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公开(公告)号：US11744017B2
公开(公告)日：2023-08-29
申请号：US16868941
申请日：2020-05-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sangwon Ha , Subyung Kang , Sanghoon Park , Soohyun Seo , Yongjin Woo , Yeomoon Yoon
CPC classification number: H05K1/145 , H05K1/144 , H01L2023/4087 , H05K1/111 , H05K1/117
Abstract: An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in an internal space of the housing and including first conductive terminals, and a second printed circuit board disposed parallel to the first printed circuit board in the internal space and including second conductive terminals electrically connected to the first conductive terminals. The second printed circuit board includes at least some conductive terminals of the second conductive terminals, or at least one connection failure prevention structure disposed around at least some conductive terminals of the second conductive terminals.
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2.发明授权公开(公告)号：US11289790B2
公开(公告)日：2022-03-29
申请号：US17025096
申请日：2020-09-18
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jungmin Park , Chonghwa Seo , Dongil Son , Jongwon Lee , Sangwon Ha
Abstract: An electronic device is provided. The electronic device includes a housing, an antenna module disposed along an inner wall of the housing, and a heat dissipation member disposed inside the housing. The antenna module may include a first circuit board including a plurality of layers, wherein the plurality of layers include a plurality of conductive layers and a plurality of non-conductive layers, and the conductive layer and the non-conductive layer are alternately stacked, at least one integrated circuit mounted on the first circuit board, an antenna array disposed on any one of the plurality of layers and electrically coupled with the at least one integrated circuit, and a heat transfer member including a conductive member extending from any one conductive layer among the plurality of conductive layers and a non-conductive member surrounding, at least in part, the conductive member.
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公开(公告)号：US12171065B2
公开(公告)日：2024-12-17
申请号：US18456153
申请日：2023-08-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sangwon Ha , Subyung Kang , Sanghoon Park , Soohyun Seo , Yongjin Woo , Yeomoon Yoon
Abstract: An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in an internal space of the housing and including first conductive terminals, and a second printed circuit board disposed parallel to the first printed circuit board in the internal space and including second conductive terminals electrically connected to the first conductive terminals. The second printed circuit board includes at least some conductive terminals of the second conductive terminals, or at least one connection failure prevention structure disposed around at least some conductive terminals of the second conductive terminals.
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公开(公告)号：US20240098912A1
公开(公告)日：2024-03-21
申请号：US18373776
申请日：2023-09-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jinhwan JEON , Kwangho Jung , Chihyun Cho , Sangwon Ha
CPC classification number: H05K5/0069 , H05K1/111 , H05K1/181 , H05K3/0044 , H05K3/284 , H05K3/341 , H05K5/0086 , H05K2201/09372 , H05K2201/10007
Abstract: An electronic device includes a housing, a circuit board disposed within the housing, a first component and a second component disposed on one surface of the circuit board, a shielding mold disposed on the one surface of the circuit board to cover top and side surfaces of the first component, and an open structure disposed on the one surface of the circuit board to surround a side surface of the second component. In the open structure, a top portion is opened and exposes a part of the second component or the circuit board, an inner surface is spaced apart from the second component, and an outer surface contacts the shielding mold.
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公开(公告)号：US11690179B2
公开(公告)日：2023-06-27
申请号：US17286519
申请日：2019-10-18
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungchul Park , Sangwon Ha , Chulwoo Park
CPC classification number: H05K3/4046 , H05K1/115 , H05K2201/096
Abstract: A substrate connection member according to various embodiments of the present invention can comprise a printed circuit board which has a plurality of layers that are stacked and which comprises a front surface, a rear surface, and a side surface encompassing the front surface and the rear surface. The printed circuit board can comprise: an opening part which encompasses a partial region of the printed circuit board and which is penetratingly formed from the front surface to the rear surface; at least one bridge connected between the partial region and the printed circuit board by crossing at least a portion of the opening part; and at least one through-hole wire formed in the partial region from the front surface to the rear surface, wherein the inner surface of the opening part and the side surface of the bridge can be formed from a conductive member. Other various embodiments, in addition to the embodiments disclosed in the present invention, are possible.
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Patent Agency Ranking
公开(公告)号：US20230007766A1
公开(公告)日：2023-01-05
申请号：US17825191
申请日：2022-05-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyunmo YANG , Junwhon Uhm , Yonghyun Park , Yongwon Lee , Sangwon Ha
Abstract: An electronic device is provided, which includes a PCB including a first alignment mark formed on a first surface of the PCB, and an RFPCB including a plurality of layers, a rigid portion disposed on the first surface of the PCB, a flexible portion extending from the rigid portion, and a first protrusion formed as one of the plurality of layers protruding and extending from the rigid portion. A second alignment mark corresponding to the first alignment mark of the PCB is defined in the first protrusion. The first protrusion overlaps at least partially with the first alignment mark of the PCB.
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公开(公告)号：US11588496B2
公开(公告)日：2023-02-21
申请号：US16051788
申请日：2018-08-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junhaeng Lee , Seungwon Lee , Sangwon Ha , Wonjo Lee
Abstract: A method of generating a fixed-point quantized neural network includes analyzing a statistical distribution for each channel of floating-point parameter values of feature maps and a kernel for each channel from data of a pre-trained floating-point neural network, determining a fixed-point expression of each of the parameters for each channel statistically covering a distribution range of the floating-point parameter values based on the statistical distribution for each channel, determining fractional lengths of a bias and a weight for each channel among the parameters of the fixed-point expression for each channel based on a result of performing a convolution operation, and generating a fixed-point quantized neural network in which the bias and the weight for each channel have the determined fractional lengths.
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公开(公告)号：US11481608B2
公开(公告)日：2022-10-25
申请号：US16909095
申请日：2020-06-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sangwon Ha , Gunhee Kim , Donghyun Lee
Abstract: A processor-implemented neural network method includes: determining a respective probability density function (PDF) of normalizing a statistical distribution of parameter values, for each channel of each of a plurality of feature maps of a pre-trained neural network; determining, for each channel, a corresponding first quantization range for performing quantization of corresponding parameter values, based on a quantization error and a quantization noise of the respective determined PDF; determining, for each channel, a corresponding second quantization range, based on a signal-to-quantization noise ratio (SQNR) of the respective determined PDF; correcting, for each channel, the corresponding first quantization range based on the corresponding second quantization range; and generating a quantized neural network, based on the corrected first quantization range corresponding for each channel.
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公开(公告)号：US12041717B2
公开(公告)日：2024-07-16
申请号：US17825191
申请日：2022-05-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyunmo Yang , Junwhon Uhm , Yonghyun Park , Yongwon Lee , Sangwon Ha
CPC classification number: H05K1/028 , H05K1/0216 , H05K1/0266 , H05K1/115 , H05K2201/0154
Abstract: An electronic device is provided, which includes a PCB including a first alignment mark formed on a first surface of the PCB, and an RFPCB including a plurality of layers, a rigid portion disposed on the first surface of the PCB, a flexible portion extending from the rigid portion, and a first protrusion formed as one of the plurality of layers protruding and extending from the rigid portion. A second alignment mark corresponding to the first alignment mark of the PCB is defined in the first protrusion. The first protrusion overlaps at least partially with the first alignment mark of the PCB.
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公开(公告)号：US11856696B2
公开(公告)日：2023-12-26
申请号：US17728363
申请日：2022-04-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sangwon Ha , Seyoung Jang , Sungjin Kim , Sanghoon Park , Kyungho Lee , Younoh Chi
IPC: H05K1/14 , H01L25/065
CPC classification number: H05K1/144 , H01L25/0657 , H05K1/142
Abstract: An electronic device is provided that includes a first circuit board including a first electronic component and a second electronic component disposed on a side of the first circuit board, a second circuit board spaced apart from the first circuit board and having a side facing the side of the first circuit board on which the first electronic component and the second electronic component are disposed, a first interposer disposed between the first circuit board and the second circuit board to form an inner space between the first circuit board and the second circuit board, and a second interposer disposed between the first circuit board and the second circuit board to divide the inner space into a first region and a second region, and wherein the first interposer and the second interposer electrically connect the first circuit board to the second circuit board.
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