Patent search ap:("Panasonic Intellectual Property Management Co. Page Ltd.") AND inv:"Toshikazu Imai"

1.

外观设计
Semiconductor device 有权

公开(公告)号：USD938925S1

公开(公告)日：2021-12-21

申请号：US29710616

申请日：2019-10-24

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Designer： Ryosuke Okawa , Toshikazu Imai , Kazuma Yoshida , Tsubasa Inoue , Takeshi Imamura

2.

发明授权
Semiconductor device 有权

公开(公告)号：US10854744B2

公开(公告)日：2020-12-01

申请号：US16447100

申请日：2019-06-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yoshihiro Matsushima , Shigetoshi Sota , Eiji Yasuda , Toshikazu Imai , Ryosuke Okawa , Kazuma Yoshida , Ryou Kato

IPC: H01L23/15 , H01L29/78 , H01L27/088

Abstract: A semiconductor device includes an N-type semiconductor substrate comprising silicon, an N-type low-concentration impurity layer that is in contact with the upper surface of the N-type semiconductor substrate, a metal layer that is in contact with the entire lower surface of the N-type semiconductor substrate and has a thickness of at least 20 μm, and first and second vertical MOS transistors formed in the low-concentration impurity layer. The ratio of the thickness of the metal layer to the thickness of a semiconductor layer containing the N-type semiconductor substrate and the low-concentration impurity layer is greater than 0.27. The semiconductor device further includes a support comprising a ceramic material and bonded to the entire lower surface of the metal layer only via a bonding layer.

3.

发明授权
Semiconductor device and semiconductor module 有权

公开(公告)号：US10541310B2

公开(公告)日：2020-01-21

申请号：US16418617

申请日：2019-05-21

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Kazuma Yoshida , Takeshi Imamura , Toshikazu Imai , Ryosuke Okawa , Ryou Kato

IPC: H01L29/417 , H01L29/78 , H01L27/088 , H01L23/00 , H01L29/423

Abstract: A semiconductor device includes a first gate electrode, a plurality of first source electrodes, a second gate electrode, and a plurality of second source electrodes. The first gate electrode is arranged with no other electrode between the first gate electrode and a first short side of the semiconductor substrate. The plurality of first source electrodes include a plurality of approximately rectangular first source electrodes arranged in stripes extending parallel to the lengthwise direction of the semiconductor substrate. The second gate electrode is arranged with no other electrode between the second gate electrode and a second short side of the semiconductor substrate. The plurality of second source electrodes include a plurality of approximately rectangular second source electrodes arranged in stripes extending parallel to the lengthwise direction of the semiconductor substrate.

4.

发明申请
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND PACKAGED SEMICONDUCTOR DEVICE 审中-公开

公开(公告)号：US20190157403A1

公开(公告)日：2019-05-23

申请号：US16261232

申请日：2019-01-29

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Eiji Yasuda , Toshikazu Imai , Ryosuke Okawa , Takeshi Imamura , Mitsuaki Sakamoto , Kazuma Yoshida , Masaaki Hirako , Yasuyuki Masumoto , Shigetoshi Sota , Tomonari Oota

IPC: H01L29/417 , H01L29/36 , H01L29/78 , H01L27/088 , H01L23/498 , H01L23/13 , H01L29/45 , H01L23/00

Abstract: A semiconductor device includes a semiconductor substrate including a first conductivity-type impurity, a low-concentration impurity layer including a first conductivity-type impurity having a concentration lower than a concentration of the first conductivity-type impurity in the semiconductor substrate, a backside electrode including a metal material, and first and second transistors in the low-concentration impurity layer. The first transistor includes a first source electrode and a first gate electrode on a surface of the low-concentration impurity layer, the second transistor includes a second source electrode and a second gate electrode on the surface of the low-concentration impurity layer. The semiconductor substrate serves as a common drain region of the transistors. The thickness of the backside electrode ranges from 25 to 35 μm, and the ratio of the thickness of the backside electrode to the thickness of a semiconductor layer including the semiconductor substrate and the low-concentration impurity layer is 0.32 or more.

5.

发明授权
Semiconductor device and semiconductor module 有权

公开(公告)号：US10340347B1

公开(公告)日：2019-07-02

申请号：US16146272

申请日：2018-09-28

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Kazuma Yoshida , Takeshi Imamura , Toshikazu Imai , Ryosuke Okawa , Ryou Kato

IPC: H01L29/417 , H01L23/00 , H01L27/088 , H01L29/423 , H01L29/78

CPC classification number: H01L29/41775 , H01L23/562 , H01L27/088 , H01L29/41741 , H01L29/4236 , H01L29/7827

Abstract: A semiconductor device includes a first gate electrode, a plurality of first source electrodes, a second gate electrode, and a plurality of second source electrodes. The first gate electrode is arranged with no other electrode between the first gate electrode and a first short side of the semiconductor substrate. The plurality of first source electrodes include a plurality of approximately rectangular first source electrodes arranged in stripes extending parallel to the lengthwise direction of the semiconductor substrate. The second gate electrode is arranged with no other electrode between the second gate electrode and a second short side of the semiconductor substrate. The plurality of second source electrodes include a plurality of approximately rectangular second source electrodes arranged in stripes extending parallel to the lengthwise direction of the semiconductor substrate.