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公开(公告)号：US12101874B2
公开(公告)日：2024-09-24
申请号：US17962286
申请日：2022-10-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Eunseok Hong
IPC: H05K1/02
CPC classification number: H05K1/0219 , H05K1/0278 , H05K2201/0715 , H05K2201/0723 , H05K2201/09609
Abstract: A rigid flexible printed circuit board (RFPCB) may include: a first base conductive layer; a first rigid conductive layer spaced apart from the first base conductive layer in a first direction; a second rigid conductive layer spaced apart from the first base conductive layer in the first direction and spaced apart from the first rigid conductive layer in a second direction intersecting the first direction; a base cover layer spaced apart from the first base conductive layer in the first direction and positioned closer to the first base conductive layer than to the first rigid conductive layer and the second rigid conductive layer; a transmission line positioned between the first base conductive layer and the base cover layer; and a dummy metal layer disposed on the base cover layer, positioned between the first rigid conductive layer and the second rigid conductive layer, and overlapping the transmission line in the first direction.
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公开(公告)号：US11510312B2
公开(公告)日：2022-11-22
申请号：US17265888
申请日：2019-08-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsun Lee , Eunseok Hong , Byeongkeol Kim , Jongmin Jeon
Abstract: Disclosed are various embodiments related to a circuit board included in an electronic device. According to one embodiment, the circuit board may comprise: a core layer including an upper surface and a lower surface and formed as a substrate made of a prepreg material; a first flexible copper clad laminate including a plurality of conductive layers and laminated on the upper surface; at least one first substrate layer laminated above the first flexible copper clad laminate and including a conductive layer formed on the substrate made of a prepreg material; a second flexible copper clad laminate including a plurality of conductive layers and laminated on the lower surface; and at least one second substrate layer laminated under the second flexible copper clad laminate and including a conductive layer formed on the substrate made of a prepreg material. Various other embodiments are also possible.
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公开(公告)号：US11363711B2
公开(公告)日：2022-06-14
申请号：US16200401
申请日：2018-11-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jaehoon Jo , Sehyun Park , Sumin Yun , Myunghun Jeong , Jehun Jong , Jinwoo Jung , Jaebong Chun , Eunseok Hong
Abstract: According to various embodiments of the present disclosure, an electronic device may include: a housing including a first plate and a second plate; a printed circuit board having a first surface and a second surface; and a communication circuit arranged inside the housing. The printed circuit board may include: a plurality of insulating layers laminated on each other between the first surface and the second surface; an antenna element arranged in a first region above the second surface of the printed circuit board or between a first pair of insulating layers of the printed circuit board, when seen from above the second surface of the printed circuit board; and a plurality of first electroconductive patterns arranged in a second region that at least surrounds one surface of the first region. Various embodiments may be possible.
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公开(公告)号：US11212378B2
公开(公告)日：2021-12-28
申请号：US16723350
申请日：2019-12-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Eunseok Hong
Abstract: A foldable electronic device is provided, which includes a flexible display; a hinge assembly configured to fold and unfold a first area and a second area of the flexible display onto and away from each other; and a heat diffusion member. The hinge assembly includes a first hinge frame attached to a bottom face of the first area via a first adhesive member; a second hinge frame attached to a bottom face of the second area via a second adhesive member; a hinge pivotally connecting the first hinge frame and the second hinge frame to each other; and a hinge housing including a space, which accommodates the hinge, and connecting the first hinge frame and the second hinge frame to each other. At least a partial area of the heat diffusion member may be disposed between the flexible display and the hinge housing, in the space or at a position communicating with the space.
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公开(公告)号：US12148985B2
公开(公告)日：2024-11-19
申请号：US17531104
申请日：2021-11-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Eunseok Hong
Abstract: According to an embodiment of the present invention, an electronic device may comprise: a first printed circuit board which includes a first surface facing a first direction and a second surface facing a second direction opposite to the first direction; a second printed circuit board which includes a third surface facing the first direction and a fourth surface facing the second direction and includes at least one first antenna; a first wireless communication circuit which is electrically connected to at least one connection terminal formed on the first printed circuit board and transmits and receives a signal of a first frequency band through the at least one first antenna; and a conductive bonding member which is disposed between the first surface and the fourth surface and electrically connects the at least one first antenna and the first wireless communication circuit. Various other embodiments may be included.
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Patent Agency Ranking
公开(公告)号：US11564311B2
公开(公告)日：2023-01-24
申请号：US17171461
申请日：2021-02-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsun Lee , Byeongkeol Kim , Yeongjin Lee , Jongmin Jeon , Jaeyoub Jung , Eunseok Hong
Abstract: The disclosure relates to a rigid-flexible printed circuit board and an electronic device including same. The electronic device may include: a housing; a first module disposed in one region of the housing; a second module disposed in an other region of the housing and spaced apart from the first module; and a rigid-flexible printed circuit board electrically connecting the first module and the second module, wherein the rigid-flexible printed circuit board includes: a rigid region; a flexible region coupled to the rigid region, wherein a part of the flexible region overlaps the rigid region; and a protective layer laminated on at least one of an upper end or a lower end of the flexible region to cover at least a part of a coupling portion of the rigid region and the flexible region by a designated numerical value, the coupling portion having a tensile strength equal to or greater than a designated strength based on the flexible region being bent. Various other embodiments are possible.
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公开(公告)号：US11245782B2
公开(公告)日：2022-02-08
申请号：US16723350
申请日：2019-12-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Eunseok Hong
Abstract: A foldable electronic device is provided, which includes a flexible display; a hinge assembly configured to fold and unfold a first area and a second area of the flexible display onto and away from each other; and a heat diffusion member. The hinge assembly includes a first hinge frame attached to a bottom face of the first area via a first adhesive member; a second hinge frame attached to a bottom face of the second area via a second adhesive member; a hinge pivotally connecting the first hinge frame and the second hinge frame to each other; and a hinge housing including a space, which accommodates the hinge, and connecting the first hinge frame and the second hinge frame to each other. At least a partial area of the heat diffusion member may be disposed between the flexible display and the hinge housing, in the space or at a position communicating with the space.
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公开(公告)号：US11202364B2
公开(公告)日：2021-12-14
申请号：US17258631
申请日：2019-06-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Eunseok Hong , Jungje Bang
Abstract: An electronic device according to various embodiments comprises: a circuit element; a printed circuit board comprising a first connection pad connected to the ground of the electronic device, a second connection pad, and a third connection pad arranged between the first connection pad and the second connection pad and connected to a signal terminal of the circuit element; and a flexible printed circuit board (FPCB) comprising a coupling part connected to the printed circuit board, and a connection part extending from the coupling part, wherein the FPCB comprises first ground wiring connected to the first connection pad and extending from the coupling part to the connection part in an assigned direction, second ground wiring connected to the second connection pad and extending from the coupling part to the connection part in the assigned direction, signal wiring connected to the third connection pad and extending from the coupling part to the connection part in the assigned direction, while being arranged between the first ground wiring and the second ground wiring, and third ground wiring arranged in an opposite direction to the assigned direction so as to be connected, in the coupling part, to the first ground wiring and the second ground wiring and surround the signal wiring. Other various embodiments are possible.
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公开(公告)号：US20210195736A1
公开(公告)日：2021-06-24
申请号：US17125512
申请日：2020-12-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jongmin Jeon , Eunseok Hong
Abstract: Disclosed is a printed circuit board (PCB) module including a first PCB comprising a base PCB, a sidewall disposed on a periphery of the base PCB, and conductive vias penetrating the sidewall, a second PCB disposed on the sidewall to cover a cavity formed by the sidewall of the first PCB, and at least one electronic component disposed inside the cavity and located on the first PCB and/or the second PCB, wherein the sidewall comprises a first layer disposed on an upper face of the base PCB and constructed of an insulating member, a second layer disposed on the first layer and comprising a polyimide, a third layer disposed on the second layer and constructed of an insulating member, and a fourth layer disposed on the third layer and comprising a conductive member conductive with respect to the conductive vias.
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公开(公告)号：US20160196206A1
公开(公告)日：2016-07-07
申请号：US14909443
申请日：2014-07-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Byoungik Kang , Jinyoung Park , Seungwook Lee , Eunseok Hong
CPC classification number: G06F12/023 , G06F12/0888 , G06F13/1663 , G06F13/1694 , G06F13/18 , G06F2212/1016 , G06F2212/1044 , Y02D10/13 , Y02D10/14
Abstract: The present invention relates to a processor and a memory. More specifically, the present invention relates to a switchable on chip memory accessible by various master intellectual properties (IPs) and a method for controlling the same, and the method for controlling the on chip memory, according to one embodiment of the present invention, can comprise the steps of: setting memory allocation information including at least one among modes of respective master IPs, priority, space size of a required memory, and correlation with other master IPs; and allocating memories for the respective master IPs by using the memory allocation information. According to the one embodiment of the present invention, various master IPs within an embedded SoC are capable of utilizing all of the advantages of an on chip buffer and an on chip cache.
Abstract translation: 本发明涉及处理器和存储器。 更具体地，本发明涉及可通过各种主要知识产权（IP）访问的可切换片上存储器及其控制方法，并且根据本发明的一个实施例的用于控制片上存储器的方法可以 包括以下步骤：设置包括各个主IP的模式，优先级，所需存储器的空间大小以及与其他主IP的相关性中的至少一个的存储器分配信息; 以及通过使用存储器分配信息为各个主IP分配存储器。 根据本发明的一个实施例，嵌入式SoC内的各种主IP能够利用片上缓冲器和片上高速缓存的所有优点。
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