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公开(公告)号：US10401235B2
公开(公告)日：2019-09-03
申请号：US14852350
申请日：2015-09-11
Applicant: QUALCOMM Incorporated
Inventor： Ryan Michael Coutts , Rajat Mittal , Mehdi Saeidi , Paul Ivan Penzes
IPC: G01K13/00 , G05B15/02 , G06F1/04 , G06F1/3206 , G06F11/30 , G06F1/20 , G06F1/324 , G06F1/3296
Abstract: In one embodiment, a temperature management system comprises a plurality of thermal sensors at different locations on a chip, and a temperature manager. The temperature manager is configured to receive a plurality of temperature readings from the thermal sensors, to fit a quadratic temperature model to the received temperature readings, and to estimate a hotspot temperature on the chip using the fitted quadratic temperature model.
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公开(公告)号：US10188015B2
公开(公告)日：2019-01-22
申请号：US15270305
申请日：2016-09-20
Applicant: QUALCOMM Incorporated
Inventor： Mehdi Saeidi , Rajat Mittal , Ryan Coutts
Abstract: The disclosure generally relates to a hybrid design whereby a heat spreader arranged to reduce an external skin temperature on a handheld device may further enable the external skin temperature to be directly measured. For example, the heat spreader may be thermally coupled to at least one external surface and include at least one region in which a plurality of recesses are formed such that an electrical resistance is produced in the at least one region when a current is applied thereto. The heat spreader may be formed from a material having a substantially linear resistance-to-temperature correlation, whereby the electrical resistance produced in the at least one region may be measured and correlated to a temperature on the at least one external surface.
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3.发明申请公开(公告)号：US20170075397A1
公开(公告)日：2017-03-16
申请号：US14852941
申请日：2015-09-14
Applicant: QUALCOMM Incorporated
Inventor： Mehdi Saeidi , Arpit Mittal , Farsheed Mahmoudi , Rajat Mittal
CPC classification number: G06F1/206 , G06F1/3206 , G06F1/3234 , G06F1/3237 , G06F1/324 , Y02D10/126 , Y02D10/128 , Y02D10/16
Abstract: A method includes: generating a power consumption reading indicative of power consumption of a device, comparing the power consumption reading to a power threshold, wherein the power threshold represents a level of power consumption corresponding to a rise in temperature of an exterior surface of the device; in response to determining that the power consumption reading exceeds the power threshold, measuring cumulative power consumption over time from the power consumption reading; comparing the cumulative power consumption over time to an energy threshold, wherein the energy threshold corresponds to a temperature threshold for the exterior surface of the device; and in response to determining that the cumulative power consumption over time exceeds the energy threshold, reducing an operating parameter of the device to reduce power consumption.
Abstract translation: 一种方法包括：产生指示设备的功耗的功率消耗读数，将功耗读取与功率阈值进行比较，其中功率阈值表示与设备的外表面的温度升高相对应的功耗水平 ; 响应于确定所述功耗读数超过所述功率阈值，从所述功耗读数测量随时间的累积功耗; 将随时间的累积功耗与能量阈值进行比较，其中所述能量阈值对应于所述装置的外表面的温度阈值; 并且响应于确定随着时间的累积功率消耗超过能量阈值，减少设备的操作参数以降低功耗。
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公开(公告)号：US20160092616A1
公开(公告)日：2016-03-31
申请号：US14502752
申请日：2014-09-30
Applicant: QUALCOMM Incorporated
Inventor： Ryan Michael Coutts , Arpit Mittal , Rajat Mittal , Mohamed Waleed Allam , Mehdi Saeidi
CPC classification number: G06F17/5009 , G06F17/15 , G06F17/5068 , G06F2217/78 , G06F2217/80
Abstract: Systems and methods for performing thermal simulations of a system are disclosed herein in. In one embodiment, a computer-implemented method for thermal simulation comprises determining a leakage power profile for a circuit in the system, adding the leakage power profile to a dynamic power profile of the circuit to obtain a combined power profile, and convolving the combined power profile with an impulse response to obtain a thermal response at a location on the system.
Abstract translation: 用于执行系统的热仿真的系统和方法在本文中公开。在一个实施例中，用于热仿真的计算机实现的方法包括确定系统中的电路的泄漏功率分布，将泄漏功率分布添加到动态功率分布 以获得组合的功率曲线，以及将组合的功率曲线与脉冲响应进行卷积以在系统上的位置处获得热响应。
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5.发明申请公开(公告)号：US20180143853A1
公开(公告)日：2018-05-24
申请号：US15398864
申请日：2017-01-05
Applicant: QUALCOMM INCORPORATED
Inventor： Mehdi Saeidi , Niladri Mojumder , Min Chen , Rajat Mittal , Rajit Chandra
CPC classification number: G06F9/44505 , G06F9/5027 , G06F9/5061
Abstract: A system includes a computer processor including N cores; and a plurality of device aging sensors, wherein each one of the plurality of device aging sensors is disposed within a respective core, the plurality of device aging sensors being configured to communicate core aging information with a core scheduler in the computer processor, wherein the core scheduler is configured to make a first set of M cores available to a thread scheduler and remaining cores of the N cores unavailable to the thread scheduler in a first time period in which the core aging information indicates that aging of the first set of M cores is below a threshold, and wherein the core scheduler is configured to make a second set of M cores available to the thread scheduler and remaining cores of the N cores unavailable to the thread scheduler in a second time period.
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Patent Agency Ranking
公开(公告)号：US09817470B2
公开(公告)日：2017-11-14
申请号：US15052786
申请日：2016-02-24
Applicant: QUALCOMM Incorporated
Inventor： Suresh Sugumar , Jeffrey Gemar , Ali Taha , Amy Derbyshire , Tao Xue , Mohammad Tamjidi , Rajat Mittal
IPC: G06F1/32
CPC classification number: G06F1/3296 , G06F1/3206 , G06F1/3243 , G06F1/3287 , G06F9/30189 , G06F9/3836 , G06F9/3861 , G06F9/3885 , Y02D10/152
Abstract: An apparatus includes a first circuit and a second circuit sharing an instruction stream. A voltage controller circuit is configured to provide an operation voltage and at least one low-power voltage to the second circuit independent of a supply voltage of the first circuit in response to a sequence of the instruction stream. In another aspect, a method of operating a power management function is presented. The method includes providing an instruction stream for a first circuit and a second circuit and providing selectively an operation voltage and at least one low-power voltage to the second circuit independent of a supply voltage of the first circuit in response to a sequence of the instruction stream.
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公开(公告)号：US09629233B2
公开(公告)日：2017-04-18
申请号：US14732787
申请日：2015-06-08
Applicant: QUALCOMM Incorporated
Inventor： Mehdi Saeidi , Arpit Mittal , Emil Rahim , Rajat Mittal , Kambiz Samadi
IPC: H05K7/20 , H05K1/02 , G05B15/02 , H01L23/473
CPC classification number: H05K1/0203 , G05B15/02 , H05K1/0209 , H05K1/0272 , H05K7/20145 , H05K7/20172 , H05K7/20209 , H05K2201/064
Abstract: Methods and apparatus for implementing a synthetic jet to cool a device are provided. Examples of the techniques keep a device case cool enough to be hand-held, while allowing a higher temperature of a circuit component located in the case, to maximize circuit performance. In an example, provided is a mobile device including a synthetic jet configured to transfer heat within the mobile device. The synthetic jet can be embedded in a circuit board inside the mobile device such that the circuit board defines at least a portion of a chamber of the synthetic jet and defines an orifice of the synthetic jet. The device case can define at least one fluid channel inside the mobile device. Also, the circuit board can define a synthetic jet outlet configured to direct a fluid at the at least one fluid channel. Also provided are methods for controlling a synthetic jet.
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公开(公告)号：US09582052B2
公开(公告)日：2017-02-28
申请号：US14675409
申请日：2015-03-31
Applicant: QUALCOMM Incorporated
Inventor： Rajat Mittal , Madan Krishnappa , Rajit Chandra , Mohammad Tamjidi
CPC classification number: G06F1/324 , G06F1/206 , G06F1/3203 , G06F1/3206 , G06F1/3287 , G06F1/329 , G06F1/3296 , G06F9/4856 , G06F9/5088 , G06F9/5094 , Y02D10/126 , Y02D10/16 , Y02D10/171 , Y02D10/172 , Y02D10/22 , Y02D10/24 , Y02D10/32
Abstract: A method, an apparatus, and a computer program product are provided. The apparatus may be a UE. The UE has a processor including a plurality of cores. The plurality of cores includes a first core and remaining cores. The UE determines a temperature of the first core of the plurality of cores. The first core processes a load. The UE determines that the temperature of the first core is greater than a first threshold. The UE determines that the temperature of the first core is not greater than a second threshold. The second threshold is greater than the first threshold. The UE transfers at least a portion of the load of the first core to a second core of the remaining cores in response to determining that the temperature of the first core is greater than the first threshold.
Abstract translation: 提供了一种方法，装置和计算机程序产品。 该装置可以是UE。 UE具有包括多个核的处理器。 多个芯包括第一芯和剩余芯。 UE确定多个核心的第一核心的温度。 第一个核心处理一个负载。 UE确定第一核的温度大于第一阈值。 UE确定第一核心的温度不大于第二阈值。 第二阈值大于第一阈值。 响应于确定第一核心的温度大于第一阈值，UE将第一核心的至少一部分负载传送到剩余核心的第二核心。
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公开(公告)号：US20160062422A1
公开(公告)日：2016-03-03
申请号：US14836572
申请日：2015-08-26
Applicant: QUALCOMM Incorporated
Inventor： Rajat Mittal , Mehdi Saeidi
CPC classification number: G06F1/206 , G06F1/3234 , G06F1/324 , G06F1/3296 , H03K19/0008 , Y02D10/126 , Y02D10/16 , Y02D10/172
Abstract: A performance setting technique is disclosed for a clocked circuit such as a processor in an integrated circuit. The technique determines a maximum power consumption for the clocked circuit as a function of a total thermal resistance of a mobile device incorporating the integrated circuit. The total thermal resistance is a sum of a system thermal resistance for the mobile device and a device thermal resistance for the integrated circuit.
Abstract translation: 针对诸如集成电路中的处理器的时钟控制电路公开了一种性能设置技术。 该技术确定了时钟控制电路的最大功耗作为结合集成电路的移动设备的总热阻的函数。 总热阻是移动设备的系统热阻和集成电路的器件热阻之和。
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公开(公告)号：US10358230B2
公开(公告)日：2019-07-23
申请号：US15263267
申请日：2016-09-12
Applicant: QUALCOMM Incorporated
Inventor： Vivek Sahu , Mehdi Saeidi , Rajat Mittal , Melika Roshandell
Abstract: A drone adapted for flight may include propellers that may be powered by motors to move the drone. The drone may include a processing component and arms for supporting each of the propellers. At least a portion of at least one of the arms may include a first thermal spreading material that is coupled to the processing component. Each of the arms may be exposed to the air.
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