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公开(公告)号:US20130256906A1
公开(公告)日:2013-10-03
申请号:US13767940
申请日:2013-02-15
Applicant: RENESAS ELECTRONICS CORPORATION
Inventor: Ryo Mori , Kazuki Fukuoka , Naozumi Morino , Yoshinori Deguchi
IPC: H01L23/538 , H01L21/02
CPC classification number: H01L23/5226 , H01L21/02697 , H01L21/768 , H01L22/32 , H01L23/528 , H01L23/5283 , H01L23/5286 , H01L23/5384 , H01L23/562 , H01L24/05 , H01L24/06 , H01L2224/02166 , H01L2224/05553 , H01L2924/1306 , H01L2924/13091 , H01L2924/00
Abstract: A semiconductor device includes a substrate including a circuit region where a circuit element is formed, a multilayer wiring layer that is formed on the substrate and composed of a plurality of wiring layers and a plurality of via layers that are laminated, and an electrode pad that is formed on the multilayer wiring layer. An interlayer insulating film is formed in a region of a first wiring layer that is a top layer of the plurality of wiring layers, in the region the electrode pad and the first circuit region overlapping each other in a planar view of the electrode pad.
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公开(公告)号:US10180711B2
公开(公告)日:2019-01-15
申请号:US15224380
申请日:2016-07-29
Applicant: Renesas Electronics Corporation
Inventor: Yuko Kitaji , Kazuki Fukuoka , Ryo Mori , Toshifumi Uemura
Abstract: There is provided a semiconductor device that can follow a fast voltage change such as a large voltage drop occurring at the time of rapid load fluctuation. The semiconductor device includes a voltage sensor which monitors a power supply voltage at a sampling speed higher than the assumed frequency of power supply voltage fluctuation and outputs a voltage code value, a voltage drop determination circuit which determines, from the voltage code value, that a voltage drop causing a malfunction of a system occurs, and outputs a clock stop signal, and a clock control circuit which controls clock stop, restart, and frequency change.
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3.
公开(公告)号:US09171767B2
公开(公告)日:2015-10-27
申请号:US14536620
申请日:2014-11-08
Applicant: RENESAS ELECTRONICS CORPORATION
Inventor: Ryo Mori , Kazuki Fukuoka , Naozumi Morino , Yoshinori Deguchi
IPC: H01L23/48 , H01L21/66 , H01L23/538 , H01L21/02 , H01L23/00 , H01L23/528 , H01L21/768 , H01L23/522
CPC classification number: H01L23/5226 , H01L21/02697 , H01L21/768 , H01L22/32 , H01L23/528 , H01L23/5283 , H01L23/5286 , H01L23/5384 , H01L23/562 , H01L24/05 , H01L24/06 , H01L2224/02166 , H01L2224/05553 , H01L2924/1306 , H01L2924/13091 , H01L2924/00
Abstract: A semiconductor device includes a substrate including a circuit region where a circuit element is formed, a multilayer wiring layer that is formed on the substrate and composed of a plurality of wiring layers and a plurality of via layers that are laminated, and an electrode pad that is formed on the multilayer wiring layer. An interlayer insulating film is formed in a region of a first wiring layer that is a top layer of the plurality of wiring layers, in the region the electrode pad and the first circuit region overlapping each other in a planar view of the electrode pad.
Abstract translation: 一种半导体器件包括:基板,包括形成有电路元件的电路区域;多层布线层,其形成在所述基板上并且由多个布线层和多个层叠的通孔层构成;电极焊盘, 形成在多层布线层上。 在电极焊盘的平面图中,在电极焊盘和第一电路区域彼此重叠的区域中,在作为多个布线层的顶层的第一布线层的区域中形成层间绝缘膜。
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4.
公开(公告)号:US08896129B2
公开(公告)日:2014-11-25
申请号:US13767940
申请日:2013-02-15
Applicant: Renesas Electronics Corporation
Inventor: Ryo Mori , Kazuki Fukuoka , Naozumi Morino , Yoshinori Deguchi
IPC: H01L23/48 , H01L23/00 , H01L21/02 , H01L23/538
CPC classification number: H01L23/5226 , H01L21/02697 , H01L21/768 , H01L22/32 , H01L23/528 , H01L23/5283 , H01L23/5286 , H01L23/5384 , H01L23/562 , H01L24/05 , H01L24/06 , H01L2224/02166 , H01L2224/05553 , H01L2924/1306 , H01L2924/13091 , H01L2924/00
Abstract: A semiconductor device includes a substrate including a circuit region where a circuit element is formed, a multilayer wiring layer that is formed on the substrate and composed of a plurality of wiring layers and a plurality of via layers that are laminated, and an electrode pad that is formed on the multilayer wiring layer. An interlayer insulating film is formed in a region of a first wiring layer that is a top layer of the plurality of wiring layers, in the region the electrode pad and the first circuit region overlapping each other in a planar view of the electrode pad.
Abstract translation: 一种半导体器件包括:基板,包括形成有电路元件的电路区域;多层布线层,其形成在所述基板上并且由多个布线层和多个层叠的通孔层构成;电极焊盘, 形成在多层布线层上。 在电极焊盘的平面图中,在电极焊盘和第一电路区域彼此重叠的区域中,在作为多个布线层的顶层的第一布线层的区域中形成层间绝缘膜。
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公开(公告)号:US11675404B2
公开(公告)日:2023-06-13
申请号:US17319880
申请日:2021-05-13
Applicant: RENESAS ELECTRONICS CORPORATION
Inventor: Ryo Mori , Kazuki Fukuoka , Kenichi Shimada
Abstract: A semiconductor device includes: a plurality of cores configured to receive power from a power supply; a plurality of power switch circuits provided for each core and configured to control the power supplied to the corresponding cores; a compare circuit configured to receive power from the power supply and compare output data of the plurality of cores; and a core voltage monitor circuit configured to monitor a voltage of a node that connects the power supply and the compare circuit.
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公开(公告)号:US20190129488A1
公开(公告)日:2019-05-02
申请号:US16219758
申请日:2018-12-13
Applicant: Renesas Electronics Corporation
Inventor: Yuko Kitaji , Kazuki Fukuoka , Ryo Mori , Toshifumi Uemura
IPC: G06F1/30
CPC classification number: G06F1/305 , G06F1/10 , G06F1/32 , G06F1/3237
Abstract: A semiconductor device includes a voltage sensor which samples a power supply voltage at a speed faster than fluctuations in the power supply voltage and encodes the power supply voltage into a voltage code value. A voltage drop determination circuit detects a voltage drop based on the voltage code value, and a clock control circuit generates a clock. The clock control circuit stops the clock when the voltage drop determination circuit detects the voltage drop. The voltage drop determination circuit includes a prediction computation circuit which looks ahead a voltage value from a history of the voltage code value and predicts a variation value, and the prediction computation circuit includes a circuit for masking a prediction value if a differential value of the prediction value is continuously negative for a predetermined cycle.
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公开(公告)号:US20160027731A1
公开(公告)日:2016-01-28
申请号:US14875335
申请日:2015-10-05
Applicant: RENESAS ELECTRONICS CORPORATION
Inventor: Ryo Mori , Kazuki Fukuoka , Naozumi Morino , Yoshinori Deguchi
IPC: H01L23/522 , H01L23/528
CPC classification number: H01L23/5226 , H01L21/02697 , H01L21/768 , H01L22/32 , H01L23/528 , H01L23/5283 , H01L23/5286 , H01L23/5384 , H01L23/562 , H01L24/05 , H01L24/06 , H01L2224/02166 , H01L2224/05553 , H01L2924/1306 , H01L2924/13091 , H01L2924/00
Abstract: A semiconductor device includes a substrate including a circuit region where a circuit element is formed, a multilayer wiring layer that is formed on the substrate and composed of a plurality of wiring layers and a plurality of via layers that are laminated, and an electrode pad that is formed on the multilayer wiring layer. An interlayer insulating film is formed in a region of a first wiring layer that is a top layer of the plurality of wiring layers, in the region the electrode pad and the first circuit region overlapping each other in a planar view of the electrode pad.
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公开(公告)号:US10222847B2
公开(公告)日:2019-03-05
申请号:US15224380
申请日:2016-07-29
Applicant: Renesas Electronics Corporation
Inventor: Yuko Kitaji , Kazuki Fukuoka , Ryo Mori , Toshifumi Uemura
IPC: G06F1/30 , G06F1/32 , G06F1/10 , G06F1/3237
Abstract: There is provided a semiconductor device that can follow a fast voltage change such as a large voltage drop occurring at the time of rapid load fluctuation. The semiconductor device includes a voltage sensor which monitors a power supply voltage at a sampling speed higher than the assumed frequency of power supply voltage fluctuation and outputs a voltage code value, a voltage drop determination circuit which determines, from the voltage code value, that a voltage drop causing a malfunction of a system occurs, and outputs a clock stop signal, and a clock control circuit which controls clock stop, restart, and frequency change.
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公开(公告)号:US08730703B2
公开(公告)日:2014-05-20
申请号:US13748663
申请日:2013-01-24
Applicant: Renesas Electronics Corporation
Inventor: Kazuki Fukuoka , Yasuto Igarashi , Ryo Mori , Yoshihiko Yasu , Toshio Sasaki
CPC classification number: H03K5/00 , H01L27/0203 , H01L27/0207 , H01L27/0928 , H01L27/11807 , H03K3/00 , H03K19/0016
Abstract: Efficient reduction in power consumption is achieved by combinational implementation of a power cutoff circuit technique using power supply switch control and a DVFS technique for low power consumption. A power supply switch section fed with power supply voltage, a circuit block in which a power cutoff is performed by the power supply switch section, and a level shifter are formed in a DEEP-NWELL region formed over a semiconductor substrate. Another power supply switch section fed with another power supply voltage, a circuit block in which a power cutoff is performed by the power supply switch section, and a level shifter are formed in another DEEP-NWELL region formed over the semiconductor substrate. In this arrangement, there arises no possibility of short-circuiting between different power supplies via each DEEP-NWELL region formed over the semiconductor substrate.
Abstract translation: 通过使用电源开关控制和DVFS技术组合实现断电电路技术实现功耗的有效降低,实现低功耗。 在半导体基板上形成的DEEP-NWELL区域中,形成供给电源电压的电源开关部,由电源开关部进行电源切断的电路块和电平移位器。 供给另一电源电压的另一个电源开关部分,由电源开关部分执行电源切断的电路块和电平移位器形成在形成在半导体衬底上的另一个DEEP-NWELL区域中。 在这种布置中,不存在通过半导体衬底上形成的每个DEEP-NWELL区域在不同电源之间短路的可能性。
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公开(公告)号:US10782763B2
公开(公告)日:2020-09-22
申请号:US16219758
申请日:2018-12-13
Applicant: Renesas Electronics Corporation
Inventor: Yuko Kitaji , Kazuki Fukuoka , Ryo Mori , Toshifumi Uemura
IPC: G06F1/30 , G06F1/10 , G06F1/32 , G06F1/3237
Abstract: A semiconductor device includes a voltage sensor which samples a power supply voltage at a speed faster than fluctuations in the power supply voltage and encodes the power supply voltage into a voltage code value. A voltage drop determination circuit detects a voltage drop based on the voltage code value, and a clock control circuit generates a clock. The clock control circuit stops the clock when the voltage drop determination circuit detects the voltage drop. The voltage drop determination circuit includes a prediction computation circuit which looks ahead a voltage value from a history of the voltage code value and predicts a variation value, and the prediction computation circuit includes a circuit for masking a prediction value if a differential value of the prediction value is continuously negative for a predetermined cycle.
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