公开(公告)号：US11739183B2

公开(公告)日：2023-08-29

申请号：US16919353

申请日：2020-07-02

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： Hyunjeong Jeon ,  Sang Soo Jee ,  Kyeong-sik Ju

IPC: C08G73/14 ,  C08G73/10 ,  C09D179/08 ,  C08J5/18 ,  C08G18/60 ,  C08G18/76 ,  C08G18/73 ,  C08G18/64 ,  C08G18/75 ,  G02F1/1333

CPC classification number: C08G73/14 ,  C08G18/603 ,  C08G18/6438 ,  C08G18/73 ,  C08G18/755 ,  C08G18/7621 ,  C08G73/1035 ,  C08J5/18 ,  C09D179/08 ,  G02F1/133308 ,  C08G2150/00 ,  C08J2379/08 ,  G02F1/133305 ,  G02F1/133331

Abstract: A poly(amide-imide) copolymer including an amide structural unit having an amide bond in a polymer main chain and an imide structural unit having an imide bond in a polymer main chain, wherein at least one imide structural unit includes a moiety cross-linked to an adjacent polymer main chain through an amide bond.

公开(公告)号：US10738164B2

公开(公告)日：2020-08-11

申请号：US15847063

申请日：2017-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： Hyunjeong Jeon ,  Sang Soo Jee ,  Kyeong-sik Ju

IPC: C08G73/14 ,  C09D179/08 ,  C08J5/18 ,  C08G73/10 ,  C08G18/60 ,  C08G18/76 ,  C08G18/73 ,  C08G18/64 ,  C08G18/75 ,  G02F1/1333

Abstract: A poly(amide-imide) copolymer including an amide structural unit having an amide bond in a polymer main chain and an imide structural unit having an imide bond in a polymer main chain, wherein at least one imide structural unit includes a moiety cross-linked to an adjacent polymer main chain through an amide bond.

公开(公告)号：US10809421B2

公开(公告)日：2020-10-20

申请号：US15714436

申请日：2017-09-25

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Samsung SDI Co., Ltd.

Inventor： Sun Jin Song ,  Sang Soo Jee ,  Boreum Jeong ,  Hyunjeong Jeon ,  Chanjae Ahn

IPC: G02B1/14 ,  C08G73/14 ,  C08G69/32 ,  C08G73/10 ,  C08G69/42 ,  C08G69/26 ,  C08G69/40 ,  C09D179/08 ,  C08J5/18 ,  C08J7/04 ,  G02B1/04 ,  G02F1/1333 ,  G02B5/20

Abstract: A stacked transparent film includes a polymer film including at least one of an amide structural unit and an imide structural unit, wherein the polymer film has a refractive index of about 1.65 to about 1.75 at a 550 nanometer wavelength and an elastic modulus of greater than or equal to about 5.5 gigapascals; and at least one of a first coating layer on a first side of the polymer film and a second coating layer on a side opposite the first side of the polymer film.

公开(公告)号：US10100153B2

公开(公告)日：2018-10-16

申请号：US15291603

申请日：2016-10-12

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Samsung SDI Co., Ltd.

Inventor： Sang Soo Jee ,  Hyunjeong Jeon ,  Sungwon Choi ,  Byunghee Sohn ,  Kyeong-sik Ju

IPC: C08G73/00 ,  C08G73/14 ,  C08G73/10 ,  C08J5/18

Abstract: A poly(imide-amide) copolymer includes: an imide structural unit which is a reaction product of a first diamine and a dianhydride, and an amide structural unit which is a reaction product of a second diamine and a diacyl halide, wherein each of the first diamine and the second diamine includes 2,2′-bis-trifluoromethyl-4,4′-biphenyldiamine, and at least one of the first diamine and the second diamine further includes a compound represented by Chemical Formula 1, wherein the dianhydride includes 3,3′,4,4′-biphenyltetracarboxylic dianhydride and 4,4′-hexafluoroisopropylidene diphthalic anhydride, wherein the diacyl halide includes terephthaloyl chloride (TPCl), and wherein an amount of the compound represented by Chemical Formula 1 is less than or equal to about 10 mole percent based on the total amount of the first diamine and the second diamine: NH2-A-NH2  Chemical Formula 1 wherein in Chemical Formula 1, A is the same as described in the detailed description.

公开(公告)号：US20230364537A1

公开(公告)日：2023-11-16

申请号：US18123628

申请日：2023-03-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyungtae SEO ,  Hyun Do Choi ,  Hyunjeong Jeon ,  Joon-Kee Cho ,  Jun-Won Jang ,  Wooram Hong ,  Jeonghun Kim ,  Won Je Choi

IPC: B01D37/04 ,  B01D27/10 ,  B01D35/157

CPC classification number: B01D37/041 ,  B01D27/108 ,  B01D35/1573 ,  B01D37/046 ,  B01D2201/165 ,  B01D2201/295 ,  B01D2201/4061

Abstract: A batch-type filtering apparatus includes: a first flow path; a second flow path configured to communicate with the first flow path; a third flow path configured to communicate with the first flow path; a fourth flow path configured to communicate with each of the second flow path and the third flow path; an external port configured to communicate with each of the third flow path and the fourth flow path; a first direction switching valve configured to allow at least two from among the first flow path, the second flow path, and the third flow path to communicate with each other; a second direction switching valve configured to allow at least two from among the third flow path, the fourth flow path, and the external port to communicate with each other; and a flow cell.

公开(公告)号：US20230089079A1

公开(公告)日：2023-03-23

申请号：US17688418

申请日：2022-03-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wooram HONG ,  Hyun Do Choi ,  Dal Heo ,  Youngchun Kwon ,  Hyukju Kwon ,  Gahee Kim ,  Bosung Kim ,  Jeonghun Kim ,  Jin Woo Kim ,  Min Sik Park ,  Youngjin Park ,  Hyungtae Seo ,  Won Seok Oh ,  Dongseon Lee ,  Sangyoon Lee ,  Jaejun Chang ,  Jun-Woon Jang ,  Hyunjeong Jeon ,  Joon-Kee Cho ,  Byung-Kwon Choi ,  Won Je Choi ,  Younsuk Choi ,  Taesin Ha

IPC: B65D51/00 ,  B65D51/20

Abstract: A sealing structure may include a lid including a first lid face, a second lid face opposite to the first lid face, and a fragile area between the first lid face and the second lid face, a cover including a first cover face facing the second lid face and covering the fragile area and a second cover face opposite to the first cover face, wherein a first distance between the second lid face and the first cover face is substantially equal to or less than a second distance between the first cover face and the second cover face, and a connector configured to connect the lid and the cover.

公开(公告)号：US10508175B2

公开(公告)日：2019-12-17

申请号：US15720992

申请日：2017-09-29

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SAMSUNG SDI CO., LTD.

Inventor： Sungwon Choi ,  Chanjae Ahn ,  Hyunjeong Jeon ,  Sang Soo Jee ,  Byunghee Sohn ,  Won Suk Chang

IPC: C08G77/445 ,  C08G77/455 ,  C08G77/04 ,  C08L83/12 ,  C08G73/14 ,  C08G73/10 ,  C08L79/08 ,  C09D179/08 ,  C08G77/00 ,  C08G77/16 ,  C08G77/18

Abstract: A composition including a polyamideimide precursor modified with an alkoxysilane group and an oligosilica compound, wherein the oligosilica compound is a condensation reaction product of an organosilane diol and an alkoxysilane compound.

公开(公告)号：US10240002B2

公开(公告)日：2019-03-26

申请号：US15346876

申请日：2016-11-09

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Samsung SDI Co., Ltd.

Inventor： Hongkyoon Choi ,  Chanjae Ahn ,  Hyunjeong Jeon ,  Sang Soo Jee ,  Sungwon Choi ,  Sung Woo Hong ,  Byunghee Sohn

IPC: C08G73/14 ,  B32B27/00 ,  C09D179/08 ,  C09J179/08 ,  C08G73/10

Abstract: A poly(imide-amide) copolymer including a structural unit represented by Chemical Formula 1; a structural unit represented by Chemical Formula 2; and any one of a structural unit represented by Chemical Formula 3, an amic acid precursor of the structural unit represented by Chemical Formula 3, and a combination thereof; wherein a cured material of the poly(imide-amide) copolymer may have a tensile modulus of greater than or equal to about 5.5 GPa, and a yellowness index of less than or equal to about 5: wherein, groups and variables in Chemical Formulae 1 and 3 are the same as described in the specification.

公开(公告)号：US09975997B2

公开(公告)日：2018-05-22

申请号：US15081468

申请日：2016-03-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjeong Jeon ,  Min Sang Kim ,  Sang Soo Jee ,  Byunghee Sohn

IPC: C08G77/455 ,  C08G73/10 ,  C08G73/14 ,  C08G77/00 ,  C08L79/08

CPC classification number: C08G73/106 ,  C08G73/10 ,  C08G73/1007 ,  C08G73/1017 ,  C08G73/1039 ,  C08G73/1067 ,  C08G73/14 ,  C08G77/455 ,  C08G77/80 ,  C08L79/08 ,  C08L83/04

Abstract: A composition including a polyamic acid modified with an alkoxysilane group; and an oligo silica compound, wherein the polyamic acid modified with an alkoxysilane group includes a reaction product of (i) a condensation reaction product of an acid anhydride and a diamine, and (ii) a reactive organosilane compound, wherein the oligo silica compound includes a condensation reaction product of an organosilane diol and a an alkoxysilane compound, wherein an amount of silicon atoms in the composition is less than or equal to about 15 wt % based on a total weight of solid contents in the composition.

公开(公告)号：US12145782B2

公开(公告)日：2024-11-19

申请号：US17688418

申请日：2022-03-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wooram Hong ,  Hyun Do Choi ,  Dal Heo ,  Youngchun Kwon ,  Hyukju Kwon ,  Gahee Kim ,  Bosung Kim ,  Jeonghun Kim ,  Jin Woo Kim ,  Min Sik Park ,  Youngjin Park ,  Hyungtae Seo ,  Won Seok Oh ,  Dongseon Lee ,  Sangyoon Lee ,  Jaejun Chang ,  Jun-Won Jang ,  Hyunjeong Jeon ,  Joon-Kee Cho ,  Byung-Kwon Choi ,  Won Je Choi ,  Younsuk Choi ,  Taesin Ha

IPC: B65D51/00 ,  B65D51/20

Abstract: A sealing structure may include a lid including a first lid face, a second lid face opposite to the first lid face, and a fragile area between the first lid face and the second lid face, a cover including a first cover face facing the second lid face and covering the fragile area and a second cover face opposite to the first cover face, wherein a first distance between the second lid face and the first cover face is substantially equal to or less than a second distance between the first cover face and the second cover face, and a connector configured to connect the lid and the cover.