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1.发明授权Thermo-oxidatively stable, side chain polyether functionalized polynorbornenes for microelectronic and optoelectronic devices and assemblies thereof 有权用于微电子和光电器件及其组件的热氧化稳定的侧链聚醚官能化聚降冰片烯公开(公告)号：US09562124B2
公开(公告)日：2017-02-07
申请号：US15209289
申请日：2016-07-13
发明人： Christopher Apanius , Andrew Bell , Cheryl Burns , Crystal Cyrus , Edmund Elce , Royce Groff , Sridevi Kaiti , Brian Knapp , Hendra Ng , Seishi Ohashi , Wei Zhang
IPC分类号： C08F232/08 , H01L51/00 , G03F7/039 , G03F7/022 , G03F7/023 , G03F7/038 , C09J7/02 , C09J145/00 , H01L21/683 , H01L23/532 , C08K5/13 , C08K5/18
CPC分类号： C08F232/08 , C08F2500/13 , C08F2500/25 , C08F2500/26 , C08F2800/20 , C08K5/13 , C08K5/18 , C09J7/22 , C09J7/35 , C09J145/00 , C09J2203/326 , C09J2205/114 , C09J2400/143 , G03F7/0226 , G03F7/0233 , G03F7/038 , G03F7/039 , G03F7/0395 , H01L21/6836 , H01L23/5329 , H01L51/004 , H01L51/0043
摘要： The present invention relates to polynorbornene (PNB) composition embodiments that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs having norbornene-type repeating units that are polyether functionalized and an additive package containing a phenolic antioxidant and a diaryl amine synergist, and the microelectronic and/or optoelectronic devices made therefrom are resistant to thermo-oxidative chain degradation of said polyether functionalization.
摘要翻译： 本发明涉及可用于形成微电子和/或光电器件及其组件的聚降冰片烯（PNB）组合物实施方案，更具体地涉及包含具有聚醚官能化的降冰片烯型重复单元的PNB的组合物和包含酚类的添加剂包 抗氧化剂和二芳基胺增效剂，并且由其制备的微电子和/或光电子器件耐受所述聚醚官能化的热氧化链降解。
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2.发明授权Thermo-oxidatively stable, side chain polyether functionalized polynorbornenes for microelectronic and optoelectronic devices and assemblies thereof 有权用于微电子和光电器件及其组件的热氧化稳定的侧链聚醚官能化聚降冰片烯公开(公告)号：US09425404B2
公开(公告)日：2016-08-23
申请号：US13741809
申请日：2013-01-15
发明人： Christopher Apanius , Andrew Bell , Cheryl Burns , Crystal Cyrus , Edmund Elce , Royce Groff , Sridevi Kaiti , Brian Knapp , Hendra Ng , Seishi Ohashi , Wei Zhang
CPC分类号： C08F232/08 , C08F2500/13 , C08F2500/25 , C08F2500/26 , C08F2800/20 , C08K5/13 , C08K5/18 , C09J7/22 , C09J7/35 , C09J145/00 , C09J2203/326 , C09J2205/114 , C09J2400/143 , G03F7/0226 , G03F7/0233 , G03F7/038 , G03F7/039 , G03F7/0395 , H01L21/6836 , H01L23/5329 , H01L51/004 , H01L51/0043
摘要： The present invention relates to polynorbornene (PNB) composition embodiments that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs having norbornene-type repeating units that are polyether functionalized and an additive package containing a phenolic antioxidant and a synergist, and the microelectronic and/or optoelectronic devices made therefrom are resistant to thermo-oxidative chain degradation of said polyether functionalization.
摘要翻译： 本发明涉及可用于形成微电子和/或光电器件及其组件的聚降冰片烯（PNB）组合物实施方案，更具体地涉及包含具有聚醚官能化的降冰片烯型重复单元的PNB的组合物和包含酚类的添加剂包 抗氧化剂和增效剂，并且由其制备的微电子和/或光电子器件耐受所述聚醚官能化的热氧化链降解。
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3.发明申请Thermo-oxidatively Stable, Side Chain Polyether Functionalized Polynorbornenes for Microelectronic and Optoelectronic Devices and Assemblies Thereof 有权用于微电子和光电子器件及其组件的热氧化稳定的侧链聚醚官能化聚降冰片烯公开(公告)号：US20130181199A1
公开(公告)日：2013-07-18
申请号：US13741809
申请日：2013-01-15
发明人： Christopher Apanius , Andrew Bell , Cheryl Burns , Crystal Cyrus , Edmund Elce , Royce Groff , Sridevi Kaiti , Brian Knapp , Hendra Ng , Seishi Ohashi , Wei Zhang
IPC分类号： H01L51/00
CPC分类号： C08F232/08 , C08F2500/13 , C08F2500/25 , C08F2500/26 , C08F2800/20 , C08K5/13 , C08K5/18 , C09J7/22 , C09J7/35 , C09J145/00 , C09J2203/326 , C09J2205/114 , C09J2400/143 , G03F7/0226 , G03F7/0233 , G03F7/038 , G03F7/039 , G03F7/0395 , H01L21/6836 , H01L23/5329 , H01L51/004 , H01L51/0043
摘要： The present invention relates to polynorbornene (PNB) composition embodiments that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs having norbornene-type repeating units that are polyether functionalized where such the PNBs of such compositions and the microelectronic and/or optoelectronic devices made therefrom are resistant to thermo-oxidative chain degradation of said polyether functionalization.
摘要翻译： 本发明涉及可用于形成微电子和/或光电子器件及其组合物的聚降冰片烯（PNB）组合物实施方案，更具体地涉及包含具有聚醚功能化的降冰片烯型重复单元的PNB的组合物，其中这种组合物的PNB 并且由其制备的微电子和/或光电子器件耐受所述聚醚官能化的热氧化链降解。
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公开(公告)号：US09765200B2
公开(公告)日：2017-09-19
申请号：US13965287
申请日：2013-08-13
申请人： Promerus, LLC
CPC分类号： C08K5/09 , C08L69/00 , H01L23/293 , H01L2924/0002 , H01L2924/01322 , H05K13/00 , H05K13/0465 , H01L2924/00
摘要： Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components.
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5.发明授权公开(公告)号：US09263416B2
公开(公告)日：2016-02-16
申请号：US14457249
申请日：2014-08-12
申请人： PROMERUS, LLC
发明人： Christopher Apanius , Robert A. Shick , Hendra Ng , Andrew Bell , Wei Zhang , Phillip S. Neal
IPC分类号： H01L21/00 , H01L23/00 , H01L25/00 , H01L27/146 , H01L21/82
CPC分类号： H01L24/83 , H01L21/82 , H01L25/50 , H01L27/14618 , H01L27/14683 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16145 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8303 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06575 , H01L2924/00014 , H01L2924/01019 , H01L2924/01025 , H01L2924/01055 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.
摘要翻译： 公开了使用这种材料的材料和方法，其可用于形成芯片堆叠，芯片和晶片接合以及晶片薄化。 这样的方法和材料提供强的键，同时也很少或没有残留物容易地除去。
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公开(公告)号：US08729166B2
公开(公告)日：2014-05-20
申请号：US14039433
申请日：2013-09-27
申请人： Promerus, LLC
CPC分类号： B23K35/362 , B23K35/26 , B23K35/3613 , C08G64/0208 , C08K5/0033 , C08K5/07 , C08K5/09 , C08K5/1535 , C08K5/42 , C08K5/55 , C09J169/00
摘要： Embodiments in accordance with the present invention encompass polymer compositions that act as both a tack agent and a fluxing agent for the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions embodiments encompass a sacrificial polymer, a carrier solvent, a thermal acid generator and, optionally, formic acid.
摘要翻译： 根据本发明的实施方案包括用作将微电子组件组装到各种基材上的粘合剂和助熔剂两者的聚合物组合物。 这样的聚合物组合物实施方案包括牺牲聚合物，载体溶剂，热酸发生剂和任选的甲酸。
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公开(公告)号：US20140024750A1
公开(公告)日：2014-01-23
申请号：US14039433
申请日：2013-09-27
申请人： Promerus, LLC
IPC分类号： B23K35/362 , C08K5/07 , C08K5/1535 , C08K5/09 , C08K5/55 , C08K5/42
CPC分类号： B23K35/362 , B23K35/26 , B23K35/3613 , C08G64/0208 , C08K5/0033 , C08K5/07 , C08K5/09 , C08K5/1535 , C08K5/42 , C08K5/55 , C09J169/00
摘要： Embodiments in accordance with the present invention encompass polymer compositions that act as both a tack agent and a fluxing agent for the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions embodiments encompass a sacrificial polymer, a carrier solvent, a thermal acid generator and, optionally, formic acid.
摘要翻译： 根据本发明的实施方案包括用作将微电子组件组装到各种基材上的粘合剂和助熔剂两者的聚合物组合物。 这样的聚合物组合物实施方案包括牺牲聚合物，载体溶剂，热酸产生剂和任选的甲酸。
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公开(公告)号：US20130327815A1
公开(公告)日：2013-12-12
申请号：US13965287
申请日：2013-08-13
申请人： Promerus, LLC
CPC分类号： C08K5/09 , C08L69/00 , H01L23/293 , H01L2924/0002 , H01L2924/01322 , H05K13/00 , H05K13/0465 , H01L2924/00
摘要： Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components.
摘要翻译： 根据本发明的实施方案包括可用于将微电子组件组装到各种基材上的聚合物组合物。 这种聚合物组合物提供将微电子组件保持在基底上的期望位置，为这些组分焊接到基底上的焊料提供助熔剂，并作为这种组分的底部填充物保留在适当位置。
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