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1.发明申请METHOD FOR OBTAINING A PALLADIUM SURFACE FINISH FOR COPPER WIRE BONDING ON PRINTED CIRCUIT BOARDS AND IC-SUBSTRATES 有权用于在打印电路板和IC基板上实现铜线接合的表面表面处理方法公开(公告)号：US20130288475A1
公开(公告)日：2013-10-31
申请号：US13996555
申请日：2011-12-16
申请人： Mustafa Özkök , Gustavo Ramos , Arnd Kilian
发明人： Mustafa Özkök , Gustavo Ramos , Arnd Kilian
CPC分类号： H05K13/04 , H01B1/02 , H01L23/49811 , H01L23/49866 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/03464 , H01L2224/04042 , H01L2224/05147 , H01L2224/05464 , H01L2224/05664 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2224/48599 , H01L2224/48664 , H01L2224/48864 , H01L2224/85045 , H01L2224/85065 , H01L2224/85075 , H01L2224/85205 , H01L2224/85464 , H01L2924/01012 , H01L2924/01015 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01327 , H01L2924/14 , H01L2924/20105 , H01L2924/3025 , H01L2924/351 , H05K1/09 , H05K3/244 , H05K2203/049 , H05K2203/072 , H05K2203/095 , H01L2924/00014 , H01L2924/00 , H01L2924/00015 , H01L2924/01201 , H01L2924/01202 , H01L2924/01203 , H01L2924/01005 , H01L2924/20752 , H01L2924/01007 , H01L2924/01001
摘要： The present invention relates to a method of bonding a copper wire to a substrate, particularly a printed circuit board and an IC-substrate, possessing a layer assembly comprising a copper bonding portion and a palladium or palladium alloy layer and a substrate having a copper wire bonded to aforementioned layer assembly.
摘要翻译： 本发明涉及一种将铜线结合到具有包括铜结合部分和钯或钯合金层的层组件的基板，特别是印刷电路板和IC基板的方法，以及具有铜线的基板 粘合到上述层组件。
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2.发明授权Method for obtaining a palladium surface finish for copper wire bonding on printed circuit boards and IC-substrates 有权在印刷电路板和IC基板上获得铜线接合的钯表面光洁度的方法公开(公告)号：US08987910B2
公开(公告)日：2015-03-24
申请号：US13996555
申请日：2011-12-16
申请人： Mustafa Özkök , Gustavo Ramos , Arnd Kilian
发明人： Mustafa Özkök , Gustavo Ramos , Arnd Kilian
CPC分类号： H05K13/04 , H01B1/02 , H01L23/49811 , H01L23/49866 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/03464 , H01L2224/04042 , H01L2224/05147 , H01L2224/05464 , H01L2224/05664 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2224/48599 , H01L2224/48664 , H01L2224/48864 , H01L2224/85045 , H01L2224/85065 , H01L2224/85075 , H01L2224/85205 , H01L2224/85464 , H01L2924/01012 , H01L2924/01015 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01327 , H01L2924/14 , H01L2924/20105 , H01L2924/3025 , H01L2924/351 , H05K1/09 , H05K3/244 , H05K2203/049 , H05K2203/072 , H05K2203/095 , H01L2924/00014 , H01L2924/00 , H01L2924/00015 , H01L2924/01201 , H01L2924/01202 , H01L2924/01203 , H01L2924/01005 , H01L2924/20752 , H01L2924/01007 , H01L2924/01001
摘要： The present invention relates to a method of bonding a copper wire to a substrate, particularly a printed circuit board and an IC-substrate, possessing a layer assembly comprising a copper bonding portion and a palladium or palladium alloy layer and a substrate having a copper wire bonded to aforementioned layer assembly.
摘要翻译： 本发明涉及一种将铜线结合到具有包括铜结合部分和钯或钯合金层的层组件的基板，特别是印刷电路板和IC基板的方法，以及具有铜线的基板 粘合到上述层组件。
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