DISPLAY DEVICE
    1.
    发明申请
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20190252481A1

    公开(公告)日:2019-08-15

    申请号:US16244372

    申请日:2019-01-10

    CPC classification number: H01L27/3276 H01L27/3248 H01L27/3258

    Abstract: A display device includes: a substrate including a pad area; a plurality of first conductive pads disposed in a matrix form in the pad area in a first direction and in a second direction intersecting the first direction; protrusions disposed on the plurality of first conductive pads; and a plurality of second conductive pads disposed on the plurality of first conductive pads and the protrusions. The plurality of second conductive pads include: contact portions in contact with the first conductive pads; and raised portions configured to extend from the contact portions, to cover the protrusions, and to have heights greater than that of the contact portions. The plurality of second conductive pads include an ultrasonic bondable material.

    INKJET PRINT APPARATUS, INKJET PRINTING METHOD USING THE SAME, AND LAMINATION METHOD USING THE SAME

    公开(公告)号:US20190224954A1

    公开(公告)日:2019-07-25

    申请号:US16254356

    申请日:2019-01-22

    Abstract: An inkjet print apparatus includes a stage; an inkjet head located over an upper portion of the stage, configured to move in a first direction and a second direction opposite to the first direction, and configured to eject an ink toward the stage; a first ultraviolet irradiator located behind the inkjet head with respect to the first direction first covers located at respective sides of the first ultraviolet irradiator in the first direction; a second ultraviolet irradiator located behind the inkjet head with respect to the second direction; and second covers located at respective sides of the second ultraviolet irradiator in the second direction. Further, a process for forming an adhesive layer may be simplified by using an inkjet printing method.

    DRIVING INTEGRATED CIRCUIT AND DISPLAY DEVICE INCLUDING THE SAME

    公开(公告)号:US20190181111A1

    公开(公告)日:2019-06-13

    申请号:US16128740

    申请日:2018-09-12

    Abstract: A driving chip includes a body portion including a circuit. A first bump is electrically connected to the body portion. A second bump is disposed on the first bump. The second bump has a planar area less than a planar area of the first bump on a plane defined along a first direction parallel to an upper surface of the body portion. The first bump has a length of about 60 μm or more in the first direction, a side surface of the second bump is aligned with a side surface of the first bump along a second direction orthogonal to the first direction.

    ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE USING THE SAME

    公开(公告)号:US20190148478A1

    公开(公告)日:2019-05-16

    申请号:US16249387

    申请日:2019-01-16

    Abstract: An anisotropic conductive film includes a conductive layer; a first resin insulating layer over a first surface of the conductive layer; and a second resin insulating layer over a second surface of the conductive layer, wherein the conductive layer comprises a plurality of conductive particles and a nano fiber connecting the plurality of conductive particles to each other, each of the plurality of conductive particles comprising a plurality of needle-shaped protrusions having a conical shape, and wherein the first resin insulating layer and the second resin insulating layer comprise a same material and have different thicknesses.

    DISPLAY DEVICE AND METHOD OF FABRICATING DISPLAY DEVICE

    公开(公告)号:US20190319213A1

    公开(公告)日:2019-10-17

    申请号:US16376187

    申请日:2019-04-05

    Abstract: A display device includes: a display panel including a display region and a non-display region; a window member on the display panel; and an adhesive member between the display panel and the window member. The adhesive member includes: a first adhesion portion overlapping the display region, and a second adhesion portion extending from the first adhesion portion and overlapping the non-display region. The display panel includes: a substrate, a display element layer on the substrate and overlapping the display region, a driving chip on the substrate and overlapping the non-display region, and an encapsulation member on the display element layer. The driving chip is configured to provide a driving signal to the display element layer. The first adhesion portion connects the window member to the encapsulation member. The second adhesion portion connects the window member to the substrate and encloses the driving chip, but does not overlap the driving chip.

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