公开(公告)号：US11652196B2

公开(公告)日：2023-05-16

申请号：US17024833

申请日：2020-09-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myunghee Kim ,  Donghwan Kim ,  Sungwook Kim ,  Yong Namkung ,  Jenghun Suh ,  Jaephil Shim

IPC: H01L33/62 ,  H01L33/00 ,  H01L23/00 ,  H01L25/075 ,  H01L33/40 ,  H01L33/42 ,  H01L33/44 ,  H01L33/58

CPC classification number: H01L33/62 ,  H01L24/29 ,  H01L24/83 ,  H01L25/0753 ,  H01L33/0093 ,  H01L33/405 ,  H01L33/42 ,  H01L33/44 ,  H01L33/58 ,  H01L2224/29239 ,  H01L2224/29244 ,  H01L2224/29255 ,  H01L2224/29263 ,  H01L2224/29269 ,  H01L2224/29287 ,  H01L2224/29293 ,  H01L2224/83894 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A display module and a manufacturing method thereof are provided. The manufacturing method may include forming an epitaxial film comprising a light emitting layer, a first type semiconductor layer, and a second type semiconductor layer, attaching the epitaxial film to an intermediate substrate comprising a conductive material, patterning the epitaxial film to form a light emitting diode (LED) and coupling the LED to a driving circuit layer through the conductive material.

公开(公告)号：US11515294B2

公开(公告)日：2022-11-29

申请号：US16891242

申请日：2020-06-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ohjae Kwon ,  Jinmo Kang ,  Donghwan Kim ,  Yong Namkung ,  Seondeok Hwang

IPC: H01L21/00 ,  H01L25/075 ,  H01L25/16

Abstract: A micro light emitting diode (LED) transfer method includes: preparing a transfer substrate including a plurality of micro LEDs, the plurality of micro LEDs having electrodes disposed in a first direction and a second direction different from the first direction on the transfer substrate; sequentially transferring a first set of micro LEDs among the plurality of micro LEDs in block units from the transfer substrate to first regions of a target substrate; and sequentially transferring a second set of micro LEDs among the plurality of micro LEDs in block units from the transfer substrate to second regions of the target substrate, and in the sequential transferring of the second set of micro LEDs, the second set of micro LEDs transferred to the second regions are disposed in the same electrode direction as an electrode direction of the first set of micro LEDs transferred to the first regions.

公开(公告)号：US20240379902A1

公开(公告)日：2024-11-14

申请号：US18784501

申请日：2024-07-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinwoong Lee ,  Sunghyun Yoo ,  Jongpil Jeon ,  Yong Namkung

IPC: H01L33/14 ,  H01L33/38

Abstract: A light-emitting diode may include: a first semiconductor layer including a light-emitting surface; a second semiconductor layer; an active layer between the first semiconductor layer and the second semiconductor layer; a first contact electrode electrically connected to the first semiconductor layer; a second contact electrode electrically connected to the second semiconductor layer; a first connection pad electrically connected to the first contact electrode; and a second connection pad electrically connected to the second contact electrode, wherein a current concentration region of the light-emitting diode is between the first connection pad and the second connection pad.

公开(公告)号：US20230163233A1

公开(公告)日：2023-05-25

申请号：US18094112

申请日：2023-01-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myunghee KIM ,  Sungwook Kim ,  Yong Namkung

IPC: H01L33/02 ,  H01L25/16 ,  H01L33/00 ,  H01L23/00

CPC classification number: H01L33/02 ,  H01L25/167 ,  H01L33/007 ,  H01L33/0093 ,  H01L24/95 ,  H01L33/32

Abstract: A nanowire LED, a display module including the nanowire LED, and a method for manufacturing the display module are provided. The method for manufacturing a display module includes forming a template layer including a magnetic layer on a silicon substrate, growing a plurality of nanowire LEDs on the template layer, separating the plurality of nanowire LEDs from the template layer by ultrasonic waves, forming a plurality of unit cells in a state in which the plurality of nanowire LEDs are aligned to have a specific directivity, forming a plurality of unit pixels by transferring the plurality of unit cells onto a unit substrate, arranging the plurality of unit pixels on a thin film transistor (TFT) substrate through a fluidic self-assembly, and bonding the plurality of unit pixels to be connected to an electrode of the TFT substrate.

公开(公告)号：US20250029965A1

公开(公告)日：2025-01-23

申请号：US18799085

申请日：2024-08-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sunghyun YOO ,  Jinwoong Lee ,  Kyehoon Lee ,  Hyunkyung Kim ,  Yong Namkung ,  Jaehee Lim ,  Hyoungjin Lim ,  Jongpil Jeon

IPC: H01L25/075 ,  H01L27/15 ,  H01L33/38 ,  H01L33/50

Abstract: A display panel includes: a substrate; a plurality of substrate electrodes on the substrate; a plurality of first light emitting diodes electrically connected to the plurality of substrate electrodes, and configured to emit light of a first color; and a plurality of second light emitting diodes electrically connected to the plurality of substrate electrodes, each of the plurality of second light emitting diodes being configured to emit light of a second color and emit light of a third color, wherein the second color and the third color are different from the first color.

公开(公告)号：US20210111325A1

公开(公告)日：2021-04-15

申请号：US17024833

申请日：2020-09-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myunghee KIM ,  Donghwan Kim ,  Sungwook Kim ,  Yong Namkung ,  Jenghun Suh ,  Jaephil Shim

IPC: H01L33/62 ,  H01L25/075 ,  H01L23/00 ,  H01L33/00 ,  H01L33/40 ,  H01L33/42 ,  H01L33/44 ,  H01L33/58

Abstract: A display module and a manufacturing method thereof are provided. The manufacturing method may include forming an epitaxial film comprising a light emitting layer, a first type semiconductor layer, and a second type semiconductor layer, attaching the epitaxial film to an intermediate substrate comprising a conductive material, patterning the epitaxial film to form a light emitting diode (LED) and coupling the LED to a driving circuit layer through the conductive material.

公开(公告)号：US20210013184A1

公开(公告)日：2021-01-14

申请号：US16891242

申请日：2020-06-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ohjae KWON ,  Jinmo Kang ,  Donghwan Kim ,  Yong Namkung ,  Seondeok Hwang

IPC: H01L25/075 ,  H01L25/16

Abstract: A micro light emitting diode (LED) transfer method includes: preparing a transfer substrate including a plurality of micro LEDs, the plurality of micro LEDs having electrodes disposed in a first direction and a second direction different from the first direction on the transfer substrate; sequentially transferring a first set of micro LEDs among the plurality of micro LEDs in block units from the transfer substrate to first regions of a target substrate; and sequentially transferring a second set of micro LEDs among the plurality of micro LEDs in block units from the transfer substrate to second regions of the target substrate, and in the sequential transferring of the second set of micro LEDs, the second set of micro LEDs transferred to the second regions are disposed in the same electrode direction as an electrode direction of the first set of micro LEDs transferred to the first regions.