Loopback testing of integrated circuits

    公开(公告)号:US12123908B1

    公开(公告)日:2024-10-22

    申请号:US18367333

    申请日:2023-09-12

    申请人: PROTEANTECS LTD.

    摘要: Loopback testing may be provided for one or more transmission output paths of a semiconductor Integrated Circuit (IC). One or more parametric loopback sensors are provided in the semiconductor IC, each parametric loopback sensor being configured to receive a clocked data input signal to a respective transmitter of the IC and a signal from a transmission output path from the respective transmitter of the IC, and to generate a respective sensor output based on a comparison of the clocked data input signal and the signal from the transmission output path for the respective transmitter of the IC. A programmable load circuit is also provided in the semiconductor IC, coupled to each transmission output path.

    Integrated circuit margin measurement and failure prediction device

    公开(公告)号:US11385282B2

    公开(公告)日:2022-07-12

    申请号:US16764056

    申请日:2018-11-15

    申请人: PROTEANTECS LTD.

    IPC分类号: G01R31/28 G01R31/30

    摘要: A semiconductor integrated circuit (IC) comprising a signal path combiner, comprising a plurality of input paths and an output path. The IC comprises a delay circuit having an input electrically connected to the output path, the delay circuit delaying an input signal by a variable delay time to output a delayed signal path. The IC may comprise a first storage circuit electrically connected to the output path and a second storage circuit electrically connected to the delayed signal path. The IC comprises a comparison circuit that compares outputs of the signal path combiner and the delayed signal, wherein the comparison circuit comprises a comparison output provided in a comparison data signal to at least one mitigation circuit.

    Thermal sensor for integrated circuit

    公开(公告)号:US11619551B1

    公开(公告)日:2023-04-04

    申请号:US17750637

    申请日:2022-05-23

    申请人: PROTEANTECS LTD.

    IPC分类号: G01K7/00 G01K7/01 G01K15/00

    摘要: A thermal sensor for an integrated circuit including: a Proportional To Absolute Temperature (PTAT) circuit comprising n-type MOS transistors and providing a first voltage; and a voltage generator circuit comprising a p-type MOS transistor and providing a second voltage. A reference voltage is based on the first voltage and the second voltage. At least one thermal output signal is based on the reference voltage together with the first voltage and/or the second voltage. In another aspect, an integrated circuit has a power routing arrangement, providing a power supply core voltage (VDDcore) to operate functional circuitry on the integrated circuit. One or more local thermal sensors are located on the integrated circuit, each comprising a PTAT circuit having MOS transistors using the power supply core voltage to generate a temperature-dependent voltage that varies independently of power supply core voltage variation.

    Integrated circuit I/O integrity and degradation monitoring

    公开(公告)号:US10740262B2

    公开(公告)日:2020-08-11

    申请号:US16729680

    申请日:2019-12-30

    申请人: PROTEANTECS LTD.

    摘要: An input/output (I/O) block for a semiconductor integrated circuit (IC), which includes: at least one I/O buffer, configured to define at least one signal path in respect of a connection to a remote I/O block via a communication channel, each signal path causing a respective signal edge slope; and an I/O sensor, coupled to the at least one signal path and configured to generate an output signal indicative of one or both of: (a) a timing difference between the signal edge for a first signal path and the signal edge for a second signal path, and (b) an eye pattern parameter for one or more of the at least one signal path.

    Die-to-die and chip-to-chip connectivity monitoring

    公开(公告)号:US12013800B1

    公开(公告)日:2024-06-18

    申请号:US18209685

    申请日:2023-06-14

    申请人: PROTEANTECS LTD.

    IPC分类号: G06F13/20 G01R31/317

    摘要: An input/output (I/O) sensor is provided for a multi-IC (Integrated Circuit) module. The I/O sensor includes: a signal input, configured to receive a data signal from an interconnected part of an IC of the multi-IC module; and a time duration measurement circuit, configured to measure a time duration between a first time, at which the data signal is at a first level, and a second time, at which the data signal is at a second level, different from the first level. The sensor may be incorporated into an I/O block, an IC, and/or a multi-IC module.

    Memory device degradation monitoring

    公开(公告)号:US11929131B2

    公开(公告)日:2024-03-12

    申请号:US17782146

    申请日:2020-12-03

    申请人: PROTEANTECS LTD.

    IPC分类号: G11C11/419 G11C29/08

    CPC分类号: G11C29/08 G11C11/419

    摘要: A memory circuit which includes: A synchronous memory cell array, configured to receive a clock signal and having address lines and bit lines. A margin agent, determining a status of the synchronous memory cell array based on a time duration between a transition of the clock signal and a change on a signal derived from a bit line due to a signaling on at least one of the address lines. In another aspect, a memory cell, having a bit line configured to provide data input/output to the memory cell may be provided with a comparator, comparing a voltage on the bit line with a reference voltage and indicating of a status of the memory cell thereby. Firmware may receive the indication of the status of a memory cell array, and transmit the indication, issue an alert, and/or reconfigure the memory circuit responsive to the status.

    Die-to-die connectivity monitoring

    公开(公告)号:US11293977B2

    公开(公告)日:2022-04-05

    申请号:US17205780

    申请日:2021-03-18

    申请人: proteanTecs Ltd.

    摘要: An input/output (I/O) sensor for a multi-IC module. The I/O sensor includes: delay circuitry, configured to receive a data signal from an interconnected part of an IC of the multi-IC module and to generate a delayed data signal, the delay circuitry including an adjustable delay-line configured to delay an input signal by a set time duration; a comparison circuit, configured to generate a comparison signal by comparing the data signal with the delayed data signal; and processing logic, configured to set the time duration of the adjustable delay-line and, based on the comparison signal, identify a margin measurement of the data signal for determining an interconnect quality parameter.

    Efficient integrated circuit simulation and testing

    公开(公告)号:US11132485B2

    公开(公告)日:2021-09-28

    申请号:US17254468

    申请日:2019-06-19

    申请人: PROTEANTECS LTD.

    摘要: A method comprising using at least one hardware processor for: running a Monte Carlo simulation of possible integrated circuit (IC) process variations of each of a plurality of IC cell types, wherein each of the plurality of IC cell types is defined by multiple specific transistors and multiple specific interconnects; based on the results of the Monte Carlo simulation, creating a library of IC cell types and their corresponding behavioral values for each of the possible IC process variations, and storing the library in a non-transient memory; receiving an IC design embodied as a digital file; correlating the received IC design with the library; and predicting a frequency distribution and a power distribution of ICs manufactured according to the IC design.