发明授权
US09263416B2 Methods and materials useful for chip stacking, chip and wafer bonding
有权
用于芯片堆叠，芯片和晶片接合的方法和材料
- 专利标题： Methods and materials useful for chip stacking, chip and wafer bonding
- 专利标题（中）： 用于芯片堆叠，芯片和晶片接合的方法和材料
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申请号： US14457249申请日： 2014-08-12
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公开(公告)号： US09263416B2公开(公告)日： 2016-02-16
- 发明人: Christopher Apanius , Robert A. Shick , Hendra Ng , Andrew Bell , Wei Zhang , Phillip S. Neal
- 申请人： PROMERUS, LLC
- 申请人地址： JP Tokyo
- 专利权人： SUMITOMO BAKELITE CO., LTD.
- 当前专利权人： SUMITOMO BAKELITE CO., LTD.
- 当前专利权人地址： JP Tokyo
- 代理商 Balaram Gupta
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/00 ; H01L25/00 ; H01L27/146 ; H01L21/82
摘要：
Materials, and methods that use such materials, that are useful for forming chip stacks, chip and wafer bonding and wafer thinning are disclosed. Such methods and materials provide strong bonds while also being readily removed with little or no residues.
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