Electronic device
    1.
    外观设计

    公开(公告)号:USD1033426S1

    公开(公告)日:2024-07-02

    申请号:US29882234

    申请日:2023-01-12

    Abstract: FIG. 1 is a front perspective view of an electronic device showing our new design;
    FIG. 2 is a front elevation view thereof;
    FIG. 3 is a rear elevation view thereof;
    FIG. 4 is a left side elevation view thereof;
    FIG. 5 is a right side elevation view thereof;
    FIG. 6 is a top plan view thereof; and,
    FIG. 7 is a bottom plan view thereof.
    The broken lines in the figures illustrate portions of the electronic device that form no part of the claimed design.

    Case for mobile electronic device

    公开(公告)号:USD1024044S1

    公开(公告)日:2024-04-23

    申请号:US29860891

    申请日:2022-11-23

    Abstract: FIG. 1 is a top front perspective view of a case for mobile electronic device showing our new design;
    FIG. 2 is a front view thereof;
    FIG. 3 is a rear view thereof;
    FIG. 4 is a left side view thereof;
    FIG. 5 is a right side view thereof;
    FIG. 6 is a top plan view thereof;
    FIG. 7 is a bottom plan view thereof; and,
    FIG. 8 is a bottom rear perspective view thereof.
    The dashed broken lines in the figures depict portions of the case for mobile electronic device that form no part of the claimed design.

    Case for mobile electronic device

    公开(公告)号:USD1024043S1

    公开(公告)日:2024-04-23

    申请号:US29860889

    申请日:2022-11-23

    Abstract: FIG. 1 is a top front perspective view of a case for mobile electronic device showing our new design;
    FIG. 2 is a front view thereof;
    FIG. 3 is a rear view thereof;
    FIG. 4 is a left side view thereof;
    FIG. 5 is a right side view thereof;
    FIG. 6 is a top plan view thereof;
    FIG. 7 is a bottom plan view thereof; and,
    FIG. 8 is a bottom rear perspective view thereof.
    The dashed broken lines in the figures depict portions of the case for mobile electronic device that form no part of the claimed design.

    METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICES USING MOIRÉ PATTERNS

    公开(公告)号:US20230152715A1

    公开(公告)日:2023-05-18

    申请号:US17982761

    申请日:2022-11-08

    Abstract: A method for manufacturing a semiconductor device may include: forming a first layer comprising a plurality of patterns, each pattern having a different respective pitch; performing exposure and development to form a second layer at a layer different from the first layer; determining whether a pitch shift of a part of exposure patterns formed is within a tolerance range, using a Moire pattern; and performing etching for the second layer when the pitch shift of the part of exposure patterns is determined to be within the tolerance range. Performing the exposure and the development may include forming a first exposure pattern corresponding to a key pattern having a first pitch, forming a second exposure pattern corresponding to a cell pattern having a second pitch, and forming a third exposure pattern corresponding to a middle pitch pattern having a third pitch between the first pitch and the second pitch.

    Case for mobile electronic device

    公开(公告)号:USD1024042S1

    公开(公告)日:2024-04-23

    申请号:US29860874

    申请日:2022-11-23

    Abstract: FIG. 1 is a top front perspective view of a case for mobile electronic device showing our new design;
    FIG. 2 is a front view thereof;
    FIG. 3 is a rear view thereof;
    FIG. 4 is a left side view thereof;
    FIG. 5 is a right side view thereof;
    FIG. 6 is a top plan view thereof;
    FIG. 7 is a bottom plan view thereof; and,
    FIG. 8 is a bottom rear perspective view thereof.
    The dashed broken lines in the figures depict portions of the case for mobile electronic device that form no part of the claimed design.

    Case for mobile electronic device

    公开(公告)号:USD1021883S1

    公开(公告)日:2024-04-09

    申请号:US29860896

    申请日:2022-11-23

    Abstract: FIG. 1 is a top front perspective view of a case for mobile electronic device showing our new design;
    FIG. 2 is a front view thereof;
    FIG. 3 is a rear view thereof;
    FIG. 4 is a left side view thereof;
    FIG. 5 is a right side view thereof;
    FIG. 6 is a top plan view thereof;
    FIG. 7 is a bottom plan view thereof;
    FIG. 8 is a bottom rear perspective view thereof; and,
    FIG. 9 is a bottom front perspective view showing our new design in an open configuration.
    The dashed broken lines in the figures depict portions of the case for mobile electronic device that form no part of the claimed design.

    Case for mobile electronic device

    公开(公告)号:USD1018513S1

    公开(公告)日:2024-03-19

    申请号:US29860893

    申请日:2022-11-23

    Abstract: FIG. 1 is a top front perspective view of a case for mobile electronic device showing our new design;
    FIG. 2 is a front view thereof;
    FIG. 3 is a rear view thereof;
    FIG. 4 is a left side view thereof;
    FIG. 5 is a right side view thereof;
    FIG. 6 is a top plan view thereof;
    FIG. 7 is a bottom plan view thereof; and,
    FIG. 8 is a bottom rear perspective view thereof.
    The dashed broken lines in the figures depict portions of the case for mobile electronic device that form no part of the claimed design.

Patent Agency Ranking