive plate covering opening of shield can
    3.
    发明授权
    Electronic device including shielding member connected to conductive plate covering opening of shield can 有权

    公开(公告)号：US10757846B2

    公开(公告)日：2020-08-25

    申请号：US16535528

    申请日：2019-08-08

    申请人： Samsung Electronics Co., Ltd.

    发明人： Haejin Lee ,  Min Park ,  Jungje Bang ,  Kyungha Koo ,  Yunjeong Park

    IPC分类号： H05K9/00 ,  H05K1/02

    摘要： Provided is an electronic device including a printed circuit board (PCB) in which at least one electrical element is disposed; a shield can including a concave portion and an opening formed in part of the concave portion and configured to receive the at least one electrical element at an inside of the concave portion disposed on the PCB; a conductive plate configured to cover the opening at an outside of the concave portion; a support member disposed between the conductive plate and the outside of the concave portion; and a shielding member disposed between the support member and the outside of the concave portion and connected to at least part of the conductive plate extended in a direction of the opening from the support member and configured to cover the opening.

    Electronic device including display module including sensor and method of manufacturing said display module
    5.
    发明授权
    Electronic device including display module including sensor and method of manufacturing said display module 有权

    公开(公告)号：US11134577B2

    公开(公告)日：2021-09-28

    申请号：US16865879

    申请日：2020-05-04

    申请人： Samsung Electronics Co., Ltd.

    发明人： Yongwon Lee ,  Youjin Kim ,  Min Park ,  Bongjae Rhee

    IPC分类号： H05K5/00 ,  H05K1/18 ,  G06K9/00 ,  H05K5/03

    摘要： An electronic device including a display module is provided. The electronic device includes a housing, a display module including a cover layer forming one surface of the housing, a first panel disposed below the cover layer and including pixels, and a second panel disposed below the first panel and including a layers, and a sensor coupled to the display module and forming a sensing region on the one surface of the housing. The display module includes an opening which penetrates the second panel, and the sensor is disposed in the second panel. A thermal shrinkage film is disposed in the opening to be in contact with the first panel. The thermal shrinkage film includes a first film being in contact with the first panel and having adhesion at a temperature above a specific first temperature, and a second film including a shrinking member which contracts at a temperature above the first temperature, and a light shielding member.

    Electronic device including noise inducing structure
    8.
    发明授权
    Electronic device including noise inducing structure 有权

    公开(公告)号：US11978950B2

    公开(公告)日：2024-05-07

    申请号：US17457989

    申请日：2021-12-07

    申请人： Samsung Electronics Co., Ltd.

    发明人： Haejin Lee ,  Min Park ,  Jinhwan Jung

    IPC分类号： H01Q1/52 ,  H01Q1/24 ,  H01Q1/02

    CPC分类号： H01Q1/243 ,  H01Q1/52 ,  H01Q1/02

    摘要： According to various embodiments, an electronic device includes: a housing including a conductive part; an antenna module, including a substrate including a first substrate surface, a second substrate surface facing a direction opposite a direction of the first substrate surface, and a substrate side surrounding a space between the first substrate surface and the second substrate surface, at least one antenna element disposed in the substrate, wireless communication circuitry disposed in the substrate and configured to transmit and/or receive a radio signal in the direction toward which the first substrate surface is directed through the at least one antenna element, a protection member disposed on the second substrate surface, and a conductive shield layer disposed on at least an external surface of the protection member, as an antenna module disposed in an internal space of the housing; a conductive member disposed in at least a part of the conductive part and having at least a partial area thereof facing at least a part of the conductive shield layer; and a noise induction layer disposed between the antenna module and the conductive member to form a capacitor structure having a specified capacitance value between the conductive shield layer and the conductive member. Noise induced from the antenna module may be induced toward the conductive part through the capacitor structure.

    Electronic device having heat-radiating structure
    10.
    发明授权
    Electronic device having heat-radiating structure 有权

    公开(公告)号：US11800632B2

    公开(公告)日：2023-10-24

    申请号：US17262973

    申请日：2019-07-24

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Yonghwa Kim ,  Min Park ,  Dongil Son ,  Hyunwoo Sim ,  Jaedeok Lim ,  Chunghyo Jung ,  Seungbum Choi

    IPC分类号： H05K1/02

    CPC分类号： H05K1/0207 ,  H05K1/0209 ,  H05K1/0219

    摘要： According to various embodiments, an electronic device may include a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, a middle plate disposed in the space between the first plate and the second plate in parallel with the second plate, a first Printed Circuit Board (PCB) disposed in a space between the second plate and the middle plate, a first electronic component mounted on the first PCB between the first PCB and the middle plate, a first heat transfer structure disposed between the first electronic component and the middle plate, a second electronic component including a first surface disposed in the space and spaced apart from the first PCB, a second surface facing away from the first surface, and a side face substantially perpendicular to the first surface or the second surface, and a second heat transfer structure. The second heat transfer structure may include a first thermal conductive layer including a first portion attached to the first surface or the second surface, and a second portion extending from the first portion toward the middle plate and at least partially having a thermal conductive path between the second electronic component and the middle plate, and a second electrical conductive layer including a third portion attached to the first portion so that the third portion constructs an electromagnetic shielding structure for the second electric component. Other various embodiments may also be possible.