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公开(公告)号：US11317512B2
公开(公告)日：2022-04-26
申请号：US16883604
申请日：2020-05-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sangwon Ha , Seyoung Jang , Sungjin Kim , Sanghoon Park , Kyungho Lee , Younoh Chi
IPC: H05K1/14 , H01L25/065
Abstract: An electronic device is provided that includes a first circuit board including a first electronic component and a second electronic component disposed on a side of the first circuit board, a second circuit board spaced apart from the first circuit board and having a side facing the side of the first circuit board on which the first electronic component and the second electronic component are disposed, a first interposer disposed between the first circuit board and the second circuit board to form an inner space between the first circuit board and the second circuit board, and a second interposer disposed between the first circuit board and the second circuit board to divide the inner space into a first region and a second region, wherein the first electronic component on the first circuit board is disposed corresponding to the first region, and the second electronic component on the first circuit board is disposed corresponding to the second region, and wherein the first interposer and the second interposer electrically connect the first circuit board to the second circuit board.
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公开(公告)号：US12171065B2
公开(公告)日：2024-12-17
申请号：US18456153
申请日：2023-08-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sangwon Ha , Subyung Kang , Sanghoon Park , Soohyun Seo , Yongjin Woo , Yeomoon Yoon
Abstract: An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in an internal space of the housing and including first conductive terminals, and a second printed circuit board disposed parallel to the first printed circuit board in the internal space and including second conductive terminals electrically connected to the first conductive terminals. The second printed circuit board includes at least some conductive terminals of the second conductive terminals, or at least one connection failure prevention structure disposed around at least some conductive terminals of the second conductive terminals.
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公开(公告)号：US12009579B2
公开(公告)日：2024-06-11
申请号：US18208349
申请日：2023-06-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sanghoon Park , Juneseok Lee , Dohyuk Ha , Jungyub Lee , Jinsu Heo , Youngju Lee
CPC classification number: H01Q1/246 , H01Q1/1271 , H01Q1/42 , H01Q21/064 , H01Q21/065 , H01Q21/245
Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. Disclosed is a cover device configured to protect an antenna device embedded in an electronic device to radiate a beam of an ultra-high frequency band, the cover device including: a cover frame including a window area corresponding to a radiation area of the antenna device; and a functional structure disposed in the window area on the cover frame and having a stacked structure comprising one or more functional layers.
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公开(公告)号：US11677138B2
公开(公告)日：2023-06-13
申请号：US17108157
申请日：2020-12-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sanghoon Park , Juneseok Lee , Dohyuk Ha , Jungyub Lee , Jinsu Heo , Youngju Lee
CPC classification number: H01Q1/246 , H01Q1/1271 , H01Q1/42 , H01Q21/064 , H01Q21/065 , H01Q21/245
Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. Disclosed is a cover device configured to protect an antenna device embedded in an electronic device to radiate a beam of an ultra-high frequency band, the cover device including: a cover frame including a window area corresponding to a radiation area of the antenna device; and a functional structure disposed in the window area on the cover frame and having a stacked structure comprising one or more functional layers.
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5.发明授权公开(公告)号：US12183969B2
公开(公告)日：2024-12-31
申请号：US17786870
申请日：2020-12-15
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sanghoon Park , Juneseok Lee , Dohyuk Ha , Jinsu Heo , Youngju Lee
Abstract: The present disclosure relates to a communication technique for converging, with IoT technology, a 5G communication system for supporting a higher data transfer rate beyond the 4G system, and a system therefor. The present disclosure may be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, healthcare, digital education, retail businesses, security- and safety-related services, etc.) on the basis of 5G communication technology and IoT-related technology. Disclosed is a cover device for protecting an antenna device which is mounted in an electronic device to radiate a beam in an ultrahigh-frequency band, the cover device comprising: a cover frame including an open window region corresponding to a radiation region of the antenna device; and a thickness compensation structure disposed in the window region on the cover frame and having a different thickness according to the frequency band of the beam radiated from the antenna device.
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Patent Agency Ranking
公开(公告)号：US12022614B2
公开(公告)日：2024-06-25
申请号：US17487673
申请日：2021-09-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Bongkyu Min , Taewoo Kim , Jinyong Park , Hyelim Yun , Hyeongju Lee , Sanghoon Park , Jiseon Han
IPC: H05K1/00 , H01L23/528 , H04M1/02 , H05K1/11 , H05K1/14
CPC classification number: H05K1/141 , H01L23/528 , H04M1/0277 , H05K1/111 , H05K1/115 , H05K1/144 , H05K2201/10378
Abstract: The disclosure relates to an electronic device including an interposer. The interposer includes a substrate and a plurality of connecting structures disposed on the substrate and electrically connecting a first circuit board and a second circuit board disposed in the electronic device. The plurality of connecting structures includes a plurality of via holes formed in the substrate, a plurality of conductive members disposed in the plurality of via holes, an insulating member disposed between the plurality of conductive members, and a plurality of pads disposed on the outer periphery of the plurality of conductive members. The plurality of conductive members may be separately disposed on the substrate to electrically connect with the first and second circuit boards.
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公开(公告)号：US12300898B2
公开(公告)日：2025-05-13
申请号：US18192910
申请日：2023-03-30
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sanghoon Park , Kwanghyun Baek , Juneseok Lee , Dohyuk Ha , Jungho Park , Youngju Lee , Jungyub Lee , Jinsu Heo
Abstract: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate than a 4th generation (4G) communication system such as long term evolution (LTE). An antenna module is provided. The antenna module includes a plurality of antennas, a first printed circuit board (PCB) on which the plurality of antennas are disposed, a second PCB on which one or more elements for processing a radio frequency (RF) signal are disposed, and an adhesive material for bonding the first PCB and the second PCB, wherein the first PCB includes a first metal layer, a second metal layer, a dielectric, and a coupling structure plated along the first metal layer, the second metal layer, and a via hole between the first metal layer and the second metal layer, and may be disposed to provide a coupling connection through the coupling structure of the first PCB.
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公开(公告)号：US12218407B2
公开(公告)日：2025-02-04
申请号：US17946688
申请日：2022-09-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Juneseok Lee , Youngsub Kim , Sanghoon Park , Jungho Park , Kwanghyun Baek , Youngju Lee , Jungyub Lee , Dohyuk Ha , Jinsu Heo
Abstract: The disclosure relates to a pre-5th-Generation (5G) or 5G communication system for supporting higher data rates Beyond 4th-Generation (4G) communication system, such as long term evolution (LTE). An antenna device is provided. The antenna device includes a first printed circuit board (PCB), a second PCB for a plurality of antenna elements, and a radio frequency integrated circuit (RFIC) coupled through a first surface of the first PCB. The second PCB may include a radio frequency (RF) routing layer including RF lines for the respective plurality of antenna elements. The first PCB may include a feeding structure for connecting the RF routing layer and the RFIC. The second PCB may be electrically connected to a second surface of the first PCB opposite to the first surface of the first PCB, through a first surface of the second PCB. The second PCB may be coupled to the plurality of antenna elements.
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公开(公告)号：US11856696B2
公开(公告)日：2023-12-26
申请号：US17728363
申请日：2022-04-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sangwon Ha , Seyoung Jang , Sungjin Kim , Sanghoon Park , Kyungho Lee , Younoh Chi
IPC: H05K1/14 , H01L25/065
CPC classification number: H05K1/144 , H01L25/0657 , H05K1/142
Abstract: An electronic device is provided that includes a first circuit board including a first electronic component and a second electronic component disposed on a side of the first circuit board, a second circuit board spaced apart from the first circuit board and having a side facing the side of the first circuit board on which the first electronic component and the second electronic component are disposed, a first interposer disposed between the first circuit board and the second circuit board to form an inner space between the first circuit board and the second circuit board, and a second interposer disposed between the first circuit board and the second circuit board to divide the inner space into a first region and a second region, and wherein the first interposer and the second interposer electrically connect the first circuit board to the second circuit board.
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公开(公告)号：US12160047B2
公开(公告)日：2024-12-03
申请号：US18152311
申请日：2023-01-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sanghoon Park , Jungho Park , Kwanghyun Baek , Youngju Lee , Jungyub Lee , Juneseok Lee , Dohyuk Ha , Jinsu Heo
Abstract: An antenna assembly is provided. The antenna assembly includes a first flexible printed circuit board (FPCB) for multiple first antennas, a second flexible printed circuit board (FPCB) for multiple second antennas, a metal plate including multiple holes, a first adhesive material layer for bonding between the metal plate and the first FPCB, and a second adhesive material layer for bonding between the metal plate and the second FPCB, wherein the metal plate is disposed such that the multiple first antennas are located in the multiple holes, respectively and the multiple second antennas to be located in the multiple holes, respectively.
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