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    METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICES USING MOIRÉ PATTERNS
    7.
    发明公开
    METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICES USING MOIRÉ PATTERNS 审中-公开

    公开(公告)号：US20230152715A1

    公开(公告)日：2023-05-18

    申请号：US17982761

    申请日：2022-11-08

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Woohyeok Jeong ,  Donghwan Kim ,  Inchul Shin ,  Wonhyeok Jo ,  Hyein Cho ,  Seulgi Han

    IPC: G03F7/20 ,  G01N21/95 ,  H01L23/544

    CPC classification number: G03F7/70633 ,  G01N21/9501 ,  G03F7/70216 ,  G03F7/70683 ,  H01L23/544 ,  G02B27/60

    Abstract: A method for manufacturing a semiconductor device may include: forming a first layer comprising a plurality of patterns, each pattern having a different respective pitch; performing exposure and development to form a second layer at a layer different from the first layer; determining whether a pitch shift of a part of exposure patterns formed is within a tolerance range, using a Moire pattern; and performing etching for the second layer when the pitch shift of the part of exposure patterns is determined to be within the tolerance range. Performing the exposure and the development may include forming a first exposure pattern corresponding to a key pattern having a first pitch, forming a second exposure pattern corresponding to a cell pattern having a second pitch, and forming a third exposure pattern corresponding to a middle pitch pattern having a third pitch between the first pitch and the second pitch.

    Antenna and electronic device comprising same
    8.
    发明授权
    Antenna and electronic device comprising same 有权

    公开(公告)号：US11522271B2

    公开(公告)日：2022-12-06

    申请号：US17058538

    申请日：2019-05-21

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jaehyung Kim ,  Donghwan Kim ,  Taegyu Kim ,  Minseok Park ,  Changha Yu ,  Jiyeon Yun ,  Bumjin Cho ,  Donguk Choi

    IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q1/44 ,  H04B1/40

    Abstract: According to various embodiments, an electronic device may comprise: a housing comprising a front plate, a rear plate facing in the opposite direction to the front plate, and a side surface member surrounding the space between the front plate and the rear plate, the side surface member comprising a first side surface extending in a first direction and having a first length, a second side surface extending in a second direction perpendicular to the first direction and having a second length larger than the first length, a third side surface extending in parallel with the first side surface and having the first length, and a fourth side surface extending in parallel with the second side surface and having the second length; a display arranged between the front plate and the rear plate, at least a partial area of the display being exposed through the front plate, the display comprising a conductive plate; a printed circuit board arranged between the display and the rear plate, the printed circuit hoard comprising at least one conductive layer, the conductive plate and the conductive layer being electrically connected to each other; a first conductive pattern arranged between the printed circuit board and the rear plate; a second conductive pattern arranged between the printed circuit board and the front plate and, when seen from above the front plate, between the first side surface of the side surface member and the conductive plate; and a wireless communication circuit electrically connected to the first conductive pattern and the second conductive pattern and configured to transmit and/or receive a signal having a designated frequency. Various other embodiments may be possible.

    LED transfer method and display module manufactured thereby
    9.
    发明授权
    LED transfer method and display module manufactured thereby 有权

    公开(公告)号：US11515294B2

    公开(公告)日：2022-11-29

    申请号：US16891242

    申请日：2020-06-03

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Ohjae Kwon ,  Jinmo Kang ,  Donghwan Kim ,  Yong Namkung ,  Seondeok Hwang

    IPC: H01L21/00 ,  H01L25/075 ,  H01L25/16

    Abstract: A micro light emitting diode (LED) transfer method includes: preparing a transfer substrate including a plurality of micro LEDs, the plurality of micro LEDs having electrodes disposed in a first direction and a second direction different from the first direction on the transfer substrate; sequentially transferring a first set of micro LEDs among the plurality of micro LEDs in block units from the transfer substrate to first regions of a target substrate; and sequentially transferring a second set of micro LEDs among the plurality of micro LEDs in block units from the transfer substrate to second regions of the target substrate, and in the sequential transferring of the second set of micro LEDs, the second set of micro LEDs transferred to the second regions are disposed in the same electrode direction as an electrode direction of the first set of micro LEDs transferred to the first regions.

    Electronic device with metal frame antenna
    10.
    发明授权
    Electronic device with metal frame antenna 有权

    公开(公告)号：US11477310B2

    公开(公告)日：2022-10-18

    申请号：US17393016

    申请日：2021-08-03

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jaehyung Kim ,  Jinkyu Bang ,  Jinu Kim ,  Donghwan Kim ,  Taegyu Kim ,  Kiyoung Chang

    IPC: H04B1/38 ,  H04M1/02 ,  H01Q9/30 ,  H01Q5/385 ,  H01Q1/24

    Abstract: An electronic device is provided. The electronic device includes a housing and a connection part. The housing includes a first housing portion that includes a first side face, and a second housing portion that includes a second side face. The connection part connects the first housing portion and the second housing portion. A first conductive member extends along at least a portion of the first side face, a first non-conductive member is disposed on the first side face, a second conductive member extends along at least a portion of the second side face, a second non-conductive member is disposed on the second side face, and when the second housing portion faces the first housing portion, the first non-conductive member and the second non-conductive member are substantially aligned.

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