公开(公告)号：US20230089079A1

公开(公告)日：2023-03-23

申请号：US17688418

申请日：2022-03-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wooram HONG ,  Hyun Do Choi ,  Dal Heo ,  Youngchun Kwon ,  Hyukju Kwon ,  Gahee Kim ,  Bosung Kim ,  Jeonghun Kim ,  Jin Woo Kim ,  Min Sik Park ,  Youngjin Park ,  Hyungtae Seo ,  Won Seok Oh ,  Dongseon Lee ,  Sangyoon Lee ,  Jaejun Chang ,  Jun-Woon Jang ,  Hyunjeong Jeon ,  Joon-Kee Cho ,  Byung-Kwon Choi ,  Won Je Choi ,  Younsuk Choi ,  Taesin Ha

IPC: B65D51/00 ,  B65D51/20

Abstract: A sealing structure may include a lid including a first lid face, a second lid face opposite to the first lid face, and a fragile area between the first lid face and the second lid face, a cover including a first cover face facing the second lid face and covering the fragile area and a second cover face opposite to the first cover face, wherein a first distance between the second lid face and the first cover face is substantially equal to or less than a second distance between the first cover face and the second cover face, and a connector configured to connect the lid and the cover.