Abstract:
The present disclosure relates to a composite article that may include a structural substrate, a multilayer fluoropolymer film that can include a high-melt fluoropolymer layer and a low-melt fluoropolymer adhesion layer that may contact the structural substrate and the fluoropolymer film. The high-melt fluoropolymer layer may have a melting temperature A1 and the low-melt fluoropolymer adhesive layer may have a melting temperature A2. The melting temperature A2 may be less than the melting temperature A1.
Abstract:
The present disclosure relates to a dielectric substrate that may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D10 of at least about 1.0 microns and not greater than about 1.7, a D50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D90 of at least about 2.7 microns and not greater than about 6 microns.
Abstract:
A cooking release material includes a layer comprising fluoropolymer. The cooking release material has a major surface having nucleation structures in a density of at least 10 per square inch. The cooking release material can include a reinforcement material, the layer coated over the reinforcement material. The cooking release material can include a second layer forming the major surface.
Abstract:
A fabric includes a reinforcement material and a layer disposed adjacent to the reinforcement material including a fluoropolymer and an elastomer. The fabric can be an architectural fabric included in an architectural assembly.
Abstract:
The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.
Abstract:
The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D10 of at least about 1.0 microns and not greater than about 1.7, a D50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D90 of at least about 2.7 microns and not greater than about 6 microns.
Abstract:
The present disclosure relates to a low friction bearing liner for a solenoid that may include a core layer, a first outer layer overlying a first surface of the core layer, a second outer layer overlying the first outer layer, a first inner layer overlying a second surface of the core layer that is opposite of the first surface of the core layer, and a second inner layer overlying the first inner layer. The first outer layer and the first inner layer may include a fluoropolymer material and may have a melt flow rate of at least about 2 g/10 min at 372° C. The second outer layer and the second inner layer may include a fluoropolymer material distinct from the fluoropolymer material of the first outer layer and may have a surface coefficient of friction of not greater than about 0.2.
Abstract:
The present disclosure is directed to transparent composites having anti-fogging properties and anti-fog coating compositions for providing anti-fogging properties. The anti-fogging layers can contain an adhesive polymer, a hard polymer, and a hydrophilic polymer, wherein the adhesive polymer, hard polymer, and hydrophilic polymers are different. In further embodiments, composites are described including a substrate layer; a first adhesive layer; a first transparent layer; a second adhesive layer; a second transparent layer; and an anti-fog layer.
Abstract:
A cooking release material includes a layer comprising fluoropolymer. The cooking release material has a major surface having nucleation structures in a density of at least 10 per square inch. The cooking release material can include a reinforcement material, the layer coated over the reinforcement material. The cooking release material can include a second layer forming the major surface.
Abstract:
The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.