公开(公告)号：US20140291821A1

公开(公告)日：2014-10-02

申请号：US14304016

申请日：2014-06-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In-sang SONG

IPC: H01L23/58 ,  H01L23/552

CPC classification number: H01L23/585 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/552 ,  H01L24/06 ,  H01L24/16 ,  H01L24/24 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06051 ,  H01L2224/06135 ,  H01L2224/06155 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24011 ,  H01L2224/24227 ,  H01L2224/29099 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/9222 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/078 ,  H01L2224/85 ,  H01L2224/82 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor package and method of manufacture are provided. The semiconductor package may include a package substrate, a semiconductor chip, a molding member and a grounding member. The package substrate may include a ground pad and a signal pad. The semiconductor chip may be arranged on an upper surface of the package substrate. The semiconductor chip may be electrically connected with the signal pad of the package substrate. The molding member may be formed on the upper surface of the package substrate to cover the semiconductor chip. The grounding member may be arranged on a surface of the molding member. The grounding member may be electrically connected with the ground pad.

Abstract translation: 提供半导体封装和制造方法。 半导体封装可以包括封装衬底，半导体芯片，模制构件和接地构件。 封装衬底可以包括接地焊盘和信号焊盘。 半导体芯片可以布置在封装衬底的上表面上。 半导体芯片可以与封装衬底的信号焊盘电连接。 模制构件可以形成在封装衬底的上表面上以覆盖半导体芯片。 接地构件可以布置在模制构件的表面上。 接地构件可以与接地垫电连接。

公开(公告)号：US20150102506A1

公开(公告)日：2015-04-16

申请号：US14511149

申请日：2014-10-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： In-sang SONG ,  In-Ku KANG ,  Joon-hee LEE ,  Kyung-man KIM

IPC: H01L25/10

CPC classification number: H01L25/105 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/60 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0235 ,  H01L2224/02379 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05008 ,  H01L2224/05012 ,  H01L2224/05548 ,  H01L2224/05558 ,  H01L2224/05564 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/06135 ,  H01L2224/29034 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/454 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48148 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/4866 ,  H01L2224/48666 ,  H01L2224/48681 ,  H01L2224/48684 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/4876 ,  H01L2224/48766 ,  H01L2224/48781 ,  H01L2224/48784 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/4886 ,  H01L2224/48866 ,  H01L2224/48881 ,  H01L2224/48884 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83365 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/8546 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/10333 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/14511 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The semiconductor package includes: a package substrate comprising a bonding pad; a plurality of semiconductor chips stacked on the package substrate; and a bonding wire configured to electrically connect the semiconductor chips and the bonding pad. For at least one of the plurality of semiconductor chips: the semiconductor chip comprises: a semiconductor device; a first pad electrically connected to the semiconductor device; a conductive pattern; and a second pad electrically connected to the first pad, spaced apart from the conductive pattern, and extending over the conductive pattern; and the bonding wire is connected to the second pad.

Abstract translation: 半导体封装包括：封装衬底，其包括焊盘; 堆叠在所述封装基板上的多个半导体芯片; 以及被配置为电连接半导体芯片和接合焊盘的接合线。 对于所述多个半导体芯片中的至少一个半导体芯片，所述半导体芯片包括：半导体器件; 电连接到所述半导体器件的第一焊盘; 导电图案; 以及第二焊盘，其电连接到所述第一焊盘，与所述导电图案间隔开并且延伸穿过所述导电图案; 并且接合线连接到第二焊盘。

公开(公告)号：US20140312993A1

公开(公告)日：2014-10-23

申请号：US14327151

申请日：2014-07-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kuang-woo NAM ,  In-sang SONG ,  Chul-soo KIM ,  Yun-kwon PARK ,  Eun-seok PARK

IPC: H03H9/46 ,  H03H9/54 ,  H03H9/64

CPC classification number: H03H9/46 ,  H03H3/02 ,  H03H3/08 ,  H03H9/105 ,  H03H9/1092 ,  H03H9/54 ,  H03H9/64 ,  H03H9/703 ,  H03H9/706 ,  H03H9/72 ,  H03H9/725 ,  H03H2003/0071 ,  Y10T29/42

Abstract: A method of fabricating a multi-band filter module is provided. The method includes forming a Film Bulk Acoustic Resonator (FBAR) on a piezoelectric substrate by forming a resonant part on the piezoelectric substrate and then an air gap recessed on a surface of the piezoelectric substrate and positioned under the resonant part; and forming a Surface Acoustic Wave (SAW) device on the piezoelectric substrate in which the steps of forming the FBAR and the SAW are concurrently performed.

Abstract translation: 提供一种制造多频带滤波器模块的方法。 该方法包括通过在压电基片上形成共振部分，然后形成凹陷在压电基片的表面上且位于谐振部分下方的气隙，在压电基片上形成薄膜体声波谐振器（FBAR）; 并在压电基板上形成表面声波（SAW）器件，其中形成FBAR和SAW的步骤同时进行。