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    Method of producing printed circuit boards and a heat sink arrangement produced in accordance with the method
    1.
    发明授权
    Method of producing printed circuit boards and a heat sink arrangement produced in accordance with the method 有权
    制造印刷电路板的方法和根据该方法制造的散热装置

    公开(公告)号：US06459585B1

    公开(公告)日：2002-10-01

    申请号：US09520840

    申请日：2000-03-08

    申请人： Leif Bergstedt ,  Per Ligander

    发明人： Leif Bergstedt ,  Per Ligander

    IPC分类号： H05K720

    CPC分类号： H05K1/0204 ,  H05K3/4046 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/10416 ,  H05K2201/1059 ,  H05K2201/10689

    摘要： A component (16) mounted on the board (20) is cooled by a cooling surface (15) in contact with a heat sink element in the form of a metal stud (8) which, in turn, may be connected to an outer cooling surface. One method of achieving this is to form holes (4) in a laminate (1), etching patterns (5), placing a metal stud (8) in the hole (4), applying a dielectric (9) to the upper and lower side of the laminate (1), forming openings (14) in the dielectric (9), and thereafter metal plating the entire circuit board and etching further patterns. Component 16 can then be mounted on the printed circuit board (20). A heat sink element (8) includes a cutting edge (18) and can be used beneficially in conjunction with one embodiment of the method.

    摘要翻译： 安装在板（20）上的部件（16）被冷却表面（15）冷却，该冷却表面与金属螺柱（8）形式的散热元件接触，冷却表面又可以连接到外部冷却 表面。 实现这一点的一种方法是在层叠体（1）中形成孔（4），蚀刻图案（5），将金属柱（8）放置在孔（4）中，将电介质（9）施加到上下 （1）的侧面，在电介质（9）中形成开口（14），然后金属电镀整个电路板并蚀刻其它图案。 组件16然后可以安装在印刷电路板（20）上。 散热元件（8）包括切割边缘（18）并且可以有益地使用该方法的一个实施例。

    Method and an arrangement in an electronics system
    2.
    发明授权
    Method and an arrangement in an electronics system 有权
    电子系统中的方法和装置

    公开(公告)号：US06230401B1

    公开(公告)日：2001-05-15

    申请号：US09143436

    申请日：1998-08-28

    申请人： Per Ligander ,  Leif Bergstedt

    发明人： Per Ligander ,  Leif Bergstedt

    IPC分类号： H05K302

    CPC分类号： H01P11/003 ,  H05K1/0218 ,  H05K1/024 ,  H05K3/0023 ,  H05K3/386 ,  H05K3/4685 ,  H05K3/4697 ,  H05K2201/0355 ,  H05K2201/0715 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： The invention relates to a method and an apparatus for making an air gap (L, 1a) over at least one conductor (5, 5a) on a printed circuit board (1), minimizing the losses in the conductor (5, 5a). The well known Sequential Build Up (SBU) technology is used, wherein a carrier (3) with the conductor (5, 5a) is covered by a photosensitive varnish layer (7, 7a). An opening (8, 8a) is made in the varnish layer (7, 7a) above the conductor (5, 5a) by a photographic method. A metal layer (11, 11a) is then fastened to the varnish layer (7, 7a) covering at least said opening 88, 8a) so that an air gap (L, 1a) is formed between the conductor (5, 5a) and the metal layer (11, 11a). The resulting circuit board (1) has an air gap (L, 1a) well adapted to the conductor (5, 5a). According to an alternative inventive method the carrier (3) also comprises a lower conductor (5b) placed opposite to the conductor (5a) described above on the opposite side of the carrier. In the same way as above the lower carrier (5b) is provided with an air gap (1b). A layer (13) of dielectric material can be fixed to the metal layer (11) to obtain a more rigid construction.

    摘要翻译： 本发明涉及一种用于在印刷电路板（1）上的至少一个导体（5,5a）上形成气隙（L，1a）的方法和装置，使导体（5,5a）中的损耗最小化。 使用众所周知的顺序构建（SBU）技术，其中具有导体（5,5a）的载体（3）被感光漆层（7,7a）覆盖。 通过照相方法在导体（5,5a）上方的清漆层（7,7a）中形成开口（8,8a）。 然后将金属层（11,11a）紧固到覆盖至少所述开口88,8a）的清漆层（7,7a），使得在导体（5,5a）和 金属层（11,11a）。 所得到的电路板（1）具有适合于导体（5,5a）的气隙（L，1a）。 根据替代的本发明方法，载体（3）还包括在载体的相对侧上与上述导体（5a）相对放置的下导体（5b）。 以与上述相同的方式，下部载体（5b）设置有气隙（1b）。 可以将电介质材料层（13）固定在金属层（11）上以获得更刚性的结构。

    Printed circuit board integrated switch
    5.
    发明授权
    Printed circuit board integrated switch 有权
    印刷电路板集成开关

    公开(公告)号：US07102480B2

    公开(公告)日：2006-09-05

    申请号：US10475137

    申请日：2001-04-17

    申请人： Leif Bergstedt ,  Kent Falk ,  Per Ligander

    发明人： Leif Bergstedt ,  Kent Falk ,  Per Ligander

    IPC分类号： H01F27/28

    CPC分类号： H01H50/005 ,  H05K1/16

    摘要： A printed circuit board includes a first layer on which a first stationary contact terminal is formed and one or more second layers spaced apart from the first layer by at least one intermediate layer. A portion of the one or more second layers extends into a recess formed by a discontinuity of the intermediate layers. The portion is flexible and has a second terminal which can be brought into contact with the first stationary terminal.

    摘要翻译： 印刷电路板包括形成有第一固定接触端子的第一层和通过至少一个中间层与第一层隔开的一个或多个第二层。 一个或多个第二层的一部分延伸到由中间层的不连续形成的凹部中。 该部分是柔性的并且具有能够与第一固定端子接触的第二端子。

    Microstrip structure
    6.
    发明授权
    Microstrip structure 失效
    微带结构

    公开(公告)号：US5977915A

    公开(公告)日：1999-11-02

    申请号：US104328

    申请日：1998-06-25

    申请人： Leif Bergstedt ,  Per Ligander

    发明人： Leif Bergstedt ,  Per Ligander

    IPC分类号： H01P3/08 ,  H01Q1/38 ,  H01Q13/08 ,  H01Q21/00

    CPC分类号： H01P3/081 ,  H01P3/087 ,  H01Q1/38 ,  H01Q21/0075

    摘要： An environmentally compatible microstrip structure for electromagnetic signals in the microwave frequency range and higher. The microstrip structure according to the invention comprises at least two dielectric bodies made of an inorganic non-metallic material. Conductors of the microstrip structure are disposed on a first dielectric body. The ground plane of the microstrip structure is disposed on a second dielectric body. The dielectric bodies are so oriented that the second dielectric is between the at least one conductor and the ground plane while the first dielectric body is not. At least one cavitity is formed in the second dielectric body around at least one of the conductors to thereby create a composite dielectric comprising gas/air/vacuum of the cavity and the second dielectric body. The composite dielectric giving the microstrip structure adequate performance with dielectrically poor but environmentally compatible dielectric materials forming the dielectric bodies.

    摘要翻译： 微波频率范围内的电磁信号环境友好的微带结构。 根据本发明的微带结构包括由无机非金属材料制成的至少两个介电体。 微带结构的导体设置在第一绝缘体上。 微带结构的接地平面设置在第二电介质体上。 介电体的取向使得第二电介质位于至少一个导体和接地平面之间，而第一绝缘体不是。 在第二绝缘体中至少一个导体周围形成至少一个空穴，从而形成包括空腔的气体/空气/真空和第二介电体的复合电介质。 复合电介质为微带结构提供了足够的性能，介质形成介质较薄但环境友好的介电材料。

    Arrangement relating to conductor carriers and methods for the manufacture of such carriers
    7.
    发明授权
    Arrangement relating to conductor carriers and methods for the manufacture of such carriers 有权
    有关导体载体的安排和制造这种载体的方法

    公开(公告)号：US06617509B1

    公开(公告)日：2003-09-09

    申请号：US09495481

    申请日：2000-02-01

    申请人： Leif Bergstedt ,  Per Ligander ,  Spartak Gevorgian

    发明人： Leif Bergstedt ,  Per Ligander ,  Spartak Gevorgian

    IPC分类号： H01B734

    CPC分类号： H05K1/162 ,  H05K1/0231 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/0367 ,  H05K2201/09318

    摘要： Method and arrangements for reducing crosstalk between conductors on a conductor carrier, and methods for manufacturing conductor carriers including these arrangements are presented. Crosstalk between the conductors is prevented by providing a dielectric material in the space between each conductor and an earth plane so that the electric field can be tied down within this space and thus prevent leakage of field lines to the co-lateral conductors. The capacitance is increased by an arrangement in the space immediately beneath the conductor so as to reduce the distance between conductors and the earth plane and/or through the medium of a dielectric material that has a higher dielectric index &egr;r than the dielectric material.

    摘要翻译： 介绍了减少导体载体上导体之间串扰的方法和装置，以及制造包括这些布置在内的导体载体的方法。 通过在每个导体和接地平面之间的空间中提供介电材料来防止导体之间的串扰，使得电场可以在该空间内被束缚，并且因此防止了场线到同侧导体的泄漏。 通过在导体的正下方的空间中的布置来增加电容，以便减小导体与接地面之间的距离和/或通过介电材料的介质，该介质具有比介电材料更高的介电常数εir。

    Method of manufacturing a printed board assembly
    8.
    发明授权
    Method of manufacturing a printed board assembly 有权
    制造印刷电路板组件的方法

    公开(公告)号：US07051430B2

    公开(公告)日：2006-05-30

    申请号：US10369873

    申请日：2003-02-19

    申请人： Leif Bergstedt ,  Per Ligander ,  Katarina Boustedt

    发明人： Leif Bergstedt ,  Per Ligander ,  Katarina Boustedt

    IPC分类号： H05K3/36 ,  H05K1/00 ,  H01L29/04 ,  H01L31/036

    CPC分类号： H05K1/186 ,  H05K1/185 ,  H05K3/386 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0187 ,  H05K2201/0195 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49169

    摘要： Methods of manufacturing a printed board assembly. In one embodiment, a substrate is coated with an electrically conducting material; electrical components are mounted on some areas of the substrate; non-conducting material is disposed in areas between the electrical components; the substrate, electrical components and non-conducting material are sandwiched between two sheets of resin coated conducting foil, wherein the resin on the foils faces the substrate and buries the electrical components; circuit patterns are etched in the exposed surfaces of the resin coated conducting foils; and, electrical connections are established between at least one of the resin coated conducting foils and the electronic components.

    摘要翻译： 制造印刷电路板组件的方法。 在一个实施例中，衬底被涂覆有导电材料; 电气部件安装在基板的一些区域上; 非导电材料设置在电气部件之间的区域中; 基板，电气部件和非导电材料夹在两片树脂涂覆的导电箔之间，其中箔上的树脂面向基板并埋入电气部件; 在树脂涂覆的导电箔的暴露表面中蚀刻电路图案; 并且在至少一个树脂涂覆的导电箔和电子部件之间建立电连接。

    PCB and method for making PCB with thin copper layer
    9.
    发明授权
    PCB and method for making PCB with thin copper layer 有权
    PCB和PCB薄膜制作方法

    公开(公告)号：US06395378B2

    公开(公告)日：2002-05-28

    申请号：US09753653

    申请日：2001-01-04

    申请人： Leif Bergstedt ,  Per Ligander

    发明人： Leif Bergstedt ,  Per Ligander

    IPC分类号： B32B300

    CPC分类号： H05K3/387 ,  H05K1/0366 ,  H05K3/381 ,  H05K3/426 ,  H05K2203/0759 ,  Y10S428/901 ,  Y10T428/24355 ,  Y10T428/24917 ,  Y10T428/24994

    摘要： The invention concerns a PC board with laminates for electrical circuits, the PC board comprising at least one carrier (1) and at least one copper surface layer (7), intended to, after the removal of selected parts, e.g. by etching, function as conductors on the PC board. The new thing is that the carrier at least at some parts has a surface roughness of up to mainly the same size as the thickness of the copper layer and that at least at the above named rough parts is arranged a surface levelling layer (5a,b) between the carrier (1) and the copper layer (7). Further, the invention concerns a method for producing PC board laminate for electrical circuits as above, the laminate comprising a copper layer and a carrier that has a surface roughness of mainly the same size as the thickness of the copper layer. The new thing here is that a layer (5a,b) of liquid epoxy is applied on the one or those surface parts of the carrier which in the end are to carry a copper layer, that the epoxy layer is dried and hardened, and that copper layers (7) are plated on the epoxy layers (5a,b).

    摘要翻译： 本发明涉及一种具有用于电路的层压板的PC板，所述PC板包括至少一个载体（1）和至少一个铜表面层（7），所述至少一个铜表面层（7）在去除所选择的部分之后，例如， 通过蚀刻，作为PC板上的导体。 至少在某些部位的载体至少具有与铜层的厚度大致相同的表面粗糙度，并且至少在上述粗糙部分上布置有表面平整层（5a，b） ）在载体（1）和铜层（7）之间。 此外，本发明涉及一种如上制造的用于电路的PC板层叠体的方法，该层压体包括铜层和具有与铜层的厚度大致相同尺寸的表面粗糙度的载体。 这里的新事物是，在载体的一个或那些表面部分上施加液体环氧树脂层（5a，b），其最终将携带铜层，使环氧树脂层被干燥和硬化，并且 铜层（7）镀在环氧树脂层（5a，b）上。