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公开(公告)号：US11943862B2
公开(公告)日：2024-03-26
申请号：US17825508
申请日：2022-05-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Bongchoon Park , Taewon Sun , Sangyong Kim , Bosung Choi
CPC classification number: H05K1/0216 , H05K1/0242 , H05K1/111 , H05K1/115 , H05K1/181 , H05K2201/0715 , H05K2201/10037
Abstract: An electronic device is provided. The electronic device includes a board including a first conductive line, a second conductive line, a ground plane, and a conductive via hole connecting the first conductive line and the ground plane, at least one electronic component disposed in the board, an insulation member covering the at least one electronic component, and a conductive layer, the conductive layer includes a first part formed on a surface of the insulation member, a second part extending from an edge of the first part and electrically connected to the first conductive line, and a third part spaced apart from the second part and electrically connected to the second conductive line, and the electronic device includes at least one transmission line constituted by the second conductive line and the third part of the conductive layer.
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公开(公告)号：US11388277B2
公开(公告)日：2022-07-12
申请号：US16985516
申请日：2020-08-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Taewoo Kim , Dui Kang , Bongkyu Min , Bongchoon Park , Sanghoon Park , Jinyong Park , Hyelim Yun , Hyeongju Lee , Younoh Chi
Abstract: An interposer and an electronic device including an interposer are provided. The interposer includes a multi-conductive member. The multi-conductive member includes an insulation member, a first conductive member that is disposed inside the insulation member and electrically transmits a designated signal or a designated power; and a ground member that surrounds the insulation member.
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