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公开(公告)号：US12274040B2
公开(公告)日：2025-04-08
申请号：US18514331
申请日：2023-11-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyelim Yun , Bongkyu Min , Dohoon Kim , Taewoo Kim , Jinyong Park , Jungje Bang , Hyeongju Lee
Abstract: An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.
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公开(公告)号：US11812555B2
公开(公告)日：2023-11-07
申请号：US17718891
申请日：2022-04-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jinyong Park , Taewoo Kim , Hyeongju Lee , Bongkyu Min , Jungsik Park , Hyelim Yun
IPC: H01Q1/24 , H05K1/14 , H05K5/00 , H05K1/02 , H05K1/11 , H05K3/46 , H04M1/02 , H05K1/03 , H04M1/03
CPC classification number: H05K1/144 , H01Q1/243 , H04M1/0264 , H04M1/0277 , H05K1/025 , H05K1/0243 , H05K1/0366 , H05K1/115 , H05K3/4644 , H05K5/0086 , H04M1/03 , H05K2201/042 , H05K2201/09027 , H05K2201/1009 , H05K2201/10098 , H05K2201/10121 , H05K2201/10151 , H05K2201/10234
Abstract: According to an embodiment of the disclosure, an electronic device comprises a first printed circuit board including a first electrical terminal exposed on one face of a first area, a second electrical terminal exposed on the one face of a second area and insulated from the first electrical terminal, and a first ground terminal exposed on the one face of a third area formed between the first area and the second area, the third area having a width narrower than a width of the first area or the width of the second area; and a second printed circuit board including a third electrical terminal exposed on one face of a fourth area, a fourth electrical terminal exposed on the one face of a fifth area and electrically connected to the third electrical terminal, and a second ground terminal exposed on the one face of a sixth area located between the fourth area and the fifth area, wherein the second printed circuit board is disposed on the first printed circuit board to overlap the third area, the first electrical terminal and the third electrical terminal are electrically coupled to each other, the second electrical terminal and the fourth electrical terminal are electrically coupled to each other, and the first ground terminal and the second ground terminal are electrically coupled to each other.
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公开(公告)号：US11277949B2
公开(公告)日：2022-03-15
申请号：US16921801
申请日：2020-07-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyelim Yun , Bongkyu Min , Dohoon Kim , Taewoo Kim , Jinyong Park , Jungje Bang , Hyeongju Lee
Abstract: Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.
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公开(公告)号：US12022614B2
公开(公告)日：2024-06-25
申请号：US17487673
申请日：2021-09-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Bongkyu Min , Taewoo Kim , Jinyong Park , Hyelim Yun , Hyeongju Lee , Sanghoon Park , Jiseon Han
IPC: H05K1/00 , H01L23/528 , H04M1/02 , H05K1/11 , H05K1/14
CPC classification number: H05K1/141 , H01L23/528 , H04M1/0277 , H05K1/111 , H05K1/115 , H05K1/144 , H05K2201/10378
Abstract: The disclosure relates to an electronic device including an interposer. The interposer includes a substrate and a plurality of connecting structures disposed on the substrate and electrically connecting a first circuit board and a second circuit board disposed in the electronic device. The plurality of connecting structures includes a plurality of via holes formed in the substrate, a plurality of conductive members disposed in the plurality of via holes, an insulating member disposed between the plurality of conductive members, and a plurality of pads disposed on the outer periphery of the plurality of conductive members. The plurality of conductive members may be separately disposed on the substrate to electrically connect with the first and second circuit boards.
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公开(公告)号：US11330716B2
公开(公告)日：2022-05-10
申请号：US17132484
申请日：2020-12-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jinyong Park , Taewoo Kim , Hyeongju Lee , Bongkyu Min , Jungsik Park , Hyelim Yun
IPC: H05K1/14 , H05K1/11 , H05K5/00 , H05K1/02 , H05K3/46 , H04M1/02 , H01Q1/24 , H05K1/03 , H04M1/03
Abstract: According to an embodiment of the disclosure, an electronic device comprises a first printed circuit board including a first electrical terminal exposed on one face of a first area, a second electrical terminal exposed on the one face of a second area and insulated from the first electrical terminal, and a first ground terminal exposed on the one face of a third area formed between the first area and the second area, the third area having a width narrower than a width of the first area or the width of the second area; and a second printed circuit board including a third electrical terminal exposed on one face of a fourth area, a fourth electrical terminal exposed on the one face of a fifth area and electrically connected to the third electrical terminal, and a second ground terminal exposed on the one face of a sixth area located between the fourth area and the fifth area, wherein the second printed circuit board is disposed on the first printed circuit board to overlap the third area, the first electrical terminal and the third electrical terminal are electrically coupled to each other, the second electrical terminal and the fourth electrical terminal are electrically coupled to each other, and the first ground terminal and the second ground terminal are electrically coupled to each other.
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Patent Agency Ranking
公开(公告)号：US11196847B2
公开(公告)日：2021-12-07
申请号：US16296701
申请日：2019-03-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seyoung Jang , Chulwoo Park , Dongil Son , Hyeongju Lee
Abstract: An electronic device includes a housing including a first plate including a glass plate, a second plate facing the first plate, and a side surface surrounding a space between the first plate and the second plate, a display positioned inside the space and exposed through a first area of the first plate, an antenna structure at least partially overlapping a second area of the first plate when viewed from above the first plate and which is connected to the second area, and a processor.
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公开(公告)号：US11825639B2
公开(公告)日：2023-11-21
申请号：US17694529
申请日：2022-03-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyelim Yun , Bongkyu Min , Dohoon Kim , Taewoo Kim , Jinyong Park , Jungje Bang , Hyeongju Lee
CPC classification number: H05K9/0032 , H05K1/115 , H05K1/144 , H05K1/181 , H05K7/1427 , H05K2201/10371 , H05K2201/10378
Abstract: An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.
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公开(公告)号：US11558496B2
公开(公告)日：2023-01-17
申请号：US17343825
申请日：2021-06-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seyoung Jang , Chulwoo Park , Dongil Son , Hyeongju Lee
Abstract: An electronic device includes a housing including a first plate including a glass plate, a second plate facing the first plate, and a side surface surrounding a space between the first plate and the second plate, a display positioned inside the space and exposed through a first area of the first plate, an antenna structure at least partially overlapping a second area of the first plate when viewed from above the first plate and which is connected to the second area, and a processor.
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公开(公告)号：US11388277B2
公开(公告)日：2022-07-12
申请号：US16985516
申请日：2020-08-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Taewoo Kim , Dui Kang , Bongkyu Min , Bongchoon Park , Sanghoon Park , Jinyong Park , Hyelim Yun , Hyeongju Lee , Younoh Chi
Abstract: An interposer and an electronic device including an interposer are provided. The interposer includes a multi-conductive member. The multi-conductive member includes an insulation member, a first conductive member that is disposed inside the insulation member and electrically transmits a designated signal or a designated power; and a ground member that surrounds the insulation member.
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10.发明授权公开(公告)号：US10709043B2
公开(公告)日：2020-07-07
申请号：US16575679
申请日：2019-09-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyelim Yun , Bongkyu Min , Dohoon Kim , Taewoo Kim , Jinyong Park , Jungje Bang , Hyeongju Lee
Abstract: Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.
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