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    Semiconductor package including semiconductor chips stacked via conductive bumps
    2.
    发明授权
    Semiconductor package including semiconductor chips stacked via conductive bumps 有权

    公开(公告)号：US12272661B2

    公开(公告)日：2025-04-08

    申请号：US17564689

    申请日：2021-12-29

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Eunsu Lee ,  Dongho Kim ,  Jiyong Park ,  Jeonghyun Lee

    IPC: H01L23/00 ,  H01L23/48 ,  H01L25/065

    Abstract: A semiconductor package includes a first semiconductor chip including a first bonding pad on a first surface of a first substrate, a first through electrode penetrating through the first substrate and electrically connected to the first bonding pad, a first recess with a desired depth in the first substrate from a second surface of the first substrate and exposing an end portion of the first through electrode, and a second bonding pad in the first recess and electrically connected to the first through electrode, a second semiconductor chip stacked on the second surface of the first substrate and including a third bonding pad on a third surface of a second substrate, and a conductive connection member between the second bonding pad and the third bonding pad. At least a portion of the conductive connection member may be in the first recess.

    Semiconductor device having package on package structure and method of manufacturing the semiconductor device
    7.
    发明授权
    Semiconductor device having package on package structure and method of manufacturing the semiconductor device 有权

    公开(公告)号：US12261157B2

    公开(公告)日：2025-03-25

    申请号：US18372846

    申请日：2023-09-26

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jeonghyun Lee ,  Jihwang Kim ,  Jongbo Shim

    IPC: H01L25/10 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

    Abstract: A semiconductor device having a package on package (PoP) structure, in which a fine pitch between package substrates is implemented, a total height of a package is reduced, and reliability is enhanced. The semiconductor package includes a first package substrate including a first body layer and a first passivation layer, a first semiconductor chip on the first package substrate, a second package substrate on the first package substrate, the second package substrate including a second body layer and a second passivation layer, a first connection member on the first package substrate outside the first semiconductor chip, and a gap filler filled between the first package substrate and the second package substrate, wherein the first package substrate includes a first trench, the second package substrate includes a second trench, and the first semiconductor chip is disposed between the first trench and the second trench.

    Refrigerator
    10.
    发明授权
    Refrigerator 有权

    公开(公告)号：US11359856B2

    公开(公告)日：2022-06-14

    申请号：US16876685

    申请日：2020-05-18

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Chanbin Park ,  Yang-Yeol Gu ,  Jaejin Lee ,  Jeonghyun Lee

    IPC: F25D23/02 ,  E05B65/00

    Abstract: A refrigerator with an enhanced door includes a main body including a storeroom, first and second doors pivotally coupled to the main body to open or close the storeroom and a pivot bar pivotally installed at the first door. The pivot bar is movable between a first position between the first and second doors and a second position pivoted toward the first door to prevent cold air leaks from the storeroom. A locking device separably locks the pivot bar to the first door when the pivot bar is in the second position.

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