公开(公告)号：US11317512B2

公开(公告)日：2022-04-26

申请号：US16883604

申请日：2020-05-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangwon Ha ,  Seyoung Jang ,  Sungjin Kim ,  Sanghoon Park ,  Kyungho Lee ,  Younoh Chi

IPC: H05K1/14 ,  H01L25/065

Abstract: An electronic device is provided that includes a first circuit board including a first electronic component and a second electronic component disposed on a side of the first circuit board, a second circuit board spaced apart from the first circuit board and having a side facing the side of the first circuit board on which the first electronic component and the second electronic component are disposed, a first interposer disposed between the first circuit board and the second circuit board to form an inner space between the first circuit board and the second circuit board, and a second interposer disposed between the first circuit board and the second circuit board to divide the inner space into a first region and a second region, wherein the first electronic component on the first circuit board is disposed corresponding to the first region, and the second electronic component on the first circuit board is disposed corresponding to the second region, and wherein the first interposer and the second interposer electrically connect the first circuit board to the second circuit board.

公开(公告)号：US11388277B2

公开(公告)日：2022-07-12

申请号：US16985516

申请日：2020-08-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taewoo Kim ,  Dui Kang ,  Bongkyu Min ,  Bongchoon Park ,  Sanghoon Park ,  Jinyong Park ,  Hyelim Yun ,  Hyeongju Lee ,  Younoh Chi

IPC: H05K1/02 ,  H04M1/02 ,  H05K1/18 ,  H05K1/11

Abstract: An interposer and an electronic device including an interposer are provided. The interposer includes a multi-conductive member. The multi-conductive member includes an insulation member, a first conductive member that is disposed inside the insulation member and electrically transmits a designated signal or a designated power; and a ground member that surrounds the insulation member.

公开(公告)号：US11856696B2

公开(公告)日：2023-12-26

申请号：US17728363

申请日：2022-04-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangwon Ha ,  Seyoung Jang ,  Sungjin Kim ,  Sanghoon Park ,  Kyungho Lee ,  Younoh Chi

IPC: H05K1/14 ,  H01L25/065

CPC classification number: H05K1/144 ,  H01L25/0657 ,  H05K1/142

Abstract: An electronic device is provided that includes a first circuit board including a first electronic component and a second electronic component disposed on a side of the first circuit board, a second circuit board spaced apart from the first circuit board and having a side facing the side of the first circuit board on which the first electronic component and the second electronic component are disposed, a first interposer disposed between the first circuit board and the second circuit board to form an inner space between the first circuit board and the second circuit board, and a second interposer disposed between the first circuit board and the second circuit board to divide the inner space into a first region and a second region, and wherein the first interposer and the second interposer electrically connect the first circuit board to the second circuit board.

公开(公告)号：US09924616B2

公开(公告)日：2018-03-20

申请号：US14640520

申请日：2015-03-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyunghoon Song ,  Jungje Bang ,  Kwangsub Lee ,  Saebom Lee ,  Seyoung Jang ,  Younoh Chi

IPC: H05K9/00 ,  H05K7/20 ,  H01L23/42 ,  H01L23/552

CPC classification number: H05K7/20445 ,  H01L23/42 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/12044 ,  H05K9/0032 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00

Abstract: A shield can for electromagnetic shielding is provided. The shield can includes a shield cover having a bump protruding laterally therefrom, and a shield frame having a connecting part for selectively fixing the bump at a first height or a second height such that the shield frame is fastened to the shield cover. An electronic device includes a substrate, an internal device mounted on the substrate, and the shield can. The shield cover is located over the internal device, and the shield frame is formed vertically on the substrate to surround the internal device.