公开(公告)号：US20190004571A1

公开(公告)日：2019-01-03

申请号：US15637901

申请日：2017-06-29

Applicant: QUALCOMM Incorporated

Inventor： Vivek SAHU ,  Mehdi SAEIDI

IPC: G06F1/18 ,  H01L23/433 ,  H05K3/36 ,  H01L23/13 ,  H01L23/14 ,  H01L23/373 ,  H01L23/552 ,  H01L23/00

Abstract: A device that includes a die, a thermal interface material (TIM) coupled to the die, and an electromagnetic (EMI) shield coupled to the thermal interface material (TIM). The electromagnetic (EMI) shield is configured to compress the thermal interface material (TIM). The electromagnetic (EMI) shield comprises a flexible portion. In some implementations, the thermal interface material (TIM) is compressed by the electromagnetic (EMI) shield such that the thickness of the thermal interface material (TIM) is reduced by about at least 10˜20 percent.

公开(公告)号：US20180072431A1

公开(公告)日：2018-03-15

申请号：US15263267

申请日：2016-09-12

Applicant: QUALCOMM Incorporated

Inventor： Vivek SAHU ,  Mehdi SAEIDI ,  Rajat MITTAL ,  Melika ROSHANDELL

IPC: B64D33/08 ,  B64C39/02 ,  B64C27/08

CPC classification number: B64D33/08 ,  B64C39/024 ,  B64C2201/027 ,  B64C2201/042 ,  B64C2201/108 ,  B64D27/24 ,  Y02T50/44

Abstract: A drone adapted for flight may include propellers that may be powered by motors to move the drone. The drone may include a processing component and arms for supporting each of the propellers. At least a portion of at least one of the arms may include a first thermal spreading material that is coupled to the processing component. Each of the arms may be exposed to the air.

公开(公告)号：US20170290194A1

公开(公告)日：2017-10-05

申请号：US15087864

申请日：2016-03-31

Applicant: QUALCOMM Incorporated

Inventor： Rajat MITTAL ,  Mehdi SAEIDI ,  Vivek SAHU ,  Ryan COUTTS

IPC: H05K7/20 ,  H01L41/04 ,  H01L41/09

CPC classification number: H05K7/2039 ,  H01L41/042 ,  H01L41/0926 ,  H01L41/0973 ,  H05K7/20445 ,  H05K7/20472

Abstract: An electronic device includes an integrated circuit, a flexible heat spreader, an actuator, and a controller. The actuator is coupled to the flexible heat spreader and the controller is configured to control the actuator between a first actuation mode and a second actuation mode. When in the first actuation mode, the actuator positions the flexible heat spreader with an air gap between the flexible heat spreader and the integrated circuit such that the flexible heat spreader is thermally separated from the integrated circuit to increase a thermal impedance between the flexible heat spreader and the integrated circuit. When in the second actuation mode, the actuator positions the flexible heat spreader in thermal contact with the integrated circuit without the air gap there between to reduce the thermal impedance between the flexible heat spreader and the integrated circuit.