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公开(公告)号：US20240310757A1
公开(公告)日：2024-09-19
申请号：US18415312
申请日：2024-01-17
发明人： Yasumasa SAGAWA
IPC分类号： G03G15/08
CPC分类号： G03G15/0896
摘要： An image formation apparatus according to an embodiment may include: development devices; and transmission gear members each including an output gear portion engaged with a drive gear portion of the corresponding development device. Among adjacent first and second development devices, a smallest angle θ1 of angles of gear teeth on a first output gear portion corresponding to the first development device in a rotation direction is different from a smallest angle θ2 of angles of gear teeth on a second output gear portion corresponding to a second development device in the rotation direction.
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公开(公告)号：US20240210846A1
公开(公告)日：2024-06-27
申请号：US18528208
申请日：2023-12-04
发明人： Karin HASEGAWA
CPC分类号： G03G9/0819 , G03G15/0856 , G03G15/0877 , G03G15/5087 , G03G2215/0106
摘要： An image formation apparatus according to an embodiment may include: a first image formation unit including a storage part storing a glitter developer and configured to form a glitter developer image with the glitter developer; and a controller configured to control an operation of the first image formation unit based on print data received. The controller is configured to: when a remaining amount of the glitter developer in the storage part is a first remaining amount, to form the glitter developer image such that the glitter developer image is divided per unit area by a first division number; and when the remaining amount of the glitter developer in the storage part is a second remaining amount less than the first remaining amount, to form the glitter developer image such that the glitter developer image is divided per unit area by a second division number smaller than the first division number.
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公开(公告)号：US20230420427A1
公开(公告)日：2023-12-28
申请号：US18320618
申请日：2023-05-19
发明人： Akihiro IINO , Toru KOSAKA , Hironori FURUTA , Genichirou MATSUO , Shinya JUMONJI , Hiroto KAWADA , Yuuki SHINOHARA
CPC分类号： H01L25/13 , H01L33/52 , H01L33/0093 , H01L33/62 , H01L2933/005 , H01L2933/0066 , H01L2933/0016
摘要： A semiconductor device includes: a planarized layer having insulating properties, the planarized layer having a first surface and a second surface opposite the first surface; a plurality of semiconductor elements formed on the first surface of the planarized layer; and a groove provided in the second surface of the planarized layer. The groove is formed in a region outside the plurality of semiconductor elements as viewed in a direction perpendicular to the first surface.
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公开(公告)号：US20230375957A1
公开(公告)日：2023-11-23
申请号：US18313667
申请日：2023-05-08
发明人： Fumitaka OZEKI , Hisashi SOGA
IPC分类号： G03G15/08
CPC分类号： G03G15/0844 , G03G15/0887
摘要： An image formation apparatus according to an embodiment may include: an image formation section to form an image with a developer; an entire area printing rate calculator configured to calculate an entire area printing rate, which is, a printing rate of an entirety of an image formation area; a divided area printing rate calculator configured to calculate each divided area printing rate, which is, a printing rate of each of plural divided areas, divided in a main scanning direction, of the image formation area; and a deteriorated developer discarding operation execution section configured, when the entire area printing rate is equal to or lower than an entire area printing rate threshold, to perform a deteriorated developer discarding operation to discard the developer in any one of the divided areas in which the divided area printing rate is equal to or lower than a divided area printing rate threshold thereof.
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公开(公告)号：US20230320224A1
公开(公告)日：2023-10-05
申请号：US18179014
申请日：2023-03-06
发明人： Hironori FURUTA , Toru KOSAKA , Takahito SUZUKI , Kenichi TANIGAWA , Takuma ISHIKAWA , Yutaka KITAJIMA
IPC分类号： H10N30/50 , H10N30/00 , H10N30/87 , H10N30/853 , H10N30/85 , H10N30/057
CPC分类号： H10N30/50 , H10N30/057 , H10N30/1051 , H10N30/852 , H10N30/853 , H10N30/872
摘要： A piezoelectric-body film joint substrate includes a substrate, a first electrode provided on the substrate, a first piezoelectric-body film stuck on the first electrode and including a first piezoelectric film and a first upper electrode film formed on the first piezoelectric film, a second electrode provided on the substrate, and a second piezoelectric-body film stuck on the second electrode and including a second piezoelectric film different from the first piezoelectric film and a second upper electrode film formed on the second piezoelectric film, wherein a height from an upper surface of the substrate, on which the first electrode and the second electrode are formed, to a top of the first upper electrode film and a height from the upper surface of the substrate to a top of the second upper electrode film differ from each other.
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公开(公告)号：US20230268219A1
公开(公告)日：2023-08-24
申请号：US18165442
申请日：2023-02-07
发明人： Genichirou MATSUO , Toru KOSAKA , Takahito SUZUKI , Hironori FURUTA , Shinya JUMONJI , Hiroto KAWADA , Yuuki SHINOHARA , Akihiro IINO
IPC分类号： H01L21/683 , H01L33/38 , H01L33/52 , H01L33/62 , H01L27/15 , H01L25/10 , H01L25/00 , H01L21/56
CPC分类号： H01L21/6835 , H01L33/38 , H01L33/52 , H01L33/62 , H01L27/153 , H01L25/105 , H01L25/50 , H01L21/568 , H01L2933/005 , H01L2933/0016 , H01L2933/0066 , H01L2221/68318 , H01L2221/68381
摘要： An electronic structure includes: a substrate having a first surface; a functional element unit including a functional element having an electronic function, and a protector covering the functional element, the functional element unit having a second surface facing the first surface; a support disposed between the first surface and the second surface, the support supporting the second surface; and a projection disposed on a first surface side of the substrate, the projection projecting toward the functional element unit. The support has a third surface in contact with the second surface of the functional element unit, the third surface having an area smaller than an area of the second surface. The projection has a fourth surface in contact with or close to the functional element unit, the fourth surface having an area smaller than the area of the second surface, the projection being formed by a different material from the support.
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7.发明公开公开(公告)号：US20230247547A1
公开(公告)日：2023-08-03
申请号：US18011900
申请日：2021-04-01
发明人： Masaaki KANATANI
IPC分类号： H04W52/02
CPC分类号： H04W52/0203
摘要： The present invention, a communication device configured to receive supply of electrical power from a battery unit and transmit and receive a data signal, the device includes a first wireless communication means configured to intermittently receive a data signal, a second wireless communication means configured to transmit a data signal; and a communication control means configured to temporarily hold the data signal received by the first wireless communication means, power off the second wireless communication means until a predetermined condition is satisfied, power on the second wireless communication means after a predetermined condition is satisfied, and transmit the held data signal.
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公开(公告)号：US11619891B2
公开(公告)日：2023-04-04
申请号：US17392968
申请日：2021-08-03
发明人： Masashi Fujii , Yoshihiro Goto
IPC分类号： G03G15/08
摘要： A development unit according to an embodiment may include a developer carrier configured to carry developer on a surface thereof; a layer regulation member being elongate in a direction and provided facing the developer carrier; and a frame supporting the developer carrier and the layer regulation member. The layer regulation member comprises a metal blade that contacts the developer carrier and a support member attached to the frame and supporting the blade. A free length of the blade at an end portion in a longitudinal direction of the layer regulation member is shorter than a free length of the blade at a center portion in the longitudinal direction of the layer regulation member.
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公开(公告)号：US20230086071A1
公开(公告)日：2023-03-23
申请号：US17891682
申请日：2022-08-19
发明人： Yusuke NAKAI , Takuma ISHIKAWA , Kenichi TANIGAWA , Hiroto KAWADA
IPC分类号： H01L27/146
摘要： A semiconductor device includes: a first layer including a first optical semiconductor element; a second layer including a second optical semiconductor element having a lower conversion efficiency than the first optical semiconductor element; and a lens member. The first optical semiconductor element and the second optical semiconductor element are disposed between the lens member and a focal point of the lens member in an optical axis direction of the lens member, at least partially overlap as viewed in the optical axis direction, and are disposed so that the second optical semiconductor element is closer to the focal point than the first optical semiconductor element.
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公开(公告)号：USD981480S1
公开(公告)日：2023-03-21
申请号：US29736150
申请日：2020-05-28
设计人： Tomoya Urabe , Shiro Ino , Katsuhiro Yamaguchi , Morihito Saigusa
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