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公开(公告)号：US20240145620A1
公开(公告)日：2024-05-02
申请号：US18446214
申请日：2023-08-08
发明人： Hironori FURUTA , Takuma ISHIKAWA , Yuuki SHINOHARA , Takahito SUZUKI , Kenichi TANIGAWA , Yutaka KITAJIMA
CPC分类号： H01L31/1896 , H10N30/03
摘要： A manufacturing method of an electronic device includes forming a support layer that is provided to extend from a first surface of a functional layer formed on a first substrate via a first layer, as a surface on a side opposite to the first substrate, to the first substrate and supports the functional layer with respect to the first substrate, forming a thin film holding layer on at least one of the support layer and the first surface of the functional layer, removing the first layer, joining a transfer member to a surface of the thin film holding layer on a side opposite to the functional layer, separating the functional layer, the support layer and the thin film holding layer from the first substrate, transferring the functional layer, the support layer and the thin film holding layer to a different second substrate, and removing the thin film holding layer.
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2.发明公开公开(公告)号：US20230320219A1
公开(公告)日：2023-10-05
申请号：US18179106
申请日：2023-03-06
发明人： Hironori FURUTA , Toru KOSAKA , Takahito SUZUKI , Kenichi TANIGAWA , Takuma ISHIKAWA , Yutaka KITAJIMA , Akio KONISHI , Hiroaki KANAMORI , Takeshi IIZUKA
IPC分类号： H10N30/00 , H10N30/093 , H10N30/853 , H10N30/87
CPC分类号： H10N30/1071 , H10N30/093 , H10N30/8554 , H10N30/8536 , H10N30/8542 , H10N30/877
摘要： A piezoelectric film integrated device include a substrate; a first electrode provided on the substrate; a second electrode provided on the substrate; a first monocrystalline piezoelectric film provided on the first electrode; a second monocrystalline piezoelectric film provided on the second electrode and having a crystal structure different from a crystal structure of the first monocrystalline piezoelectric film; a third electrode provided on the first monocrystalline piezoelectric film; and a fourth electrode provided on the second monocrystalline piezoelectric film.
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公开(公告)号：US20220310817A1
公开(公告)日：2022-09-29
申请号：US17556450
申请日：2021-12-20
发明人： Yuuki SHINOHARA , Takahito SUZUKI , Kenichi TANIGAWA , Hironori FURUTA , Toru KOSAKA , Yusuke NAKAI , Shinya JYUMONJI , Genichirou MATSUO , Takuma ISHIKAWA , Chihiro TAKAHASHI , Hiroto KAWADA
摘要： A semiconductor element unit includes a semiconductor element; and a first electrode having a flat first electrode mounting surface whose surface roughness is less than or equal to 10 [nm] and forming eutectic bonding with the semiconductor element in a part different from the first electrode mounting surface. A semiconductor element unit supply substrate includes one or more semiconductor element units. A semiconductor packaging circuit includes the semiconductor element unit.
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公开(公告)号：US20220157796A1
公开(公告)日：2022-05-19
申请号：US17504306
申请日：2021-10-18
发明人： Takuma ISHIKAWA , Takahito SUZUKI , Kenichi TANIGAWA , Hironori FURUTA , Toru KOSAKA , Yusuke NAKAI , Shinya JYUMONJI , Genichiro MATSUO , Chihiro TAKAHASHI , Hiroto KAWADA , Yuuki SHINOHARA
摘要： A composite integrated film includes a base member thin film having a base member first surface and a base member second surface facing each other, one or more penetration parts penetrating the base member first surface and the base member second surface of the base member thin film, one or more electrodes each including an electrical path part formed between the base member first surface and the base member second surface via the penetration part and an electrode surface in a planar shape formed on the base member second surface's side, and one or more elements provided on the base member first surface of the base member thin film and electrically connected to the electrodes, wherein the electrode surface and the base member second surface form a same flat surface.
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公开(公告)号：US20230320224A1
公开(公告)日：2023-10-05
申请号：US18179014
申请日：2023-03-06
发明人： Hironori FURUTA , Toru KOSAKA , Takahito SUZUKI , Kenichi TANIGAWA , Takuma ISHIKAWA , Yutaka KITAJIMA
IPC分类号： H10N30/50 , H10N30/00 , H10N30/87 , H10N30/853 , H10N30/85 , H10N30/057
CPC分类号： H10N30/50 , H10N30/057 , H10N30/1051 , H10N30/852 , H10N30/853 , H10N30/872
摘要： A piezoelectric-body film joint substrate includes a substrate, a first electrode provided on the substrate, a first piezoelectric-body film stuck on the first electrode and including a first piezoelectric film and a first upper electrode film formed on the first piezoelectric film, a second electrode provided on the substrate, and a second piezoelectric-body film stuck on the second electrode and including a second piezoelectric film different from the first piezoelectric film and a second upper electrode film formed on the second piezoelectric film, wherein a height from an upper surface of the substrate, on which the first electrode and the second electrode are formed, to a top of the first upper electrode film and a height from the upper surface of the substrate to a top of the second upper electrode film differ from each other.
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公开(公告)号：US20230268219A1
公开(公告)日：2023-08-24
申请号：US18165442
申请日：2023-02-07
发明人： Genichirou MATSUO , Toru KOSAKA , Takahito SUZUKI , Hironori FURUTA , Shinya JUMONJI , Hiroto KAWADA , Yuuki SHINOHARA , Akihiro IINO
IPC分类号： H01L21/683 , H01L33/38 , H01L33/52 , H01L33/62 , H01L27/15 , H01L25/10 , H01L25/00 , H01L21/56
CPC分类号： H01L21/6835 , H01L33/38 , H01L33/52 , H01L33/62 , H01L27/153 , H01L25/105 , H01L25/50 , H01L21/568 , H01L2933/005 , H01L2933/0016 , H01L2933/0066 , H01L2221/68318 , H01L2221/68381
摘要： An electronic structure includes: a substrate having a first surface; a functional element unit including a functional element having an electronic function, and a protector covering the functional element, the functional element unit having a second surface facing the first surface; a support disposed between the first surface and the second surface, the support supporting the second surface; and a projection disposed on a first surface side of the substrate, the projection projecting toward the functional element unit. The support has a third surface in contact with the second surface of the functional element unit, the third surface having an area smaller than an area of the second surface. The projection has a fourth surface in contact with or close to the functional element unit, the fourth surface having an area smaller than the area of the second surface, the projection being formed by a different material from the support.
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公开(公告)号：US20220029078A1
公开(公告)日：2022-01-27
申请号：US17379538
申请日：2021-07-19
发明人： Hironori FURUTA , Takahito SUZUKI , Kenichi TANIGAWA , Yusuke NAKAI , Shinya JUMONJI , Genichiro MATSUO , Takuma ISHIKAWA , Hiroto KAWADA
IPC分类号： H01L33/62 , H01L33/00 , H01L33/38 , H01L25/075
摘要： Provided is a light emitting device that includes a substrate including electrodes; a film member; light emitting elements arranged on the film member; and conductive members that electrically connect the light emitting elements and the electrodes to each other, wherein the film member has through holes formed at positions corresponding to the electrodes, and each of the conductive members includes a first conductive part extending from the light emitting element to the through hole and a second conductive part connecting the first conductive part and the electrode to each other via the through hole.
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8.发明公开公开(公告)号：US20240332454A1
公开(公告)日：2024-10-03
申请号：US18417257
申请日：2024-01-19
发明人： Hiroto KAWADA , Takuma ISHIKAWA , Hironori FURUTA , Takahito SUZUKI , Kenichi TANIGAWA , Yusuke NAKAI , Yutaka KITAJIMA
CPC分类号： H01L33/22 , H01L33/0095
摘要： A manufacturing method of an electronic structure includes forming a second sacrificial layer extending from a substrate to a function part of a layered substrate including the substrate, a first sacrificial layer formed on the substrate, and the function part formed on the first sacrificial layer. The manufacturing method further includes forming a cover layer extending from the substrate to the second sacrificial layer, and removing the first sacrificial layer and the second sacrificial layer.
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公开(公告)号：US20230063063A1
公开(公告)日：2023-03-02
申请号：US17884665
申请日：2022-08-10
发明人： Takuma ISHIKAWA , Takahito SUZUKI , Kenichi TANIGAWA , Hironori FURUTA , Toru KOSAKA , Yusuke NAKAI , Shinya JYUMONJI , Genichirou MATSUO , Chihiro TAKAHASHI , Hiroto KAWADA , Yuuki SHINOHARA , Akihiro IINO
IPC分类号： H01L25/075 , H01L25/16 , H01L33/62
摘要： A light emitting device includes: a first layer in which a first light emitting element is disposed; a second layer stacked on the first layer and including a second light emitting element that at least partially overlaps the first light emitting element as viewed in a light emitting direction perpendicular to a light emitting surface of the first light emitting element; and a control substrate on which the first layer is stacked and that controls light emission of the first light emitting element and the second light emitting element. The first layer includes a first surface facing the second layer in the light emitting direction, a second surface facing the control substrate in the light emitting direction, and a first opening formed from the first surface to the second surface. The second light emitting element and the control substrate are electrically connected together through the first opening.
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公开(公告)号：US20220029077A1
公开(公告)日：2022-01-27
申请号：US17353288
申请日：2021-06-21
发明人： Yusuke NAKAI , Takahito SUZUKI , Kenichi TANIGAWA , Hironori FURUTA , Shinya JUMONJI , Genichiro MATSUO , Takuma ISHIKAWA , Hiroto KAWADA
IPC分类号： H01L33/62 , H01L25/075
摘要： A light emitting device includes a pixel set unit that includes a plurality of pixels arranged in a grid; first common wiring that connects together first terminals of pixels aligned in a first direction among the plurality of pixels; and second common wiring that connects together second terminals of two pixels aligned in a second direction orthogonal to the first direction among the plurality of pixels.
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