发明申请
- 专利标题： RELIABLE WAFER-LEVEL CHIP-SCALE SOLDER BUMP STRUCTURE
- 专利标题（中）： 可靠的水平切割尺寸焊接结构
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申请号： US12690179申请日： 2010-01-20
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公开(公告)号： US20100117231A1公开(公告)日： 2010-05-13
- 发明人: Dennis Lang , Sonbol Vaziri , James Kent Naylor , Eric Woolsey , Chung-Lin Wu , Mike Gruenhagen , Neill Thornton
- 申请人： Dennis Lang , Sonbol Vaziri , James Kent Naylor , Eric Woolsey , Chung-Lin Wu , Mike Gruenhagen , Neill Thornton
- 主分类号： H01L23/498
- IPC分类号： H01L23/498
摘要：
A wafer level chip scale package (WLCSP) includes a semiconductor device with a plurality of solder bump pads, patterned passivation regions above each of the solder bump pads, a patterned under bump metallization (UBM) region on each of the solder bump pads and the passivation regions, a polyimide region over a portion of the UBM regions and the passivation regions, solder bumps formed on each of the UBM regions.
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