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公开(公告)号：US12274040B2
公开(公告)日：2025-04-08
申请号：US18514331
申请日：2023-11-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyelim Yun , Bongkyu Min , Dohoon Kim , Taewoo Kim , Jinyong Park , Jungje Bang , Hyeongju Lee
Abstract: An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.
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公开(公告)号：US11304337B2
公开(公告)日：2022-04-12
申请号：US17001017
申请日：2020-08-24
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haejin Lee , Kyungha Koo , Min Park , Jungje Bang
Abstract: Various embodiments of the present invention relate to an electronic device comprising a shielding structure which is arranged on the periphery of an electronic component, and which has an improved heat-radiating performance. The electronic device comprises: a circuit board; a non-elastic shielding member arranged on one surface of the circuit board, the non-elastic shielding member having a concave portion and an opening formed on a part of the concave portion; a processor contained in the concave portion and arranged on the one surface so as to correspond to the opening; a first heat transfer member arranged to contact the outer surface of the processor in at least a partial area of the opening; an elastic shielding member arranged on the periphery of the opening; and a second heat transfer member arranged to contact the first heat transfer member and the elastic shielding member. The second heat transfer member comprises a metal plate and a heat transfer material having a thermal conductivity higher than 1 W/mK. The heat transfer material may be coupled to the metal plate. The present invention may further comprise various other embodiments.
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公开(公告)号：US11047628B2
公开(公告)日：2021-06-29
申请号：US15999729
申请日：2017-02-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haejin Lee , Kyungha Koo , Chunghyo Jung , Se-Young Jang , Jungje Bang , Jaeheung Ye , Chi-Hyun Cho
Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.
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公开(公告)号：US12245374B2
公开(公告)日：2025-03-04
申请号：US17982040
申请日：2022-11-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Eunseok Hong , Jungje Bang
IPC: H05K1/11
Abstract: An electronic device includes a housing, a first substrate, a second substrate, and an interposer disposed between the first substrate and the second substrate and configured to electrically connect the first substrate and the second substrate. The interposer includes a substrate, a first surface, a second surface, and a side surface. The interposer further includes a plurality of first conductive pads, a plurality of second conductive pads, a plurality of conductive posts, a plurality of third conductive terminals at least partially exposed on the first surface and electrically connected to the plurality of first conductive pads via a first conductive via (CV), and a plurality of fourth conductive terminals at least partially exposed on the second surface and electrically connected to the plurality of second conductive pads via a second CV.
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公开(公告)号：US11832389B2
公开(公告)日：2023-11-28
申请号：US17431900
申请日：2021-08-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Taewon Sun , Jichul Kim , Kicheol Bae , Jinyong Park , Jungje Bang , Yongjae Song
CPC classification number: H05K1/14 , H04M1/0249 , H05K1/0216 , H05K1/181 , H05K7/1427 , H05K2201/10378
Abstract: An electronic device according to various embodiments may include: a display, a first circuit board disposed under the display, a first component and a second component disposed on one surface of the first circuit board, the first and second components each having different heights, a first interposer surrounding at least one side surface of the first component and disposed in a first region of the first circuit board, the first interposer part having a first height, a second interposer part surrounding at least one side surface of the second component and disposed in a second region of the first circuit board, the second interposer part having a second height different from the first height, a first second circuit board, at least a portion of which is spaced apart from the first region of the first circuit board, the first second circuit board including a first first portion bonded to the first interposer part, and a second second circuit board, at least a portion of which is spaced apart from the second region of the first circuit board, the second second circuit board including a first second portion bonded to the second interposer and spaced apart from the first second circuit board by a specified gap.
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Patent Agency Ranking
公开(公告)号：US11098959B2
公开(公告)日：2021-08-24
申请号：US17094293
申请日：2020-11-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haejin Lee , Kyungha Koo , Chunghyo Jung , Se-Young Jang , Jungje Bang , Jaeheung Ye , Chi-Hyun Cho
Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.
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公开(公告)号：US10798849B2
公开(公告)日：2020-10-06
申请号：US16515275
申请日：2019-07-18
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haejin Lee , Kyungha Koo , Chunghyo Jung , Se-Young Jang , Jungje Bang , Jaeheung Ye , Chi-Hyun Cho
IPC: H05K7/20 , F28D15/02 , H01L23/427 , G06F1/20 , H05K9/00
Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.
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公开(公告)号：US10757846B2
公开(公告)日：2020-08-25
申请号：US16535528
申请日：2019-08-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haejin Lee , Min Park , Jungje Bang , Kyungha Koo , Yunjeong Park
Abstract: Provided is an electronic device including a printed circuit board (PCB) in which at least one electrical element is disposed; a shield can including a concave portion and an opening formed in part of the concave portion and configured to receive the at least one electrical element at an inside of the concave portion disposed on the PCB; a conductive plate configured to cover the opening at an outside of the concave portion; a support member disposed between the conductive plate and the outside of the concave portion; and a shielding member disposed between the support member and the outside of the concave portion and connected to at least part of the conductive plate extended in a direction of the opening from the support member and configured to cover the opening.
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公开(公告)号：US12142815B2
公开(公告)日：2024-11-12
申请号：US17528720
申请日：2021-11-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jaehoon Jo , Eunseok Hong , Dongyeon Kim , Sehyun Park , Jungje Bang , Myunghun Jeong , Jehun Jong
Abstract: An electronic device is provided, which includes a housing; a first plate placed on the front side of the housing; a second plate placed on the rear side of the housing; and an antenna module arranged between the first plate and the second plate. The antenna module includes a first PCB; a second PCB having a material different from that of the first PCB and at least partially coupled to one surface of the first PCB in an overlap area; a first conductive line included in the first PCB; a second conductive line included in the second PCB; a first conductive pattern arranged on the second PCB and connected to the second conductive line; a first connection member for connecting the first conductive line and the second conductive line in the overlap area; and a second connection member for coupling the first PCB and the second PCB in the overlap area.
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公开(公告)号：US11555657B2
公开(公告)日：2023-01-17
申请号：US17375626
申请日：2021-07-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haejin Lee , Kyungha Koo , Chunghyo Jung , Se-Young Jang , Jungje Bang , Jaeheung Ye , Chi-Hyun Cho
Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.
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