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公开(公告)号：US11646400B2
公开(公告)日：2023-05-09
申请号：US17343182
申请日：2021-06-09
发明人： Soonmin Hong , Gyuhwa Kim , Jeonggen Yoon , Tackmo Lee , Gyun Heo , Youngjun Moon , Kyungwoon Jang
CPC分类号： H01L33/62 , H01L25/167 , H01L27/1262 , H01L2933/0066
摘要： A display module includes a glass substrate having a front surface and a back surface opposite to the front surface; a TFT layer; LEDs mounted on the TFT layer; and a plurality of side wirings formed at intervals in an edge area of the glass substrate, and the edge area includes a first area corresponding to a side surface of the glass substrate, a second area adjacent to the side surface, and a third area adjacent to the side surface, and a first chamfered surface formed by chamfering a corner at which the first area and the second area meet, and a second chamfered surface formed by chamfering a corner at which the first area and the third area meet, and each of the plurality of side wirings is disposed along the second area, the first chamfered surface, the first area, the second chamfered surface, and the third area.
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公开(公告)号：US11056630B2
公开(公告)日：2021-07-06
申请号：US16786514
申请日：2020-02-10
发明人： Soonmin Hong , Gyuhwa Kim , Jeonggen Yoon , Tackmo Lee , Gyun Heo , Youngjun Moon , Kyungwoon Jang
摘要： A display module includes a glass substrate having a front surface and a back surface opposite to the front surface; a TFT layer; LEDs mounted on the TFT layer; and a plurality of side wirings formed at intervals in an edge area of the glass substrate, and the edge area includes a first area corresponding to a side surface of the glass substrate, a second area adjacent to the side surface, and a third area adjacent to the side surface, and a first chamfered surface formed by chamfering a corner at which the first area and the second area meet, and a second chamfered surface formed by chamfering a corner at which the first area and the third area meet, and each of the plurality of side wirings is disposed along the second area, the first chamfered surface, the first area, the second chamfered surface, and the third area.
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公开(公告)号：US20210305477A1
公开(公告)日：2021-09-30
申请号：US17343182
申请日：2021-06-09
发明人： Soonmin HONG , Gyuhwa Kim , Jeonggen Yoon , Tackmo Lee , Gyun Heo , Youngjun Moon , Kyungwoon Jang
摘要： A display module includes a glass substrate having a front surface and a back surface opposite to the front surface; a TFT layer; LEDs mounted on the TFT layer; and a plurality of side wirings formed at intervals in an edge area of the glass substrate, and the edge area includes a first area corresponding to a side surface of the glass substrate, a second area adjacent to the side surface, and a third area adjacent to the side surface, and a first chamfered surface formed by chamfering a corner at which the first area and the second area meet, and a second chamfered surface formed by chamfering a corner at which the first area and the third area meet, and each of the plurality of side wirings is disposed along the second area, the first chamfered surface, the first area, the second chamfered surface, and the third area.
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公开(公告)号：US11805633B2
公开(公告)日：2023-10-31
申请号：US16638645
申请日：2018-07-11
发明人： Hyun-Tae Jang , Min Park , Byung Hoon Lee , Youngchul Lee , Changjoon Lee , Jiyoung Jang , Youngjun Moon , Minyoung Park , Jeonggen Yoon , Won Choi , Siho Jang
CPC分类号： H05K13/041 , H01L33/005 , H05K13/02 , H05K13/0409 , Y10T29/53174
摘要： According to various embodiments, provided is an electrical element transfer apparatus comprising: a fixing jig in which each of a plurality of electrical elements is arranged at a predetermined interval; a movement jig movably arranged at an upper part of the fixing jig, and including a plurality of first accommodating grooves for accommodating at least a part of each of the plurality of electrical elements; and an attraction device arranged around the movable jig and attaching each of the plurality of electrical elements through the movable jig to the first accommodating groove of the movable jig through magnetic force. Additional various embodiments are possible.
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公开(公告)号：US11355365B2
公开(公告)日：2022-06-07
申请号：US16761905
申请日：2018-12-03
发明人： Changjoon Lee , Byunghoon Lee , Min Park , Kyungwoon Jang , Jeonggen Yoon , Hyuntae Jang
IPC分类号： H01L21/67 , B65G47/90 , H01L25/075
摘要： Introduced is a micro-chip gripper comprising: a pin plate of which one surface is coupled to another apparatus; a hole plate of which one surface faces the other surface of the pin plate while being disposed to be spaced apart therefrom by a fixed distance, and which is driven together with the drive of the pin plate, and in which a plurality of holes making a fixed pattern are formed; pins which are inserted into the holes of the hole plate and of which one end part is supported by the pin plate; and an adhesion layer which covers the other surface of the hole plate. Other embodiments are possible.
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