-
公开(公告)号:US10903359B2
公开(公告)日:2021-01-26
申请号:US16488199
申请日:2019-01-17
Inventor: Chie Fujioka , Hiroshi Yoshida , Yoshihiro Matsushima , Hideki Mizuhara , Masao Hamasaki , Mitsuaki Sakamoto
IPC: H01L29/78 , H01L23/538 , H01L27/088
Abstract: A semiconductor device includes: a semiconductor layer that includes principal surfaces; a metal layer that includes principal surfaces, is disposed with the principal surface in contact with the principal surface, is thicker than the semiconductor layer, and comprises a first metal material; a metal layer that includes principal surfaces, is disposed with the principal surface in contact with the principal surface, and comprises a metal material having a Young's modulus greater than that of the first metal material; and transistors. The transistor includes a source electrode and a gate electrode on a side facing the principal surface. The transistor includes a source electrode and a gate electrode on a side facing the principal surface.
-
公开(公告)号:US20190157403A1
公开(公告)日:2019-05-23
申请号:US16261232
申请日:2019-01-29
Inventor: Eiji Yasuda , Toshikazu Imai , Ryosuke Okawa , Takeshi Imamura , Mitsuaki Sakamoto , Kazuma Yoshida , Masaaki Hirako , Yasuyuki Masumoto , Shigetoshi Sota , Tomonari Oota
IPC: H01L29/417 , H01L29/36 , H01L29/78 , H01L27/088 , H01L23/498 , H01L23/13 , H01L29/45 , H01L23/00
Abstract: A semiconductor device includes a semiconductor substrate including a first conductivity-type impurity, a low-concentration impurity layer including a first conductivity-type impurity having a concentration lower than a concentration of the first conductivity-type impurity in the semiconductor substrate, a backside electrode including a metal material, and first and second transistors in the low-concentration impurity layer. The first transistor includes a first source electrode and a first gate electrode on a surface of the low-concentration impurity layer, the second transistor includes a second source electrode and a second gate electrode on the surface of the low-concentration impurity layer. The semiconductor substrate serves as a common drain region of the transistors. The thickness of the backside electrode ranges from 25 to 35 μm, and the ratio of the thickness of the backside electrode to the thickness of a semiconductor layer including the semiconductor substrate and the low-concentration impurity layer is 0.32 or more.
-