-
公开(公告)号：US20240213291A1
公开(公告)日：2024-06-27
申请号：US18507528
申请日：2023-11-13
Applicant: Oki Electric Industry Co., Ltd.
Inventor： Yusuke NAKAI , Takuma ISHIKAWA , Shinya JUMONJI , Genichirou MATSUO , Hiroto KAWADA , Akihiro IINO
Abstract: A light emitting device includes a first layer including a first light emitting element that has a first light emission region and a first transparent insulation member that covers the first light emitting element; a second layer stacked on the first layer and including a second light emitting element that has a second light emission region and a second transparent insulation member that covers the second light emitting element; and a third layer stacked on the second layer and including a third light emitting element that has a third light emission region, at least partially overlapping with the first light emission region and the second light emission region, and a third transparent insulation member that covers the third light emitting element, wherein the third light emission region is formed so that its area is larger than the first light emission region and the second light emission region.
-
公开(公告)号：US20220310817A1
公开(公告)日：2022-09-29
申请号：US17556450
申请日：2021-12-20
Applicant: Oki Electric Industry Co., Ltd.
Inventor： Yuuki SHINOHARA , Takahito SUZUKI , Kenichi TANIGAWA , Hironori FURUTA , Toru KOSAKA , Yusuke NAKAI , Shinya JYUMONJI , Genichirou MATSUO , Takuma ISHIKAWA , Chihiro TAKAHASHI , Hiroto KAWADA
Abstract: A semiconductor element unit includes a semiconductor element; and a first electrode having a flat first electrode mounting surface whose surface roughness is less than or equal to 10 [nm] and forming eutectic bonding with the semiconductor element in a part different from the first electrode mounting surface. A semiconductor element unit supply substrate includes one or more semiconductor element units. A semiconductor packaging circuit includes the semiconductor element unit.
-
公开(公告)号：US20220157796A1
公开(公告)日：2022-05-19
申请号：US17504306
申请日：2021-10-18
Applicant: Oki Electric Industry Co., Ltd.
Inventor： Takuma ISHIKAWA , Takahito SUZUKI , Kenichi TANIGAWA , Hironori FURUTA , Toru KOSAKA , Yusuke NAKAI , Shinya JYUMONJI , Genichiro MATSUO , Chihiro TAKAHASHI , Hiroto KAWADA , Yuuki SHINOHARA
Abstract: A composite integrated film includes a base member thin film having a base member first surface and a base member second surface facing each other, one or more penetration parts penetrating the base member first surface and the base member second surface of the base member thin film, one or more electrodes each including an electrical path part formed between the base member first surface and the base member second surface via the penetration part and an electrode surface in a planar shape formed on the base member second surface's side, and one or more elements provided on the base member first surface of the base member thin film and electrically connected to the electrodes, wherein the electrode surface and the base member second surface form a same flat surface.
-
4.发明公开公开(公告)号：US20240145631A1
公开(公告)日：2024-05-02
申请号：US18446271
申请日：2023-08-08
Applicant: Oki Electric Industry Co., Ltd.
Inventor： Shinya JUMONJI , Toru KOSAKA , Takahito SUZUKI , Kenichi TANIGAWA , Yusuke NAKAI , Hiroto KAWADA , Genichirou MATSUO , Yutaka KITAJIMA
CPC classification number: H01L33/32 , H01L33/007 , H01L33/0093
Abstract: A manufacturing method of a semiconductor element includes forming a plurality of semiconductor layers on a sapphire substrate, each of the semiconductor layers having a first surface on the sapphire substrate side and a second surface on the opposite side, joining the second surfaces of the plurality of semiconductor layers to a retention member via an adhesive member, peeling off the plurality of semiconductor layers from the sapphire substrate by irradiating the first surfaces of the plurality of semiconductor layers with laser light, and polishing the first surfaces of the plurality of semiconductor layers. At least one semiconductor layer among the plurality of semiconductor layers includes a polishing indication part extending from the second surface toward the first surface. The polishing is executed until the polishing indication part is exposed to the polished surface.
-
5.发明公开公开(公告)号：US20240145239A1
公开(公告)日：2024-05-02
申请号：US18446643
申请日：2023-08-09
Applicant: Oki Electric Industry Co., Ltd.
Inventor： Shinya JUMONJI , Toru KOSAKA , Takahito SUZUKI , Kenichi TANIGAWA , Yusuke NAKAI , Hiroto KAWADA , Genichirou MATSUO , Yutaka KITAJIMA
IPC: H01L21/02 , H01L21/306 , H01L29/20
CPC classification number: H01L21/0254 , H01L21/0242 , H01L21/30625 , H01L29/2003 , H01L33/007
Abstract: A manufacturing method of a semiconductor element includes forming a plurality of islands, each including a semiconductor layer containing a nitride semiconductor and a support formed on the semiconductor layer, on a sapphire substrate, joining the support to a retention substrate via an adhesive member, peeling off the semiconductor layer from the sapphire substrate by irradiating the semiconductor layer with laser light, and polishing a surface of the semiconductor layers peeled off from the sapphire substrate.
-
Patent Agency Ranking
公开(公告)号：US20230420427A1
公开(公告)日：2023-12-28
申请号：US18320618
申请日：2023-05-19
Applicant: Oki Electric Industry Co., Ltd.
Inventor： Akihiro IINO , Toru KOSAKA , Hironori FURUTA , Genichirou MATSUO , Shinya JUMONJI , Hiroto KAWADA , Yuuki SHINOHARA
CPC classification number: H01L25/13 , H01L33/52 , H01L33/0093 , H01L33/62 , H01L2933/005 , H01L2933/0066 , H01L2933/0016
Abstract: A semiconductor device includes: a planarized layer having insulating properties, the planarized layer having a first surface and a second surface opposite the first surface; a plurality of semiconductor elements formed on the first surface of the planarized layer; and a groove provided in the second surface of the planarized layer. The groove is formed in a region outside the plurality of semiconductor elements as viewed in a direction perpendicular to the first surface.
-
公开(公告)号：US20230268219A1
公开(公告)日：2023-08-24
申请号：US18165442
申请日：2023-02-07
Applicant: Oki Electric Industry Co., Ltd.
Inventor： Genichirou MATSUO , Toru KOSAKA , Takahito SUZUKI , Hironori FURUTA , Shinya JUMONJI , Hiroto KAWADA , Yuuki SHINOHARA , Akihiro IINO
CPC classification number: H01L21/6835 , H01L33/38 , H01L33/52 , H01L33/62 , H01L27/153 , H01L25/105 , H01L25/50 , H01L21/568 , H01L2933/005 , H01L2933/0016 , H01L2933/0066 , H01L2221/68318 , H01L2221/68381
Abstract: An electronic structure includes: a substrate having a first surface; a functional element unit including a functional element having an electronic function, and a protector covering the functional element, the functional element unit having a second surface facing the first surface; a support disposed between the first surface and the second surface, the support supporting the second surface; and a projection disposed on a first surface side of the substrate, the projection projecting toward the functional element unit. The support has a third surface in contact with the second surface of the functional element unit, the third surface having an area smaller than an area of the second surface. The projection has a fourth surface in contact with or close to the functional element unit, the fourth surface having an area smaller than the area of the second surface, the projection being formed by a different material from the support.
-
公开(公告)号：US20230086071A1
公开(公告)日：2023-03-23
申请号：US17891682
申请日：2022-08-19
Applicant: Oki Electric Industry Co., Ltd.
Inventor： Yusuke NAKAI , Takuma ISHIKAWA , Kenichi TANIGAWA , Hiroto KAWADA
IPC: H01L27/146
Abstract: A semiconductor device includes: a first layer including a first optical semiconductor element; a second layer including a second optical semiconductor element having a lower conversion efficiency than the first optical semiconductor element; and a lens member. The first optical semiconductor element and the second optical semiconductor element are disposed between the lens member and a focal point of the lens member in an optical axis direction of the lens member, at least partially overlap as viewed in the optical axis direction, and are disposed so that the second optical semiconductor element is closer to the focal point than the first optical semiconductor element.
-
公开(公告)号：US20220029078A1
公开(公告)日：2022-01-27
申请号：US17379538
申请日：2021-07-19
Applicant: Oki Electric Industry Co., Ltd.
Inventor： Hironori FURUTA , Takahito SUZUKI , Kenichi TANIGAWA , Yusuke NAKAI , Shinya JUMONJI , Genichiro MATSUO , Takuma ISHIKAWA , Hiroto KAWADA
IPC: H01L33/62 , H01L33/00 , H01L33/38 , H01L25/075
Abstract: Provided is a light emitting device that includes a substrate including electrodes; a film member; light emitting elements arranged on the film member; and conductive members that electrically connect the light emitting elements and the electrodes to each other, wherein the film member has through holes formed at positions corresponding to the electrodes, and each of the conductive members includes a first conductive part extending from the light emitting element to the through hole and a second conductive part connecting the first conductive part and the electrode to each other via the through hole.
-
10.发明公开公开(公告)号：US20240332454A1
公开(公告)日：2024-10-03
申请号：US18417257
申请日：2024-01-19
Applicant: Oki Electric Industry Co., Ltd.
Inventor： Hiroto KAWADA , Takuma ISHIKAWA , Hironori FURUTA , Takahito SUZUKI , Kenichi TANIGAWA , Yusuke NAKAI , Yutaka KITAJIMA
CPC classification number: H01L33/22 , H01L33/0095
Abstract: A manufacturing method of an electronic structure includes forming a second sacrificial layer extending from a substrate to a function part of a layered substrate including the substrate, a first sacrificial layer formed on the substrate, and the function part formed on the first sacrificial layer. The manufacturing method further includes forming a cover layer extending from the substrate to the second sacrificial layer, and removing the first sacrificial layer and the second sacrificial layer.
-
-
-
-
-
-
-
-
-
Search Results
12
records
(took 0.02 seconds)
