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公开(公告)号：US20160360606A1
公开(公告)日：2016-12-08
申请号：US14732787
申请日：2015-06-08
Applicant: QUALCOMM Incorporated
Inventor： Mehdi SAEIDI , Arpit MITTAL , Emil RAHIM , Rajat MITTAL , Kambiz SAMADI
CPC classification number: H05K1/0203 , G05B15/02 , H05K1/0209 , H05K1/0272 , H05K7/20145 , H05K7/20172 , H05K7/20209 , H05K2201/064
Abstract: Methods and apparatus for implementing a synthetic jet to cool a device are provided. Examples of the techniques keep a device case cool enough to be hand-held, while allowing a higher temperature of a circuit component located in the case, to maximize circuit performance. In an example, provided is a mobile device including a synthetic jet configured to transfer heat within the mobile device. The synthetic jet can be embedded in a circuit board inside the mobile device such that the circuit board defines at least a portion of a chamber of the synthetic jet and defines an orifice of the synthetic jet. The device case can define at least one fluid channel inside the mobile device. Also, the circuit board can define a synthetic jet outlet configured to direct a fluid at the at least one fluid channel. Also provided are methods for controlling a synthetic jet.
Abstract translation: 提供了用于实施合成射流以冷却装置的方法和装置。 这些技术的示例使得器件的壳体足够冷却成为手持式，同时允许位于壳体中的电路元件的较高温度以最大化电路性能。 在一个示例中，提供了包括被配置为在移动设备内传递热量的合成射流的移动设备。 合成射流可以嵌入在移动装置内的电路板中，使得电路板限定合成射流的室的至少一部分并且限定合成射流的孔口。 设备壳体可以在移动设备内定义至少一个流体通道。 此外，电路板可以限定配置成在至少一个流体通道处引导流体的合成射流出口。 还提供了用于控制合成射流的方法。
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公开(公告)号：US20170160785A1
公开(公告)日：2017-06-08
申请号：US15441124
申请日：2017-02-23
Applicant: QUALCOMM Incorporated
Inventor： Rajat MITTAL , Madan KRISHNAPPA , Rajit CHANDRA , Mohammad TAMJIDI
CPC classification number: G06F1/324 , G06F1/206 , G06F1/3203 , G06F1/3206 , G06F1/3287 , G06F1/329 , G06F1/3296 , G06F9/4856 , G06F9/5088 , G06F9/5094 , Y02D10/126 , Y02D10/16 , Y02D10/171 , Y02D10/172 , Y02D10/22 , Y02D10/24 , Y02D10/32
Abstract: A thermal controller for managing thermal energy of a multi-core processor is provided. The cores include a first core processing a load and remaining cores. The thermal controller is configured to determine that a temperature of the first core is greater than a first threshold, determine a temperature of a second core of the remaining cores in response to determining that the temperature of the first core is greater than the first threshold, and determine whether the temperature of the second core is greater than or less than a second threshold. The thermal controller is configured to transfer at least a portion of the load of the first core to the second core in response to determining that the temperature of the first core is greater than the first threshold and based on whether the temperature of the second core is greater than or less than the second threshold.
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公开(公告)号：US20160246362A1
公开(公告)日：2016-08-25
申请号：US15052786
申请日：2016-02-24
Applicant: QUALCOMM Incorporated
Inventor： Suresh SUGUMAR , Jeffrey GEMAR , Ali TAHA , Amy DERBYSHIRE , Tao XUE , Mohammad TAMJIDI , Rajat MITTAL
IPC: G06F1/32
CPC classification number: G06F1/3296 , G06F1/3206 , G06F1/3243 , G06F1/3287 , G06F9/30189 , G06F9/3836 , G06F9/3861 , G06F9/3885 , Y02D10/152
Abstract: An apparatus includes a first circuit and a second circuit sharing an instruction stream. A voltage controller circuit is configured to provide an operation voltage and at least one low-power voltage to the second circuit independent of a supply voltage of the first circuit in response to a sequence of the instruction stream. In another aspect, a method of operating a power management function is presented. The method includes providing an instruction stream for a first circuit and a second circuit and providing selectively an operation voltage and at least one low-power voltage to the second circuit independent of a supply voltage of the first circuit in response to a sequence of the instruction stream.
Abstract translation: 一种装置包括第一电路和共享指令流的第二电路。 电压控制器电路被配置为响应于指令流的序列，独立于第一电路的电源电压而向第二电路提供操作电压和至少一个低功率电压。 另一方面，提出了一种操作电源管理功能的方法。 该方法包括提供用于第一电路和第二电路的指令流，并响应于指令序列而独立于第一电路的电源电压而选择性地向第二电路提供操作电压和至少一个低功率电压 流。
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公开(公告)号：US20170163302A1
公开(公告)日：2017-06-08
申请号：US14957569
申请日：2015-12-02
Applicant: QUALCOMM Incorporated
Inventor： Mehdi SAEIDI , Emil RAHIM , Rajat MITTAL , Arpit MITTAL
IPC: H04B1/3827
Abstract: A method and an apparatus for providing thermal solution are provided. The apparatus includes an electronic component that emits heat during the operation of the apparatus. A single-piece component covers the electronic component and is configured to shield the electronic component from an electromagnetic field surrounding the electronic component. The single-piece component is also configured to transfer at least a portion of the heat emitted by the electronic component to a cooling region of the apparatus. In another aspect, a method and an apparatus for providing thermal solution are provided. The apparatus shields an electronic component of the apparatus from an electromagnetic field surrounding the electronic component. The apparatus transfers at least a portion of heat emitted by the electronic component to a cooling region of the mobile device. The shielding and the transferring are performed by the same single-piece component of the apparatus.
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公开(公告)号：US20170102676A1
公开(公告)日：2017-04-13
申请号：US14882158
申请日：2015-10-13
Applicant: QUALCOMM Incorporated
Inventor： Hee Jun PARK , Rajat MITTAL , Mehdi SAEIDI
CPC classification number: G05B15/02 , G06F1/1616 , G06F1/206
Abstract: A method, an apparatus, and a computer program product for performance management are provided. The apparatus may be an electronic device. The electronic device detects a change of form factor mode or ambient wind using a detection circuit or at least one sensor. The change of form factor mode may include at least one of folding the electronic device, unfolding the electronic device, rolling the electronic device, changing a flexible shape of the electronic device, or equipping a cover on the electronic device. A set of thermal control parameters may be determined based on the detected change. The set of thermal control parameters may be retrieved from a lookup table or calculated using a mathematical model. The electronic device adjusts the performance based on the set of thermal control parameters.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20170017279A1
公开(公告)日：2017-01-19
申请号：US14849842
申请日：2015-09-10
Applicant: QUALCOMM Incorporated
Inventor： Mehdi SAEIDI , Emil RAHIM , Rajat MITTAL , Arpit MITTAL
Abstract: A heat transfer component of a smart watch captures at least a portion of heat emitted by one or more electronic components located within an enclosure of the smart watch. The heat transfer component transfers at least a portion of the captured heat to a wrist band outside the enclosure of the smart watch. The wrist band allows for dissipation of at least a portion of the transferred heat through at least one surface of the wrist band.
Abstract translation: 智能手表的传热部件捕获位于智能手表的外壳内的一个或多个电子部件发出的至少一部分热量。 传热部件将至少一部分捕获的热量传递到智能手表的外壳外部的腕带。 腕带允许通过手腕带的至少一个表面散发所传送的热量的至少一部分。
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7.发明申请公开(公告)号：US20180084667A1
公开(公告)日：2018-03-22
申请号：US15270305
申请日：2016-09-20
Applicant: QUALCOMM Incorporated
Inventor： Mehdi SAEIDI , Rajat MITTAL , Ryan COUTTS
CPC classification number: H05K7/2039 , G01K7/183 , G01K2217/00 , G06F1/203
Abstract: The disclosure generally relates to a hybrid design whereby a heat spreader arranged to reduce an external skin temperature on a handheld device may further enable the external skin temperature to be directly measured. For example, the heat spreader may be thermally coupled to at least one external surface and include at least one region in which a plurality of recesses are formed such that an electrical resistance is produced in the at least one region when a current is applied thereto. The heat spreader may be formed from a material having a substantially linear resistance-to-temperature correlation, whereby the electrical resistance produced in the at least one region may be measured and correlated to a temperature on the at least one external surface.
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公开(公告)号：US20180072431A1
公开(公告)日：2018-03-15
申请号：US15263267
申请日：2016-09-12
Applicant: QUALCOMM Incorporated
Inventor： Vivek SAHU , Mehdi SAEIDI , Rajat MITTAL , Melika ROSHANDELL
CPC classification number: B64D33/08 , B64C39/024 , B64C2201/027 , B64C2201/042 , B64C2201/108 , B64D27/24 , Y02T50/44
Abstract: A drone adapted for flight may include propellers that may be powered by motors to move the drone. The drone may include a processing component and arms for supporting each of the propellers. At least a portion of at least one of the arms may include a first thermal spreading material that is coupled to the processing component. Each of the arms may be exposed to the air.
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公开(公告)号：US20170290194A1
公开(公告)日：2017-10-05
申请号：US15087864
申请日：2016-03-31
Applicant: QUALCOMM Incorporated
Inventor： Rajat MITTAL , Mehdi SAEIDI , Vivek SAHU , Ryan COUTTS
CPC classification number: H05K7/2039 , H01L41/042 , H01L41/0926 , H01L41/0973 , H05K7/20445 , H05K7/20472
Abstract: An electronic device includes an integrated circuit, a flexible heat spreader, an actuator, and a controller. The actuator is coupled to the flexible heat spreader and the controller is configured to control the actuator between a first actuation mode and a second actuation mode. When in the first actuation mode, the actuator positions the flexible heat spreader with an air gap between the flexible heat spreader and the integrated circuit such that the flexible heat spreader is thermally separated from the integrated circuit to increase a thermal impedance between the flexible heat spreader and the integrated circuit. When in the second actuation mode, the actuator positions the flexible heat spreader in thermal contact with the integrated circuit without the air gap there between to reduce the thermal impedance between the flexible heat spreader and the integrated circuit.
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公开(公告)号：US20160124476A1
公开(公告)日：2016-05-05
申请号：US14675409
申请日：2015-03-31
Applicant: QUALCOMM Incorporated
Inventor： Rajat MITTAL , Madan KRISHNAPPA , Rajit CHANDRA , Mohammad TAMJIDI
CPC classification number: G06F1/324 , G06F1/206 , G06F1/3203 , G06F1/3206 , G06F1/3287 , G06F1/329 , G06F1/3296 , G06F9/4856 , G06F9/5088 , G06F9/5094 , Y02D10/126 , Y02D10/16 , Y02D10/171 , Y02D10/172 , Y02D10/22 , Y02D10/24 , Y02D10/32
Abstract: A method, an apparatus, and a computer program product are provided. The apparatus may be a UE. The UE has a processor including a plurality of cores. The plurality of cores includes a first core and remaining cores. The UE determines a temperature of the first core of the plurality of cores. The first core processes a load. The UE determines that the temperature of the first core is greater than a first threshold. The UE determines that the temperature of the first core is not greater than a second threshold. The second threshold is greater than the first threshold. The UE transfers at least a portion of the load of the first core to a second core of the remaining cores in response to determining that the temperature of the first core is greater than the first threshold.
Abstract translation: 提供了一种方法，装置和计算机程序产品。 该装置可以是UE。 UE具有包括多个核的处理器。 多个芯包括第一芯和剩余芯。 UE确定多个核心的第一核心的温度。 第一个核心处理一个负载。 UE确定第一核心的温度大于第一阈值。 UE确定第一核心的温度不大于第二阈值。 第二阈值大于第一阈值。 响应于确定第一核心的温度大于第一阈值，UE将第一核心的至少一部分负载传送到剩余核心的第二核心。
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