公开(公告)号：US09629233B2

公开(公告)日：2017-04-18

申请号：US14732787

申请日：2015-06-08

Applicant: QUALCOMM Incorporated

Inventor： Mehdi Saeidi ,  Arpit Mittal ,  Emil Rahim ,  Rajat Mittal ,  Kambiz Samadi

IPC: H05K7/20 ,  H05K1/02 ,  G05B15/02 ,  H01L23/473

CPC classification number: H05K1/0203 ,  G05B15/02 ,  H05K1/0209 ,  H05K1/0272 ,  H05K7/20145 ,  H05K7/20172 ,  H05K7/20209 ,  H05K2201/064

Abstract: Methods and apparatus for implementing a synthetic jet to cool a device are provided. Examples of the techniques keep a device case cool enough to be hand-held, while allowing a higher temperature of a circuit component located in the case, to maximize circuit performance. In an example, provided is a mobile device including a synthetic jet configured to transfer heat within the mobile device. The synthetic jet can be embedded in a circuit board inside the mobile device such that the circuit board defines at least a portion of a chamber of the synthetic jet and defines an orifice of the synthetic jet. The device case can define at least one fluid channel inside the mobile device. Also, the circuit board can define a synthetic jet outlet configured to direct a fluid at the at least one fluid channel. Also provided are methods for controlling a synthetic jet.

公开(公告)号：US09405375B2

公开(公告)日：2016-08-02

申请号：US14026973

申请日：2013-09-13

Applicant: QUALCOMM Incorporated

Inventor： Arpit Mittal

IPC: G06F3/01 ,  G06F3/00 ,  G06K9/00

CPC classification number: G06F3/017 ,  G06F3/005 ,  G06K9/00355

Abstract: Methods and apparatuses of the present disclosure are presented for recognizing a gesture of a gesture object in a plurality of recorded data objects, with the recorded data objects being recorded over time. In some embodiments, a method includes computing at least one set of gesture angles using the plurality of recorded data objects, wherein each of the gesture angles in the at least one set comprises an angle measurement between two positions of the gesture object, the two positions recorded in successive data objects in the plurality of recorded data objects, and recognizing the gesture based on the at least one set of gesture angles. In some embodiments, the method includes recognizing the gesture is based further on comparing the at least one set of gesture angles to a gesture model.

Abstract translation: 呈现本公开的方法和装置用于在多个记录的数据对象中识别手势对象的手势，随着时间的推移记录所记录的数据对象。 在一些实施例中，一种方法包括使用所述多个记录的数据对象来计算至少一组手势角度，其中所述至少一个组中的每个手势角度包括所述手势对象的两个位置之间的角度测量， 记录在所述多个记录数据对象中的连续数据对象中，以及基于所述至少一组姿势角识别所述手势。 在一些实施例中，该方法包括识别手势进一步基于将至少一组手势角度与手势模型进行比较。

公开(公告)号：US10133342B2

公开(公告)日：2018-11-20

申请号：US13767820

申请日：2013-02-14

Applicant: QUALCOMM Incorporated

Inventor： Arpit Mittal ,  Giuliano Maciocci ,  Michael L. Tunmer ,  Paul Mabbutt

IPC: G06F3/01 ,  G06T19/00 ,  G06F3/03 ,  G06F3/0484 ,  G02B27/01 ,  G02B27/00

Abstract: Methods, systems, computer-readable media, and apparatuses for selecting an Augmented Reality (AR) object on a head mounted device (HMD) are presented. In some embodiments, an HMD may define a Region-of-Interest (ROI) based on a gesture formed by at least one hand of a user. Subsequently the HMD may display to the user a shape on the HMD. In at least one arrangement, the shape outlines the ROI. Additionally, the HMD may display to the user a plurality of AR objects, each of the plurality of AR objects being associated with a target inside the ROI. Furthermore, the HMD may reduce the size of the ROI based on a first movement of the at least one hand of the user to form a reduced-sized ROI. In at least one arrangement, the reduced-sized ROI is used to select a specific AR object from the plurality of AR objects.

公开(公告)号：US20160334845A1

公开(公告)日：2016-11-17

申请号：US14709276

申请日：2015-05-11

Applicant: QUALCOMM Incorporated

Inventor： Rajat Mittal ,  Hee Jun Park ,  Peng Wang ,  Mehdi Saeidi ,  Arpit Mittal

IPC: G06F1/20 ,  H01L25/10

CPC classification number: G06F1/206 ,  G01K7/04 ,  G05D23/1906 ,  H01L23/34 ,  H01L23/3677 ,  H01L23/38 ,  H01L23/49811 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1094 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package-on-package (PoP) device includes a first package, a second package, and a bi-directional thermal electric cooler (TEC). The first package includes a first substrate and a first die coupled to the first substrate. The second package is coupled to the first package. The second package includes a second substrate and a second die coupled to the second substrate. The TEC is located between the first die and the second substrate. The TEC is adapted to dynamically dissipate heat back and forth between the first package and the second package. The TEC is adapted to dissipate heat from the first die to the second die in a first time period. The TEC is further adapted to dissipate heat from the second die to the first die in a second time period. The TEC is adapted to dissipate heat from the first die to the second die through the second substrate.

Abstract translation: 封装封装（PoP）器件包括第一封装，第二封装和双向热电冷却器（TEC）。 第一封装包括第一基板和耦合到第一基板的第一管芯。 第二个包装耦合到第一个包装。 第二包装包括第二基板和耦合到第二基板的第二管芯。 TEC位于第一模具和第二基板之间。 TEC适于在第一包装和第二包装之间动态地散发热量。 TEC适于在第一时间段内将热量从第一管芯散热到第二管芯。 TEC进一步适于在第二时间段内将热量从第二管芯传送到第一管芯。 TEC适于通过第二衬底将热量从第一裸片散发到第二裸片。

公开(公告)号：US09971368B2

公开(公告)日：2018-05-15

申请号：US14963790

申请日：2015-12-09

Applicant: QUALCOMM Incorporated

Inventor： Rajat Mittal ,  Mehdi Saeidi ,  Arpit Mittal ,  Emil Rahim

IPC: G05F1/46 ,  G01K13/00

CPC classification number: G05F1/463 ,  G01K13/00 ,  G06F1/206 ,  G06F1/3206

Abstract: In one embodiment, a temperature management system comprises a plurality of temperature sensors on a chip, and a temperature manager. The temperature manager is configured to receive a plurality of temperature readings from the temperature sensors, to determine a plurality of power values based on the temperature readings, to determine a plurality of temperature values based on the determined power values, the determined temperature values corresponding to a plurality of different locations on the chip, and to estimate a temperature of a hotspot on the chip based on the determined temperature values.

公开(公告)号：US09746889B2

公开(公告)日：2017-08-29

申请号：US14709276

申请日：2015-05-11

Applicant: QUALCOMM Incorporated

Inventor： Rajat Mittal ,  Hee Jun Park ,  Peng Wang ,  Mehdi Saeidi ,  Arpit Mittal

IPC: H01L29/15 ,  H01L21/20 ,  G06F1/20 ,  H01L23/34 ,  H01L23/38 ,  H01L25/065 ,  H01L25/10 ,  G01K7/04 ,  G05D23/19 ,  H01L23/498 ,  H01L23/367

CPC classification number: G06F1/206 ,  G01K7/04 ,  G05D23/1906 ,  H01L23/34 ,  H01L23/3677 ,  H01L23/38 ,  H01L23/49811 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1094 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package-on-package (PoP) device includes a first package, a second package, and a bi-directional thermal electric cooler (TEC). The first package includes a first substrate and a first die coupled to the first substrate. The second package is coupled to the first package. The second package includes a second substrate and a second die coupled to the second substrate. The TEC is located between the first die and the second substrate. The TEC is adapted to dynamically dissipate heat back and forth between the first package and the second package. The TEC is adapted to dissipate heat from the first die to the second die in a first time period. The TEC is further adapted to dissipate heat from the second die to the first die in a second time period. The TEC is adapted to dissipate heat from the first die to the second die through the second substrate.

公开(公告)号：US20170083063A1

公开(公告)日：2017-03-23

申请号：US14860127

申请日：2015-09-21

Applicant: QUALCOMM Incorporated

Inventor： Mehdi Saeidi ,  Melika Roshandell ,  Arpit Mittal ,  Farsheed Mahmoudi

IPC: G06F1/20 ,  G01K7/22

CPC classification number: G06F1/206 ,  G01K7/22 ,  Y02D10/16

Abstract: A method includes: receiving an electrical signal from a temperature sensor, wherein the temperature sensor is disposed within a package including a processor chip, further wherein the temperature sensor is thermally separated from the processor chip by materials within the package, generating temperature information from the electrical signal, processing the temperature information to determine that a performance of the processor chip should be mitigate, and mitigating the performance of the processor chip in response to the temperature information, wherein processing the temperature information and mitigating the performance of the processor are performed by the processor chip.

公开(公告)号：US20160216719A1

公开(公告)日：2016-07-28

申请号：US14603058

申请日：2015-01-22

Applicant: QUALCOMM, Incorporated

Inventor： Mehdi Saeidi ,  Rajat Mittal ,  Arpit Mittal ,  Ryan Michael Coutts

IPC: G05D23/19 ,  G05B15/02

CPC classification number: G05D23/1917 ,  G01K3/08 ,  G01K3/10 ,  G05B15/02 ,  G06F1/206

Abstract: In one embodiment, a method of temperature control comprises receiving temperature readings from a temperature sensor on a chip, calculating one or more second derivatives of temperature with respect to time based on the temperature readings, and determining whether to perform temperature mitigation on the chip based on the one or more calculated second derivatives of temperature.

Abstract translation: 在一个实施例中，温度控制的方法包括从芯片上的温度传感器接收温度读数，基于温度读数计算温度相对于时间的一个或多个二次导数，以及确定是否在基于芯片的基础上执行温度降低 在一个或多个计算的温度的二阶导数上。

公开(公告)号：US11262835B2

公开(公告)日：2022-03-01

申请号：US16141915

申请日：2018-09-25

Applicant: QUALCOMM Incorporated

Inventor： Arpit Mittal ,  Giuliano Maciocci ,  Michael L. Tunmer ,  Paul Mabbutt

IPC: G06F3/01 ,  G06F3/03 ,  G06F3/0484 ,  G02B27/00 ,  G02B27/01 ,  G06T19/00 ,  G06F3/04842

Abstract: Methods, systems, computer-readable media, and apparatuses for selecting an Augmented Reality (AR) object on a head mounted device (HMD) are presented. In some embodiments, an HMD may define a Region-of-Interest (ROI) based on a gesture formed by at least one hand of a user. Subsequently the HMD may display to the user a shape on the HMD. In at least one arrangement, the shape outlines the ROI. Additionally, the HMD may display to the user a plurality of AR objects, each of the plurality of AR objects being associated with a target inside the ROI. Furthermore, the HMD may reduce the size of the ROI based on a first movement of the at least one hand of the user to form a reduced-sized ROI. In at least one arrangement, the reduced-sized ROI is used to select a specific AR object from the plurality of AR objects.

公开(公告)号：US20170075397A1

公开(公告)日：2017-03-16

申请号：US14852941

申请日：2015-09-14

Applicant: QUALCOMM Incorporated

Inventor： Mehdi Saeidi ,  Arpit Mittal ,  Farsheed Mahmoudi ,  Rajat Mittal

IPC: G06F1/20 ,  G06F1/32

CPC classification number: G06F1/206 ,  G06F1/3206 ,  G06F1/3234 ,  G06F1/3237 ,  G06F1/324 ,  Y02D10/126 ,  Y02D10/128 ,  Y02D10/16

Abstract: A method includes: generating a power consumption reading indicative of power consumption of a device, comparing the power consumption reading to a power threshold, wherein the power threshold represents a level of power consumption corresponding to a rise in temperature of an exterior surface of the device; in response to determining that the power consumption reading exceeds the power threshold, measuring cumulative power consumption over time from the power consumption reading; comparing the cumulative power consumption over time to an energy threshold, wherein the energy threshold corresponds to a temperature threshold for the exterior surface of the device; and in response to determining that the cumulative power consumption over time exceeds the energy threshold, reducing an operating parameter of the device to reduce power consumption.

Abstract translation: 一种方法包括：产生指示设备的功耗的功率消耗读数，将功耗读取与功率阈值进行比较，其中功率阈值表示与设备的外表面的温度升高相对应的功耗水平 ; 响应于确定所述功耗读数超过所述功率阈值，从所述功耗读数测量随时间的累积功耗; 将随时间的累积功耗与能量阈值进行比较，其中所述能量阈值对应于所述装置的外表面的温度阈值; 并且响应于确定随着时间的累积功率消耗超过能量阈值，减少设备的操作参数以降低功耗。