公开(公告)号：US10010016B2

公开(公告)日：2018-06-26

申请号：US15415181

申请日：2017-01-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-deok Lim ,  Jung-je Bang ,  Hyun-tae Jang ,  Hye-in Park ,  Jae-heung Ye ,  Chan-beom Jeong ,  Sae-bom Lee ,  Yong-won Lee

IPC: H01R4/64 ,  H05K9/00

CPC classification number: H05K9/0032 ,  H01R4/64

Abstract: A shield can device is provided. The shield can device includes a frame which is fixed to a printed circuit board (PCB) and surrounds at least one circuit device as an electromagnetic shielding target, a cover which is coupled to the frame and closes an opening formed in a top of the frame, and a plurality of contact projections which are formed between the frame and the cover and allow the frame and the cover to be in electrical contact with each other.

公开(公告)号：US20170318713A1

公开(公告)日：2017-11-02

申请号：US15476862

申请日：2017-03-31

Applicant: Samsung Electronics Co., Ltd

Inventor： Jung-Je Bang ,  Min Park ,  Jae-Heung Ye ,  Yong-won Lee ,  Sang-Seob Kim ,  Jun-Yeong Kim

IPC: H05K9/00

CPC classification number: H05K9/0083 ,  H05K9/0084 ,  H05K9/0088

Abstract: A shielding member is of a film type and includes an insulating layer, a shielding layer formed on a surface of the insulating layer, and a resin adhesive layer formed on a surface of the shielding layer. The resin adhesive layer may include a thermoplastic resin adhesive having an electrically conductive powder. The resin adhesive layer of the shielding member stably maintains connection with the ground after curing, thereby providing a stable operating environment of the electronic device.