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    Electronic device
    1.
    发明授权
    Electronic device 有权

    公开(公告)号：US11178799B2

    公开(公告)日：2021-11-16

    申请号：US15938689

    申请日：2018-03-28

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hae-Jin Lee ,  Oh-Hyuck Kwon ,  Min Park ,  Jung-Je Bang ,  Jae-Deok Lim ,  Kyung-Ha Koo ,  Jae-Heung Ye ,  Chang-Tae Kim ,  Chi-Hyun Cho

    IPC: H05K9/00 ,  H05K7/20 ,  H05K1/02 ,  H05K1/18

    Abstract: Disclosed is an electronic device including a shielding member. The electronic device includes a substrate having an electric element mounted thereon; a shield can mounted on the electric element and including an opening formed at a part facing the electric element; a shielding member mounted around a part in which the opening is formed on an outer surface of the shield can, and electrically connected to the shield can; a metal plate mounted on the shielding member, with the opening covered, and electrically connected to the shielding member; and a heat conductive member mounted in the opening and interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate.

    ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME
    3.
    发明申请
    ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME 有权

    公开(公告)号：US20170202093A1

    公开(公告)日：2017-07-13

    申请号：US15405256

    申请日：2017-01-12

    Applicant: Samsung Electronics Co., Ltd

    Inventor： Jung-Je Bang ,  Yong-Won Lee ,  Jeong-Ung Kim ,  Jae-Heung Ye

    IPC: H05K5/00 ,  H05K9/00 ,  H01R4/02 ,  H05K1/18

    CPC classification number: H05K5/0004 ,  H01R4/02 ,  H05K1/18 ,  H05K5/0086 ,  H05K9/0007 ,  H05K9/0028

    Abstract: According to embodiments, an electronic device includes: a housing including a face facing a first direction; a circuit board including first and second board faces substantially parallel to the face, and a side board face facing a second direction, the circuit board disposed within the housing; a first component disposed in a first region of the first board face; a second component disposed in a second region of the second board face overlapping with the first region; a first shield including a first side wall formed facing the second direction, the first shield covering the first region; a second shield including a second side wall formed facing the second direction, the second shield covering the second region; and a bonding material formed between the first side wall or second side wall and the side board face. The electronic device as described above may be variously implemented according to embodiments.

    SHIELD CAN ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME
    4.
    发明申请
    SHIELD CAN ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME 审中-公开
    屏蔽CAN组装和电子设备，包括它们

    公开(公告)号：US20150264844A1

    公开(公告)日：2015-09-17

    申请号：US14713940

    申请日：2015-05-15

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Ki-Youn Jang ,  Jeong-Ung Kim ,  Jung-Je Bang ,  Sang-Hyun An

    IPC: H05K9/00

    CPC classification number: H05K9/0052 ,  H05K1/023 ,  H05K9/0035

    Abstract: An electronic device includes a printed circuit board (PCB), a first cover disposed to shield a first region of the PCB, and a second cover for shielding a second region which has at least a boundary with the first region. A corresponding boundary portion the first cover and the second cover include at least one protrusion portion and at least one recess portion which are fitted to face each other. Thus, since at least two shielding covers share the single boundary region, the component mounting region of the PCB can be efficiently utilized to thus contribute to slimness of the electronic device.

    Abstract translation: 电子设备包括印刷电路板（PCB），设置成屏蔽PCB的第一区域的第一盖和用于屏蔽与第一区域至少具有边界的第二区域的第二盖。 第一盖和第二盖的相应的边界部分包括至少一个突出部分和至少一个彼此相对配合的凹部。 因此，由于至少两个屏蔽罩共享单个边界区域，因此能够有效地利用PCB的部件安装区域，从而有助于电子设备的薄型化。

    Electronic device including shield structure
    5.
    发明授权
    Electronic device including shield structure 有权

    公开(公告)号：US10470345B2

    公开(公告)日：2019-11-05

    申请号：US15377012

    申请日：2016-12-13

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jae-Heung Ye ,  Jung-Je Bang ,  Jeong-Ung Kim ,  Ki-Youn Jang

    IPC: H05K9/00

    Abstract: Disclosed are various embodiments relating to an electronic device that includes a shield structure. According to an example embodiment, the electronic device may include: a housing that includes a first surface directed in a first direction and a second surface directed in a second direction that is opposite to the first direction; a printed circuit board included in the housing, wherein the printed circuit board includes a first surface directed in the first direction and a second surface directed in the second direction; at least one electronic component disposed on the first surface of the printed circuit board; and at least one shield structure configured to electro-magnetically shield the at least one electronic component, and the shield structure may include: a flexible sheet that includes a first sheet that covers the at least one electronic component and a second sheet that at least partially covers the space between the first sheet and the first surface of the printed circuit board, when viewed from above the first surface of the printed circuit board; and at least one frame structure that supports the first and second sheets.

    Electronic device and manufacturing method of the same
    7.
    发明授权
    Electronic device and manufacturing method of the same 有权

    公开(公告)号：US09888586B2

    公开(公告)日：2018-02-06

    申请号：US15405256

    申请日：2017-01-12

    Applicant: Samsung Electronics Co., Ltd

    Inventor： Jung-Je Bang ,  Yong-Won Lee ,  Jeong-Ung Kim ,  Jae-Heung Ye

    IPC: H05K9/00 ,  H05K5/00 ,  H01R4/02 ,  H05K1/18

    CPC classification number: H05K5/0004 ,  H01R4/02 ,  H05K1/18 ,  H05K5/0086 ,  H05K9/0007 ,  H05K9/0028

    Abstract: According to embodiments, an electronic device includes: a housing including a face facing a first direction; a circuit board including first and second board faces substantially parallel to the face, and a side board face facing a second direction, the circuit board disposed within the housing; a first component disposed in a first region of the first board face; a second component disposed in a second region of the second board face overlapping with the first region; a first shield including a first side wall formed facing the second direction, the first shield covering the first region; a second shield including a second side wall formed facing the second direction, the second shield covering the second region; and a bonding material formed between the first side wall or second side wall and the side board face. The electronic device as described above may be variously implemented according to embodiments.

    SHIELD CAN ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME
    8.
    发明申请
    SHIELD CAN ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME 审中-公开
    屏蔽CAN组装和电子设备，包括它们

    公开(公告)号：US20140362543A1

    公开(公告)日：2014-12-11

    申请号：US14302387

    申请日：2014-06-11

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Ki-Youn Jang ,  Jeong-Ung Kim ,  Jung-Je Bang ,  Sang-Hyun An

    IPC: H05K1/02

    CPC classification number: H05K9/0052 ,  H05K1/023 ,  H05K9/0035

    Abstract: An electronic device includes a printed circuit board (PCB), a first cover disposed to shield a first region of the PCB, and a second cover for shielding a second region which has at least a boundary with the first region. A corresponding boundary portion the first cover and the second cover include at least one protrusion portion and at least one recess portion which are fitted to face each other. Thus, since at least two shielding covers share the single boundary region, the component mounting region of the PCB can be efficiently utilized to thus contribute to slimness of the electronic device.

    Abstract translation: 电子设备包括印刷电路板（PCB），设置成屏蔽PCB的第一区域的第一盖和用于屏蔽与第一区域至少具有边界的第二区域的第二盖。 第一盖和第二盖的相应的边界部分包括至少一个突出部分和至少一个彼此相对配合的凹部。 因此，由于至少两个屏蔽罩共享单个边界区域，因此能够有效地利用PCB的部件安装区域，从而有助于电子设备的薄型化。

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