-
1.发明授权公开(公告)号：US07390698B2
公开(公告)日：2008-06-24
申请号：US11444595
申请日：2006-05-31
申请人： Neill Thornton , Dennis Lang
发明人： Neill Thornton , Dennis Lang
CPC分类号： H01L29/0657 , H01L23/49562 , H01L24/45 , H01L24/48 , H01L2224/16245 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/10158 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor packaging technique provides for a semiconductor device with improved electrical and thermal performance. According to one embodiment of the invention, die edges are shaped before encapsulation to move the peripheral area of the die, which is more susceptible to stress and cracking, further inside the molding compound. This results in a device that can better withstand stress as well being more resistant to corrosion and other reliability problems caused by environmental conditions.
摘要翻译： 半导体封装技术提供具有改善的电和热性能的半导体器件。 根据本发明的一个实施例，在封装之前，模具边缘成形，以在模制化合物内进一步移动更容易受到应力和开裂的模具的周边区域的移动。 这导致能够更好地承受应力的装置以及更耐环境条件引起的腐蚀和其它可靠性问题。
-
公开(公告)号：US20060220241A1
公开(公告)日：2006-10-05
申请号：US11444595
申请日：2006-05-31
申请人： Neill Thornton , Dennis Lang
发明人： Neill Thornton , Dennis Lang
IPC分类号： H01L23/48
CPC分类号： H01L29/0657 , H01L23/49562 , H01L24/45 , H01L24/48 , H01L2224/16245 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/10158 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor packaging technique provides for a semiconductor device with improved electrical and thermal performance. According to one embodiment of the invention, die edges are shaped before encapsulation to move the peripheral area of the die, which is more susceptible to stress and cracking, further inside the molding compound. This results in a device that can better withstand stress as well being more resistant to corrosion and other reliability problems caused by environmental conditions.
-
公开(公告)号：US08030764B2
公开(公告)日：2011-10-04
申请号：US12419696
申请日：2009-04-07
申请人： Neill Thornton , Dennis Lang
发明人： Neill Thornton , Dennis Lang
IPC分类号： H01L23/34
CPC分类号： H01L29/41725 , H01L23/3107 , H01L23/49562 , H01L24/48 , H01L29/41775 , H01L29/45 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The invention provides a semiconductor device that is thermally isolated from the printed circuit board such that the device operates at a higher temperature and radiates heat away from the printed circuit board. In another embodiment, the semiconductor is stacked onto a second device and optionally thermally isolated from the second device.
摘要翻译： 本发明提供了一种与印刷电路板热隔离的半导体器件，使得该器件在较高温度下工作并将辐射热量从印刷电路板上散出。 在另一个实施例中，将半导体层叠到第二器件上，并且可选地与第二器件热隔离。
-
公开(公告)号：US20080054496A1
公开(公告)日：2008-03-06
申请号：US11512860
申请日：2006-08-30
申请人： Neill Thornton , Dennis Lang
发明人： Neill Thornton , Dennis Lang
IPC分类号： H01L23/29
CPC分类号： H01L29/41725 , H01L23/3107 , H01L23/49562 , H01L24/48 , H01L29/41775 , H01L29/45 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The invention provides a semiconductor device that is thermally isolated from the printed circuit board such that the device operates at a higher temperature and radiates heat away from the printed circuit board. In another embodiment, the semiconductor is stacked onto a second device and optionally thermally isolated from the second device.
摘要翻译： 本发明提供了一种与印刷电路板热隔离的半导体器件，使得该器件在较高温度下工作并将辐射热量从印刷电路板上散出。 在另一个实施例中，将半导体层叠到第二器件上，并且可选地与第二器件热隔离。
-
公开(公告)号：US07084488B2
公开(公告)日：2006-08-01
申请号：US10210515
申请日：2002-07-31
申请人： Neill Thornton , Dennis Lang
发明人： Neill Thornton , Dennis Lang
IPC分类号： H01L23/495
CPC分类号： H01L29/0657 , H01L23/49562 , H01L24/45 , H01L24/48 , H01L2224/16245 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/10158 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor packaging technique provides for a semiconductor device with improved electrical and thermal performance. According to one embodiment of the invention, die edges are shaped before encapsulation to move the peripheral area of the die, which is more susceptible to stress and cracking, further inside the molding compound. This results in a device that can better withstand stress as well being more resistant to corrosion and other reliability problems caused by environmental conditions.
-
公开(公告)号：US20100117231A1
公开(公告)日：2010-05-13
申请号：US12690179
申请日：2010-01-20
申请人： Dennis Lang , Sonbol Vaziri , James Kent Naylor , Eric Woolsey , Chung-Lin Wu , Mike Gruenhagen , Neill Thornton
发明人： Dennis Lang , Sonbol Vaziri , James Kent Naylor , Eric Woolsey , Chung-Lin Wu , Mike Gruenhagen , Neill Thornton
IPC分类号： H01L23/498
CPC分类号： H01L23/3114 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/05022 , H01L2224/05557 , H01L2224/05558 , H01L2224/13022 , H01L2224/13023 , H01L2224/131 , H01L2224/16 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/14 , H01L2224/13099
摘要： A wafer level chip scale package (WLCSP) includes a semiconductor device with a plurality of solder bump pads, patterned passivation regions above each of the solder bump pads, a patterned under bump metallization (UBM) region on each of the solder bump pads and the passivation regions, a polyimide region over a portion of the UBM regions and the passivation regions, solder bumps formed on each of the UBM regions.
摘要翻译： 晶片级芯片级封装（WLCSP）包括具有多个焊料凸块焊盘的半导体器件，每个焊料凸块焊盘上方的图案化钝化区域，每个焊料凸块焊盘上的图案化凸点下金属化（UBM）区域，以及 钝化区域，UBM区域的一部分上的聚酰亚胺区域和钝化区域，形成在每个UBM区域上的焊料凸块。
-
公开(公告)号：US20090189678A1
公开(公告)日：2009-07-30
申请号：US12419696
申请日：2009-04-07
申请人： Neill Thornton , Dennis Lang
发明人： Neill Thornton , Dennis Lang
IPC分类号： H03K17/687 , H01L23/34
CPC分类号： H01L29/41725 , H01L23/3107 , H01L23/49562 , H01L24/48 , H01L29/41775 , H01L29/45 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The invention provides a semiconductor device that is thermally isolated from the printed circuit board such that the device operates at a higher temperature and radiates heat away from the printed circuit board. In another embodiment, the semiconductor is stacked onto a second device and optionally thermally isolated from the second device.
摘要翻译： 本发明提供了一种与印刷电路板热隔离的半导体器件，使得该器件在较高温度下工作并将辐射热量从印刷电路板上散出。 在另一个实施例中，将半导体层叠到第二器件上，并且可选地与第二器件热隔离。
-
8.发明申请RELIABLE WAFER-LEVEL CHIP-SCALE PACKAGE SOLDER BUMP STRUCTURE IN A PACKAGED SEMICONDUCTOR DEVICE 审中-公开包装半导体器件中可靠的水平切片尺寸包装焊接结构公开(公告)号：US20080054461A1
公开(公告)日：2008-03-06
申请号：US11847512
申请日：2007-08-30
申请人： Dennis Lang , Sonbol Vaziri , James Naylor , Eric Woolsey , Chung-Lin Wu , Mike Gruenhagen , Neill Thornton
发明人： Dennis Lang , Sonbol Vaziri , James Naylor , Eric Woolsey , Chung-Lin Wu , Mike Gruenhagen , Neill Thornton
CPC分类号： H01L24/05 , H01L23/3114 , H01L23/3192 , H01L24/11 , H01L24/12 , H01L2224/0401 , H01L2224/05022 , H01L2224/05567 , H01L2224/05571 , H01L2224/05572 , H01L2224/05599 , H01L2224/13006 , H01L2224/13022 , H01L2224/13023 , H01L2224/131 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/14 , H01L2224/13099 , H01L2924/00012 , H01L2224/05552
摘要： A wafer level chip scale package (WLCSP) includes a packaged semiconductor device with a plurality of solder bump pads, patterned passivation regions above each of the solder bump pads, a patterned under bump metallization (UBM) region on each of the solder bump pads and the passivation regions, a polyimide region over a portion of the UBM regions and the passivation regions, solder bumps formed on each of the UBM regions, and encapsulation material surrounding the semiconductor die except for at least a portion of each of the solder bumps.
摘要翻译： 晶片级芯片级封装（WLCSP）包括具有多个焊料凸块焊盘的封装半导体器件，每个焊料凸块焊盘上方的图案化钝化区域，每个焊料凸块焊盘上的图案化凸块下金属化（UBM）区域，以及 钝化区域，UBM区域和钝化区域的一部分上的聚酰亚胺区域，形成在每个UBM区域上的焊料凸块以及围绕半导体管芯的封装材料，除了每个焊料凸块的至少一部分之外。
-
公开(公告)号：US08803239B2
公开(公告)日：2014-08-12
申请号：US13221179
申请日：2011-08-30
申请人： Neill Thornton , Dennis Lang
发明人： Neill Thornton , Dennis Lang
IPC分类号： H01L21/70 , H01L27/11 , H01L21/02 , H01L29/417 , H01L29/45
CPC分类号： H01L29/41725 , H01L23/3107 , H01L23/49562 , H01L24/48 , H01L29/41775 , H01L29/45 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The invention provides a semiconductor device that is thermally isolated from the printed circuit board such that the device operates at a higher temperature and radiates heat away from the printed circuit board. In another embodiment, the semiconductor is stacked onto a second device and optionally thermally isolated from the second device.
摘要翻译： 本发明提供了一种与印刷电路板热隔离的半导体器件，使得该器件在较高温度下工作并将辐射热量从印刷电路板上散出。 在另一个实施例中，将半导体层叠到第二器件上，并且可选地与第二器件热隔离。
-
公开(公告)号：US20120032712A1
公开(公告)日：2012-02-09
申请号：US13221179
申请日：2011-08-30
申请人： Neill Thornton , Dennis Lang
发明人： Neill Thornton , Dennis Lang
IPC分类号： H03K3/353
CPC分类号： H01L29/41725 , H01L23/3107 , H01L23/49562 , H01L24/48 , H01L29/41775 , H01L29/45 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The invention provides a semiconductor device that is thermally isolated from the printed circuit board such that the device operates at a higher temperature and radiates heat away from the printed circuit board. In another embodiment, the semiconductor is stacked onto a second device and optionally thermally isolated from the second device.
摘要翻译： 本发明提供了一种与印刷电路板热隔离的半导体器件，使得该器件在较高温度下工作并将辐射热量从印刷电路板上散出。 在另一个实施例中，将半导体层叠到第二器件上，并且可选地与第二器件热隔离。
-
-
-
-
-
-
-
-
-
搜索结果
11 条记录 (耗时 0.017 秒)
