公开(公告)号：US11564311B2

公开(公告)日：2023-01-24

申请号：US17171461

申请日：2021-02-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngsun Lee ,  Byeongkeol Kim ,  Yeongjin Lee ,  Jongmin Jeon ,  Jaeyoub Jung ,  Eunseok Hong

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/46

Abstract: The disclosure relates to a rigid-flexible printed circuit board and an electronic device including same. The electronic device may include: a housing; a first module disposed in one region of the housing; a second module disposed in an other region of the housing and spaced apart from the first module; and a rigid-flexible printed circuit board electrically connecting the first module and the second module, wherein the rigid-flexible printed circuit board includes: a rigid region; a flexible region coupled to the rigid region, wherein a part of the flexible region overlaps the rigid region; and a protective layer laminated on at least one of an upper end or a lower end of the flexible region to cover at least a part of a coupling portion of the rigid region and the flexible region by a designated numerical value, the coupling portion having a tensile strength equal to or greater than a designated strength based on the flexible region being bent. Various other embodiments are possible.